Refer to the PDF data sheet for device specific package drawings
Wireless microcontroller
Low power consumption
Wireless protocol support
High performance radio
Regulatory compliance
MCU peripherals
Security enablers
Development tools and software
Operating range
Package
The SimpleLink™CC1311P3 device is a multiprotocol Sub-1 GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz). The CC1311P3 is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.
The CC1311P3 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in 143 to 176-MHz, 287 to 351-MHz, 359 to 527-MHz, 861 to 1054-MHz, and 1076 to 1315-MHz frequency bands. The CC1311P3 has an efficient built-in PA that supports +14 dBm TX at 24.9 mA and +20 dBm TX at 65 mA. In RX it has -121 dBm sensitivity and 88 dB blocking ±10 MHz in SimpleLink™ long-range mode with 2.5-kbps data rate.
The CC1311P3 has a low sleep current of 0.7 μA with RTC and 32KB RAM retention.
Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.
The CC1311P3 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCUs. CC1311P3 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.
PART NUMBER(1) | PACKAGE | BODY SIZE (NOM) |
---|---|---|
CC1311P31T0RGZR | VQFN (48) | 7.00 mm × 7.00 mm |
DATE | REVISION | NOTES |
---|---|---|
March 2022 | * | Initial Release |
Device | RADIO SUPPORT | FLASH (KB) | RAM + Cache (KB) | GPIO | PACKAGE SIZE | |||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Sub-1 GHz Prop. | 2.4GHz Prop. | Wireless M-Bus | mioty | Wi-SUN® | Sidewalk | Bluetooth® 5.2 LE | ZigBee | Thread | Multiprotocol | +20 dBm PA | 4 X 4 mm VQFN (32) | 5 X 5 mm VQFN (32) | 5 X 5 mm VQFN (40) | 7 X 7 mm VQFN (48) | ||||
CC1310 | X | X | X | 32-128 | 16-20 + 8 | 10-30 | X | X | X | |||||||||
CC1311R3 | X | X | X | 352 | 32 + 8 | 22-30 | X | X | ||||||||||
CC1311P3 | X | X | X | X | 352 | 32 + 8 | 26 | X | ||||||||||
CC1312R | X | X | X | X | 352 | 80 + 8 | 30 | X | ||||||||||
CC1312R7 | X | X | X | X | X | X | 704 | 144 + 8 | 30 | X | ||||||||
CC1352R | X | X | X | X | X | X | X | X | X | 352 | 80 + 8 | 28 | X | |||||
CC1352P | X | X | X | X | X | X | X | X | X | X | 352 | 80 + 8 | 26 | X | ||||
CC1352P7 | X | X | X | X | X | X | X | X | X | X | X | 704 | 144 + 8 | 26 | X | |||
CC2640R2F | X | 128 | 20 + 8 | 10-31 | X | X | X | |||||||||||
CC2642R | X | 352 | 80 + 8 | 31 | X | |||||||||||||
CC2642R-Q1 | X | 352 | 80 + 8 | 31 | X | |||||||||||||
CC2651R3 | X | X | X | 352 | 32 + 8 | 23-31 | X | X | ||||||||||
CC2651P3 | X | X | X | X | 352 | 32 + 8 | 22-26 | X | X | |||||||||
CC2652R | X | X | X | X | X | 352 | 80 + 8 | 31 | X | |||||||||
CC2652RB | X | X | X | X | X | 352 | 80 + 8 | 31 | X | |||||||||
CC2652R7 | X | X | X | X | X | 704 | 144 + 8 | 31 | X | |||||||||
CC2652P | X | X | X | X | X | X | 352 | 80 + 8 | 26 | X | ||||||||
CC2652P7 | X | X | X | X | X | X | 704 | 144 + 8 | 26 | X |