Data Sheet
THVD24xxV ±70V Fault-Protected 3V to 5.5V RS-485 Transceivers with Flexible I/O Supply and IEC ESD
1 Features
- Meets or exceeds the requirements of the TIA/EIA-485A and TIA/EIA-422B standards
- 3V to 5.5V RS-485 supply voltage
- Differential output exceeds 2.1V
for PROFIBUS
compatibility with 5V supply - 1.65V to 5.5V Supply for logic signal interface
- SLR Pin Selectable Data Rates:
- THVD2410V, THVD2412V: 250kbps and 1Mbps
- THVD2450V, THVD2452V: 20Mbps and 50Mbps
- Bus I/O protection
- ±70V DC bus fault
- ±16kV HBM ESD
- Half duplex devices: ±15kV IEC 61000-4-2 contact and air-gap discharge
- Full duplex devices: ±8kV IEC 61000-4-2 contact and air-gap discharge
- ±4kV IEC 61000-4-4 fast transient burst
- Half-duplex and Full-Duplex devices available in two speed grades
- Extended ambient temperature range: -40°C to 125°C
- Extended operational common-mode range: ±25V
- Enhanced receiver hysteresis for noise immunity
- Low power consumption
- Low shutdown supply current: < 5µA
- Quiescent current during operation: < 5.3mA
- Glitch-free power-up/down for hot plug-in capability
- Open, short, and idle bus failsafe
- Thermal shutdown
- 1/8 unit load (up to 256 bus nodes) in -7V to 12V common mode range
- Small 3mm x 3mm VSON package to save board space, or 14-SOIC for drop-in compatibility
3 Description
THVD24xxV are ±70V fault-protected, half and full-duplex RS-422/RS-485 transceivers using a 1.65V to 5.5V supply for logic signal interface, and a 3V to 5.5V bus side supply. These devices have slew rate select feature that enables them to be used at two maximum speeds based on the SLR pin setting.
These devices feature integrated IEC ESD protection, eliminating the need for external system-level protection components. Extended ±25V input common-mode range makes reliable data communication over longer cable run lengths and/or in the presence of large ground loop voltages. Enhanced 250-mV receiver hysteresis provides high noise rejection. In addition, the receiver fail-safe feature makes sure of a logic high when the inputs are open or shorted together.
Package Information
| PART NUMBER | PACKAGE(1) | PACKAGE SIZE(2) |
|---|---|---|
| THVD2450V THVD2410V |
VSON (10) | 3mm × 3mm |
| THVD2412V THVD2452V |
SOIC (14) | 8.65mm × 3.91mm |
(1) For more information, see Section 11.
(2) The package size (length × width)
is a nominal value and includes pins, where applicable.
Table 3-1 Device Information
| PART NUMBER | Duplex | Maximum data rate |
|---|---|---|
| THVD2410V | Half | SLR = High, 250kbps SLR = Low, 1Mbps |
| THVD2412V | Full | |
| THVD2450V | Half | SLR = High, 20Mbps SLR = Low, 50Mbps |
| THVD2452V | Full |
Simplified Schematic4 Pin Configuration and Functions
Figure 4-1 THVD2410V, THVD2450V
10-Pin DRC Package (VSON)
Top View
10-Pin DRC Package (VSON)
Top View
Table 4-1 Pin Functions
| NO. | NAME | TYPE | DESCRIPTION |
|---|---|---|---|
| 1 | VIO | Logic Supply | Supply for logic I/O signals (R, RE, D, DE, and SLR) |
| 2 | R | Digital Output | Receive data output |
| 3 | DE | Digital Input | Driver enable input; integrated pull-down |
| 4 | RE | Digital Input | Receiver enable input; integrated pull-up |
| 5 | D | Digital Input | Transmission data input; integrated pull-up |
| 6 | GND | Reference Potential | Local device ground |
| 7 | SLR | Digital Input | Slew rate select. For THVD2410V: Low = 1 Mbps, High = 250 kbps. Defaults to 1 Mbps if SLR is left floating. For THVD2450V: Low = 50 Mbps, High = 20 Mbps. Defaults to 50 Mbps if left floating. |
| 8 | A | Bus I/O | RS 485 bus I/O, A |
| 9 | B | Bus I/O | RS 485 bus I/O, B |
| 10 | VCC | Bus Supply | Bus supply |
| Thermal Pad | -- | Connect to GND for optimal thermal performance |
Figure 4-2 THVD2412V, THVD2452V14-Pin SOIC Package (D)
Top View
Table 4-2 Pin functions
| NO. | NAME | TYPE | DESCRIPTION |
|---|---|---|---|
| 1 | VIO | Logic supply | 1.65 V to 5.5 V supply for logic I/O signals (R, RE, D, DE and SLR) |
| 2 | R | Digital output | Receive data output |
| 3 | RE | Digital input | Receiver enable input; integrated pull-up |
| 4 | DE | Digital input | Driver enable input; integrated pull-down |
| 5 | D | Digital input | Transmission data input; integrated pull-up |
