SCES193N April   1999  – January 2015 SN74LVC2G00

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Switching Characteristics, -40°C to 125°C
    5. 7.5 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • YZP|8
  • DCT|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.3 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial Power
    Down Mode, and Back Drive Protection
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model

2 Applications

  • IP Phones: Wired and Wireless
  • Optical Modules
  • Optical Networking: EPON and Video Over Fiber
  • Point-to-Point Microwave Backhaul
  • Power: Telecom DC/DC Module:
    Analog and Digital
  • Private Branch Exchanges (PBX)
  • TETRA Base Exchanges
  • Telecom Base Band Units
  • Telecom Shelters: Power Distribution Units (PDU), Power Monitoring Units (PMU), Wireless Battery Monitoring, Remote Electrical Tilt Units (RET), Remote Radio Units (RRU), Tower Mounted Amplifiers (TMA)
  • Vector Signal Analyzers and Generators
  • Video Conferencing: IP-Based HD
  • WiMAX and Wireless Infrastructure Equipment
  • Wireless Communications Testers and
    Wireless Repeaters
  • xDSL Modems and DSLAM

3 Description

This dual 2-input positive-NAND gate is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC2G00 device performs the Boolean function Y = A × B or Y = A + B in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
SN74LVC2G00 SM8 (8) 2.95 mm × 2.80 mm
US8 (8) 2.30 mm × 2.00 mm
DSBGA (8) 1.91 mm × 0.91 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

4 Simplified Schematic

LD_CES193.gif