TPLD1202-Q1 Automotive Programmable Logic Device with I2C/SPI and 10-GPIO
1 Features
Operating characteristics
Extended temperature range: -40°C to 125°C
Wide supply voltage range: 1.71V to 5.5V
Qualified for automotive applications
Configurable macro-cells
2-, 3-, and 4-bit lookup tables
D-type flip-flops and latches with and without reset/set option
8-bit shift register
16-bit pattern generator
Counters and delay generators
PWM generators
Programmable deglitch filter or edge detector
Multi-channel sampling analog comparator
Voltage reference and Analog temperature sensor
Oscillators
Flexible digital I/O features
All digital signals can be routed to any GPIO
Digital input modes: digital in with and without Schmitt-trigger, low-voltage digital in
Digital output modes: push-pull, open-drain NMOS, tri-state
Development tools
InterConnect Studio
TPLD1202-Q1 evaluation module
TPLD programming board
3 Description
The TPLD1202-Q1 is part of the TI programmable logic device (TPLD) family of devices that feature versatile programmable logic ICs with combinational logic, sequential logic, and analog blocks. TPLD provides a fully integrated, low power solution to implement common system functions, such as timing delays, voltage monitors, system resets, power sequencers, I/O expanders, and more. This device features configurable I/O structures that extends compatibility within mixed-signal environments, reducing the number of discrete components required.
System designers can create circuits and configure the macro-cells, I/O pins, and interconnections by temporarily emulating the non-volatile memory or by permanently programming the one-time programmable (OTP) through InterConnect Studio. The TPLD1202-Q1 is supported by a hardware and software ecosystem with application notes, reference designs, and design examples. Visit ti.com for more information and access to design tools.
| PART NUMBER | PACKAGE(1) | BODY SIZE (NOM) |
|---|---|---|
| TPLD1202-Q1 | DYY (SOT-23-THN, 14) | 2.00mm x 4.20mm |
4 Device and Documentation Support
4.1 Receiving Notification of Documentation Updates
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4.2 Support Resources
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4.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
4.4 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
4.5 Glossary
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TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
5 Revision History
| Date | Revision | Notes |
|---|---|---|
| September 2024 | * | Advance Information Release |
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
6.1 Packaging Option Addendum
Packaging Information
| Orderable Device | Status (1) | Package Type | Package Drawing | Pins | Package Qty | Eco Plan (2) | Lead/Ball Finish(4) | MSL Peak Temp (3) | Op Temp (°C) | Device Marking(5)(6) |
|---|---|---|---|---|---|---|---|---|---|---|
| PTPLD1202Q1DYYQ1 | PREVIEW | SOT-23-THN | DYY | 14 | 3000 | RoHS & Green | SN | Level-1-260C-UNLIM | -40 to 125 | P1202Q |
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
| Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. |
| In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. |
6.2 Tape and Reel Information
| Device | Package Type | Package Drawing | Pins | SPQ | Reel Diameter (mm) | Reel Width W1 (mm) | A0 (mm) | B0 (mm) | K0 (mm) | P1 (mm) | W (mm) | Pin1 Quadrant |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PTPLD1202DYYQ1 | SOT-23-THN | DYY | 12 | 3000 | 180 | 8.4 | 4.5 | 3.56 | 1.35 | 8 | 12 | 3 |
| Device | Package Type | Package Drawing | Pins | SPQ | Length (mm) | Width (mm) | Height (mm) |
|---|---|---|---|---|---|---|---|
| PTPLD1202DYYQ1 | SOT-23-THN | DYY | 12 | 3000 | 210 | 185 | 35 |
6.3 Mechanical Data
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