| 6 | GND | Reference potential | Local device ground |
| 7 | NC | No connect | Not connected internally |
| 8 | SLR | Digital input | Slew rate select. For THVD2412V: Low = 1 Mbps, High = 250 kbps. Defaults to 1 Mbps if SLR is left floating. For THVD2452V: Low = 50 Mbps, High = 20 Mbps. Defaults to 50 Mbps if left floating. |
| 9 | Y | Bus output | RS 485 driver non-inverting output |
| 10 | Z | Bus output | RS 485 driver inverting output |
| 11 | B | Bus input | RS 485 receiver inverting input |
| 12 | A | Bus input | RS 485 receiver non-inverting input |
| 13 | NC | No connect | Not connected internally |
| 14 | VCC | Bus supply | 3 V to 5.5 V bus supply |
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Logic supply voltage | VIO | –0.5 | VCC + 0.2 | V |
| Bus supply voltage | VCC | –0.5 | 6.5 | V |
| Bus voltage | Range at any bus pin as differential or common-mode with respect to GND | –70 | 70 | V |
| Input voltage | Range at any logic pin (D, DE, SLR or RE) | –0.3 | VIO + 0.2 | V |
| Receiver output current | IO | –24 | 24 | mA |
| Storage temperature | Tstg | –65 | 170 | °C |
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltage values, except differential I/O bus voltages, are with respect to ground terminal.
5.2 ESD Ratings
| VALUE | UNIT | ||||
|---|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | Bus terminals and GND | ±16,000 | V |
| All pins except bus terminals and GND | ±4,000 | V | |||
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1,500 | V | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
5.3 ESD Ratings [IEC]
| VALUE | UNIT | ||||
|---|---|---|---|---|---|
| V(ESD) | Electrostatic discharge, Half duplex devices THVD2410V/2450V (1) | Contact discharge, per IEC 61000-4-2 | Bus terminals and GND | ±15,000 | V |
| Air-gap discharge, per IEC 61000-4-2 | Bus terminals and GND | ±15,000 | |||
| V(ESD) | Electrostatic discharge, Full duplex devices THVD2412V/2452V | Contact discharge, per IEC 61000-4-2 | Bus terminals and GND | ±8,000 | V |
| Air-gap discharge, per IEC 61000-4-2 | Bus terminals and GND | ±8,000 | |||
| V(EFT) | Electrical fast transient | Per IEC 61000-4-4 |
Bus terminals | ±4,000 | V |
(1) For optimised IEC ESD performance, it is recommended to have series resistor (≥ 50 Ω) on all logic inputs to minimize transient currents going into or out of the logic pins.
5.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | NOM | MAX | UNIT | |||
|---|---|---|---|---|---|---|
| VCC | Supply voltage | 3 | 5.5 | V | ||
| VIO | I/O supply voltage | 1.65 | VCC | V | ||
| VI | Input voltage at any bus terminal (separately or common mode)(1) | –25 | 25 | V | ||
| VIH | High-level input voltage (driver, driver enable, receiver enable and slew rate select inputs) | 0.7*VIO | VIO | V | ||
| VIL | Low-level input voltage (driver, driver enable, receiver enable and slew rate select inputs) | 0 | 0.3*VIO | V | ||
| VID | Differential input voltage bus pins | –25 | 25 | V | ||
| IO | Output current, driver | –60 | 60 | mA | ||
| IOR | Output current, receiver | VIO = 1.8 V or 2.5 V | –4 | 4 | mA | |
| IOR | Output current, receiver | VIO = 3.3 V or 5 V | –8 | 8 | mA | |
| RL | Differential load resistance | 54 | 60 | Ω | ||
| 1/tUI | Signaling rate | THVD2410V, THVD2412V with SLR = VIO | 250 | kbps | ||
| THVD2410V, THVD2412V with SLR = GND or floating | 1 | Mbps | ||||
| THVD2450V, THVD2452V with SLR = VIO | 20 | Mbps | ||||
| THVD2450V, THVD2452V with SLR = GND or floating | 50 | Mbps | ||||
| TA | Operating ambient temperature | -40 | 125 | °C | ||
| TJ | Junction temperature | -40 | 150 | °C | ||
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
5.5 Thermal Information
| THERMAL METRIC(1) | THVD2410V THVD2450V |
THVD2412V THVD2452V |
UNIT | |
|---|---|---|---|---|
| DRC (VSON) |
D (SOIC) |
|||
| 10 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 46.7 | 87.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 47.7 | 41.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 19.1 | 43.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.7 | 8.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 19.1 | 43.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4.6 | N/A | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.