SLAS749E March   2011  – November 2015 DAC3484

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal InformationZAY package information to Thermal InformationTJ row from top of thermal table
    5. 6.5  Electrical Characteristics - DC Specifications
    6. 6.6  Electrical Characteristics - Digital Specifications
    7. 6.7  Electrical Characteristics - AC Specifications
    8. 6.8  Timing Requirements - Digital Specifications
    9. 6.9  Switching Characteristics - AC Specifications
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Serial Interface
      2. 7.3.2  Data Interface
        1. 7.3.2.1 Word-Wide Format
        2. 7.3.2.2 Byte-Wide Format
      3. 7.3.3  Input FIFO
      4. 7.3.4  FIFO Modes of Operation
        1. 7.3.4.1 Dual Sync Sources Mode
        2. 7.3.4.2 Single Sync Source Mode
        3. 7.3.4.3 Bypass Mode
      5. 7.3.5  Clocking Modes
        1. 7.3.5.1 PLL Bypass Mode
        2. 7.3.5.2 PLL Mode
      6. 7.3.6  FIR Filters
      7. 7.3.7  Complex Signal Mixer
        1. 7.3.7.1 Full Complex Mixer
        2. 7.3.7.2 Coarse Complex Mixer
        3. 7.3.7.3 Mixer Gain
        4. 7.3.7.4 Real Channel Upconversion
      8. 7.3.8  Quadrature Modulation Correction (QMC)
        1. 7.3.8.1 Gain and Phase Correction
        2. 7.3.8.2 Offset Correction
        3. 7.3.8.3 Group Delay Correction
      9. 7.3.9  Temperature Sensor
      10. 7.3.10 Data Pattern Checker
      11. 7.3.11 Parity Check Test
        1. 7.3.11.1 Word-by-Word Parity
        2. 7.3.11.2 Block Parity
      12. 7.3.12 DAC3484 Alarm Monitoring
      13. 7.3.13 LVPECL Inputs
      14. 7.3.14 LVDS Inputs
      15. 7.3.15 Unused LVDS Port Termination
      16. 7.3.16 CMOS Digital Inputs
      17. 7.3.17 Reference Operation
      18. 7.3.18 DAC Transfer Function
      19. 7.3.19 Analog Current Outputs
    4. 7.4 Device Functional Modes
      1. 7.4.1 Multi-Device Synchronization
        1. 7.4.1.1 Multi-Device Synchronization: PLL Bypassed with Dual Sync Sources Mode
        2. 7.4.1.2 Multi-Device Synchronization: PLL Enabled with Dual Sync Sources Mode
        3. 7.4.1.3 Multi-Device Operation: Single Sync Source Mode
    5. 7.5 Programming
      1. 7.5.1 Power-Up Sequence
      2. 7.5.2 Example Start-Up Routine
        1. 7.5.2.1 Device Configuration
        2. 7.5.2.2 PLL Configuration
        3. 7.5.2.3 NCO Configuration
        4. 7.5.2.4 Example Start-Up Sequence
    6. 7.6 Register Map
      1. 7.6.1 Register Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 IF Based LTE Transmitter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Data Input Rate
          2. 8.2.1.2.2 Interpolation
          3. 8.2.1.2.3 LO Feedthrough and Sideband Correction
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Direct Upconversion (Zero IF) LTE Transmitter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Data Input Rate
          2. 8.2.2.2.2 Interpolation
          3. 8.2.2.2.3 LO Feedthrough and Sideband Correction
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Assembly
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Definition of Specifications
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Very Low Power: 1.27 W at 1.25 GSPS, Full Operating Conditions
  • Multi-DAC Synchronization
  • Selectable 2x, 4x, 8x, 16x Interpolation Filter
    • Stop-Band Attenuation > 90 dBc
  • Flexible On-chip Complex Mixing
    • Two Independent Fine Mixers with 32-Bit NCOs
    • Power Saving Coarse Mixers: ± n×Fs/8
  • High Performance, Low Jitter Clock Multiplying PLL
  • Digital I and Q Correction
    • Gain, Phase, Offset, and Group Delay Correction
  • Digital Inverse Sinc Filter
  • Flexible 16-Bit LVDS Input Data Bus
    • 8 Sample Input FIFO
    • Data Pattern Checker
    • Parity Check
    • GC5330 Compatible
  • Temperature Sensor
  • Differential Scalable Output: 10 mA to 30 mA
  • Multiple Package Options: 88-Pin 9x9mm WQFN and 196-Ball 12mmx12mm NFBGA (GREEN / Pb-Free)

2 Applications

  • Cellular Base Stations
  • Diversity Transmit
  • Wideband Communications

3 Description

The DAC3484 is a very low power, high dynamic range, quad-channel, 16-bit digital-to-analog converter (DAC) with a sample rate as high as 1.25 GSPS.

The device includes features that simplify the design of complex transmit architectures: 2x to 16x digital interpolation filters with over 90dB of stop-band attenuation simplify the data interface and reconstruction filters. Independent complex mixers allow flexible carrier placement. A high-performance low jitter clock multiplier simplifies clocking of the device without significant impact on the dynamic range. The digital Quadrature Modulator Correction (QMC) enables complete IQ compensation for gain, offset, phase and group delay between channels in direct up-conversion applications.

Digital data is input to the device through a 16-bit LVDS data bus with on-chip termination. The device includes a FIFO, data pattern checker and parity test to ease the input interface. The interface also allows full synchronization of multiple devices.

The device is characterized for operation over the entire industrial temperature range of –40°C to 85°C and is available in a very-small 88-pin 9x9mm WQFN package or 196-ball 12x12mm NFBGA package.

Very low power, small size, superior crosstalk, high dynamic range and features of the DAC3484 are an ideal fit for systems with multiple transmit channels.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
DAC3484 WQFN (88) 9.00 mm x 9.00 mm
NFBGA (196) 12.00 mm x 12.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

DAC3484 fp_schem_las749.gif