The TLV713 series of low-dropout (LDO) linear regulators are low quiescent current LDOs with excellent line and load transient performance and are designed for power-sensitive applications. These devices provide a typical accuracy of 1%.
The TLV713 series of devices is designed to be stable without an output capacitor. The removal of the output capacitor allows for a very small solution size. However, the TLV713 series is also stable with any output capacitor if an output capacitor is used.
The TLV713 also provides inrush current control during device power up and enabling. The TLV713 limits the input current to the defined current limit to avoid large currents from flowing from the input power source. This functionality is especially important in battery-operated devices.
The TLV713 series is available in standard DQN and DBV packages. The TLV713P provides an active pulldown circuit to quickly discharge output loads.
DEVICE NAME | PACKAGE | BODY SIZE |
---|---|---|
TLV713 | X2SON (4) | 1.00 mm × 1.00 mm |
SOT-23 (5) | 2.90 mm × 1.60 mm |
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Changes from E Revision (March 2015) to F Revision
Changes from D Revision (July 2013) to E Revision
Changes from C Revision (July 2013) to D Revision
Changes from B Revision (December 2012) to C Revision
Changes from A Revision (October 2012) to B Revision
Changes from * Revision (September 2012) to A Revision
PIN | I/O | DESCRIPTION | ||
---|---|---|---|---|
NAME | NO. | |||
X2SON | SOT-23 | |||
EN | 3 | 3 | I | Enable pin. Driving EN over 0.9 V turns on the regulator.
Driving EN below 0.4 V puts the regulator into shutdown mode. |
GND | 2 | 2 | — | Ground pin |
IN | 4 | 1 | I | Input pin. A small capacitor is recommended from this pin to ground. See the Input and Output Capacitor Considerations section in the Feature Description for more details. |
NC | — | 4 | — | No internal connection |
OUT | 1 | 5 | O | Regulated output voltage pin. For best transient response, a small 1-μF ceramic capacitor is recommended from this pin to ground. See the Input and Output Capacitor Considerations section in the Feature Description for more details. |
Thermal pad | — | — | The thermal pad is electrically connected to the GND node. Connect to the GND plane for improved thermal performance. |