Data Sheet
SN74LVC2G101-Q1
Automotive Dual D-Type
Flip-Flop with Configurable
Multiple-Function Gated Clock
1 Features
- AEC-Q100 qualified for automotive applications:
- Device temperature grade 1: -40°C to +125°C
- Device HBM ESD classification level 2
- Device CDM ESD classification level C4B
- Operating range from 1.1V to 3.6V
- Over-voltage tolerant inputs support up to 5.5V independent of VCC
- Supports partial-power-down with back drive protection (Ioff)
-
High push-pull output drive strength:
- ±24mA at 3.3V
- ±8mA at 2.3V
- ±4mA at 1.65V
- Maximum propagation delay of 7ns at 3.3V supply
- Latch-up performance exceeds
100mA
per JESD78 and AEC-Q100-004
2 Applications
- Convert a momentary switch to a toggle switch
- Divide a clock signal by 2 or 4
3 Description
The SN74LVC2G101-Q1 contains two independent D-type flip-flops. Each channel has data (D), clear (CLR), and clock (CLKA, CLKB, CLKC, CLKD) inputs and a non-inverted output (Q). The clock inputs can be configured for use in a wide variety of applications, allowing for configuration as 2-input AND, OR, NAND, NOR, XOR, XNOR, as well as 1-input inverted or non-inverted operation. All inputs include Schmitt-trigger architecture.
Package
Information
| PART NUMBER(1) | PACKAGE | PACKAGE SIZE(2) | BODY SIZE (NOM)(3) |
|---|---|---|---|
| SN74LVC2G101-Q1 | BQB (WQFN, 16) | 3.5mm × 2.5mm | 3.5mm × 2.5mm |
| PW (TSSOP, 16)(4) | 5mm × 6.4mm | 5mm × 4.4mm |
(1) For more information, see Section 11.
(2) The package size (length × width) is a nominal value and includes
pins, where applicable
(3) The body size (length × width) is a nominal value and does not
include pins.
(4) Preview package.
Functional Diagram4 Pin Configuration and Functions
Figure 4-1 BQB
Package,16-Pin WQFN(Top
View)
Figure 4-2 PW
Package,16-Pin TSSOP
(Preview)(Top View)Table 4-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| CLR1 | 1 | I | Channel 1, clear, active low |
| CLKA1 | 2 | I | Channel 1, clock input A |
| CLKB1 | 3 | I | Channel 1, clock input B |
| CLKC1 | 4 | I | Channel 1, clock input C |
| CLKD1 | 5 | I | Channel 1, clock input D |
| Q1 | 6 | O | Channel 1, non-inverted output |
| D1 | 7 | I | Channel 1, data input |
| GND | 8 | G | Ground |
| D2 | 9 | I | Channel 2, data input |
| Q2 | 10 | O | Channel 2, non-inverted output |
| CLKD2 | 11 | I | Channel 2, clock input D |
| CLKC2 | 12 | I | Channel 2, clock input C |
| CLKB2 | 13 | I | Channel 2, clock input B |
| CLKA2 | 14 | I | Channel 2, clock input A |
| CLR2 | 15 | I | Channel 2, clear, active low |
| VCC | 16 | P | Positive supply |
| Thermal Pad(2) | — | The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply. | |
(1) I = Input, O = Output, I/O =
Input or Output, G = Ground, P = Power.
(2) BQB package only
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| VCC | Supply voltage range | -0.5 | 6.5 | V | |
| VI | Input voltage range(2) | -0.5 | 6.5 | V | |
| VO | Output voltage range(2) | -0.5 | VCC + 0.5 | V | |
| IIK | Input clamp current | VI < 0V | -50 | mA | |
| IOK | Output clamp current | VO < 0V | -50 | mA | |
| IO | Continuous output current | ±50 | mA | ||
| Continuous current through VCC or GND | ±100 | mA | |||
| TJ | Junction temperature | 150 | °C | ||
| Tstg | Storage temperature | -65 | 150 | °C | |
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
5.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human body model (HBM), per AEC Q100-002 HBM ESD Classification Level 2(1) | ±2000 | V |
| Charged device model (CDM), per AEC Q100-011 CDM ESD Classification Level C4B | ±1000 | |||
(1) AEC Q100-002 indicate that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
5.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| VCC | Supply voltage | Operating | 1.1 | 3.6 | V |
| VI | Input voltage | 0 | 5.5 | V | |
| VO | Output voltage | High or low state | 0 | VCC | V |
| IOH | High-level output current | VCC = 1.8V | -4 | mA | |
| VCC = 2.3V | -8 | ||||
| VCC = 2.7V | -12 | ||||
| VCC = 3V | -24 | ||||
| IOL | Low-level output current | VCC = 1.8V | 4 | mA | |
| VCC = 2.3V | 8 | ||||
| VCC = 2.7V | 12 | ||||
| VCC = 3V | 24 | ||||
| Δt/Δv | Input transition rise or fall rate | 10 | ns/V | ||
| TA | Operating free-air temperature | -40 | 125 | °C | |