Processor Cores:

• Dual 64-bit Arm®Cortex®-A53 microprocessor subsystem up to 1.25GHz
  • Dual-core Cortex-A53 with 256KB L2 Cache
  • Each A53 core has 32KB L1 DCache and 32KB L1 ICache

Memory Subsystem:

• 160KB of Shared On-Chip SRAM (OCSRAM)
• DDR Subsystem (DDRSS)
  • Supports LPDDR4, DDR4 memory types
  • 16-bit data bus
  • Supports speeds up to 1600MT/s
  • Max DDR4 addressing range of 4GB
  • Max LPDDR addressing range of 2GB

Multimedia:

• Display Subsystem
  • Single display support
  • Up to 1920x1080 @ 60fps
  • Supported with independent PLL
  • MIPI DSI (4 lanes DPHY) or DPI (24-bit RGB LVCMOS)

Security:

• Secure boot supported
  • Hardware-enforced Root-of-Trust (RoT)
  • Support to switch RoT via backup key
  • Support for takeover protection, IP protection, and anti-roll back protection
• Trusted Execution Environment (TEE) supported
  • Arm TrustZone® based TEE
  • Extensive firewall support for isolation
  • Secure watchdog/timer/IPC
  • Secure storage support
  • Replay Protected Memory Block (RPMB) support
• Dedicated Security Controller and dedicated security DMA & IPC subsystem for isolated processing
• Cryptographic acceleration supported
  • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
  • Supports cryptographic cores
    • AES – 128-/192-/256-bit key sizes
    • SHA2 – 224-/256-/384-/512-bit key sizes
    • DRBG with true random number generator
    • SM3 and SM4
    • Public Key Engine (PKE) to Assist in RSA/ECC processing for secure boot
• Debugging security
  • Secure software controlled debug access
  • Security aware debugging

High Speed Interfaces:

• Integrated Ethernet switch supporting (total 2 external ports)
  • RMII(10/100) or RGMII (10/100/1000)
  • IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
  • Clause 45 MDIO PHY management
  • Priority based flow control
  • Packet Classifier based on ALE engine with 64 classifiers
  • Time sensitive networking (TSN) support
  • H/W interrupt Pacing
  • IP/UDP/TCP checksum offload in hardware
• Two USB2.0 Ports
  • Each port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
  • Integrated USB VBUS detection

General Connectivity:

• 8x Universal Asynchronous Receiver-Transmitters (UARTs)
  • All instances Support RTS and CTS Flow Control
  • Supports RS-485 external transceiver auto flow control
• 4x Serial Peripheral Interface (SPI) controllers
• 5x Inter-Integrated Circuit (I2C) ports
• 3x Multichannel Audio Serial Ports (McASPs)
  • Transmit and Receive clocks up to 50MHz
  • Up to 4/6/16 Serial Data Pins across 3x McASPs with Independent TX and RX Clocks
  • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and similar formats
  • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 formats)
  • FIFO buffers for Transmit and Receive (256Bytes)
  • Support for audio reference output clock
• 3x enhanced PWM modules (ePWM)
• 3x enhanced Quadrature Encoder Pulse modules (eQEP)
• 3x enhanced Capture modules (eCAP)
• General-Purpose I/O (GPIO), most LVCMOS I/O can be configured as GPIO
  • 4 banks supported for dual-voltage (1.8V/3.3V) and the rest single-voltage (1.8V) LVCMOS I/O banks
• 3x Controller Area Network (CAN) with optional CAN-FD support
  • Conforms with CAN Protocol 2.0 A, B, and ISO 11898-1
  • Full CAN-FD support (up to 64 data bytes)
  • Speed up to 8Mbps
• 1x 12-bit Analog-to-Digital Converter (ADC)
  • 10 bits of effective resolution (ENOB ≅ 10)
  • Up to 4MSPS
  • 4x analog inputs (time-multiplexed)

Media and Data Storage:

• 3x Multi-Media Card/Secure Digital® (MMC/SD®) interface
  • 1x 8-bit eMMC interface up to HS200 speed
  • 2x 4-bit SD/SDIO interface up to UHS-I
  • Compliant with eMMC 5.1, SD 3.0, and SDIO Version 3.0
• 1× General-Purpose Memory Controller (GPMC) up to 133MHz
  • Flexible 8- and 16-Bit Synchronous or Asynchronous Memory Interfaces with up to four Chip Selects
  • Supports 16-bit Muxed Address/Data schemes (AD, AAD)
  • Uses BCH code to support 4-, 8-, or 16-bit ECC
  • Uses Hamming code to support 1-bit ECC
  • Error Locator Module (ELM)
• OSPI/QSPI with DDR / SDR support
  • Support for Serial NAND and Serial NOR Flash devices
  • 4GBytes memory address support

Power Management:

• Active power management features such as auto clock gating, power gating, and dynamic frequency scaling
• Several low-power features supported
• Low-Power Modes
  • RTC Only
  • RTC Only + DDR Self-refresh
  • DeepSleep
  • Standby

Boot Options:

• UART
• OSPI/QSPI Flash
• GPMC NAND Flash
• SD Card
• eMMC
• USB (host) Mass storage
• USB (device) boot from external host (DFU mode)

Technology / Package:

• 16-nm Technology
• 11.9mm ×11.9mm, 0.5mm VCA, 373-pin FCCSP BGA package (ANB)