Refer to the PDF data sheet for device specific package drawings
The OPA891 and OPA2891 (OPAx891) are ultra-low voltage noise, high-speed voltage feedback amplifiers that are an excellent choice for applications requiring low voltage noise, including communications and imaging. The single-amplifier OPA891 and the dual-amplifier OPA2891 offer very good ac performance with 140MHz bandwidth, gain (G) = 2V/V, 105V/μs slew rate, and 70ns settling time (0.1%). The OPAx891 are unity-gain stable with 180MHz bandwidth. These amplifiers have a high drive capability of 200mA and draw only 7.5mA supply current per channel. With –100dBc of total harmonic distortion (THD) at f = 1MHz and a very low noise of 0.95nV/√Hz, the OPAx891 are designed for applications requiring low distortion and low noise such as buffering analog-to-digital converters.
PART NUMBER | AMPLIFIERS | PACKAGE(1) | PACKAGE SIZE(2) |
---|---|---|---|
OPA891 | One | D (SOIC, 8) | 4.9mm × 6mm |
DGN (HVSSOP, 8) | 3mm × 4.9mm | ||
OPA2891 | Two | D (SOIC, 8) | 4.9mm × 6mm |
DGN (HVSSOP, 8) | 3mm × 4.9mm |
PIN | TYPE | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
IN– | 2 | Input | Inverting input |
IN+ | 3 | Input | Noninverting input |
NC | 5 | — | No connection |
NULL | 1, 8 | Input | Voltage offset adjust |
OUT | 6 | Output | Output of amplifier |
VCC– | 4 | — | Negative power supply |
VCC+ | 7 | — | Positive power supply |
Thermal Pad | Pad | — | Thermal pad. DGN (HVSSOP) package only. For the best thermal performance, connect this pad to a large copper plane. The thermal pad can be connected to any pin on the device, or any other potential on the board, as long as the voltage on the thermal pad remains between VCC+ and VCC–. |
PIN | TYPE | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
1IN– | 2 | Input | Channel 1 inverting input |
1IN+ | 3 | Input | Channel 1 noninverting input |
1OUT | 1 | Output | Channel 1 output |
2IN– | 6 | Input | Channel 2 inverting input |
2IN+ | 5 | Input | Channel 2 noninverting input |
2OUT | 7 | Output | Channel 2 output |
VCC– | 4 | — | Negative power supply |
VCC+ | 8 | — | Positive power supply |
Thermal Pad | Pad | — | Thermal pad. DGN (HVSSOP) package only. For the best thermal performance, connect this pad to a large copper plane. The thermal pad can be connected to any pin on the device, or any other potential on the board, as long as the voltage on the thermal pad remains between VCC+ and VCC–. |
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
VCC | Supply voltage, VCC+ – VCC– | 37 | V | ||
VI | Input voltage | ±VCC | V | ||
IO | Output current(2) | 240 | mA | ||
VIO | Differential input voltage | ±1.5 | V | ||
IIN | Continuous input current | 10 | mA | ||
TA | Operating free-air temperature | –40 | 85 | °C | |
TJ | Junction temperature | Any condition | 150 | °C | |
Maximum junction temperature, continuous operation, long-term reliability(3) | 125 | ||||
Tstg | Storage temperature | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) | ±4000 | V |
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2) | ±1500 |