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LMH1208 12G UHD-SDI Dual Output Cable Driver
SNLS569C
March 2017 – May 2020
LMH1208
PRODUCTION DATA.
CONTENTS
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LMH1208 12G UHD-SDI Dual Output Cable Driver
1
Features
2
Applications
3
Description
Simplified Block Diagram
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Recommended SMBus Interface Timing Specifications
6.7
Serial Parallel Interface (SPI) Timing Specifications
6.8
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
4-Level Input Pins and Thresholds
7.3.2
OUT0_SEL and SDI_OUT2_SEL Control
7.3.3
Input Signal Detect
7.3.4
Continuous Time Linear Equalizer (CTLE)
7.3.5
Output Driver Control
7.3.5.1
Line-Side Output Cable Driver (SDI_OUT1+, SDI_OUT2+)
7.3.5.1.1
Output Amplitude (VOD)
7.3.5.1.2
Output Pre-Emphasis
7.3.5.1.3
Output Slew Rate
7.3.5.1.4
Output Polarity Inversion
7.3.5.2
Host-Side 100-Ω Output Driver (OUT0±)
7.3.6
Status Indicators and Interrupts
7.3.6.1
SD_N (Signal Detect)
7.3.6.2
INT_N (Interrupt)
7.4
Device Functional Modes
7.4.1
System Management Bus (SMBus) Mode
7.4.1.1
SMBus Read and Write Transaction
7.4.1.1.1
SMBus Write Operation Format
7.4.1.1.2
SMBus Read Operation Format
7.4.2
Serial Peripheral Interface (SPI) Mode
7.4.2.1
SPI Read and Write Transactions
7.4.2.2
SPI Write Transaction Format
7.4.2.3
SPI Read Transaction Format
7.4.2.4
SPI Daisy Chain
7.5
Register Maps
8
Application and Implementation
8.1
Application Information
8.1.1
SMPTE Requirements and Specifications
8.1.2
LMH1208 and LMH1228 Compatibility
8.2
Typical Applications
8.2.1
Dual Cable Driver
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curves
8.2.2
Distribution Amplifier
8.2.2.1
Design Requirements
8.2.2.2
Detailed Design Procedure
8.2.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.1.1
Board Stack-Up and Ground References
10.1.2
High-Speed PCB Trace Routing and Coupling
10.1.3
Anti-Pads
10.1.4
BNC Connector Layout and Routing
10.1.5
Power Supply and Ground Connections
10.1.6
Footprint Recommendations
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Community Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Export Control Notice
11.7
Glossary
12
Mechanical, Packaging, and Orderable Information
12.1
Package Option Addendum
12.1.1
Packaging Information
12.1.2
Tape and Reel Information
IMPORTANT NOTICE
Package Options
Mechanical Data (Package|Pins)
RTV|32
MPQF166B
Thermal pad, mechanical data (Package|Pins)
RTV|32
QFND101J
Orderable Information
snls569c_oa
snls569c_pm
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