DATA SHEET
TPS61175 3-A High-Voltage Boost Converter With Soft Start and Programmable Switching Frequency
1 Features
- 2.9-V to 18-V Input voltage range
- 3-A, 40-V Internal switch
- High-efficiency power conversion: Up to 93%
- Frequency set by external resistor: 200 kHz to 2.2 MHz
- Synchronous external switching frequency
- User-defined soft start into full load
- Skip-switching cycle for output regulation at light load
- 14-Pin HTSSOP package with PowerPad™
- Create a custom design using the TPS61175 with the WEBENCH Power Designer
2 Applications
- 5-V to 12-V, 24-V Power conversion
- Supports SEPIC and flyback topologies
- ADSL modems
- TV tuners
3 Description
The TPS61175 device is a monolithic switching regulator with integrated 3-A, 40-V power switch. The device can be configured in several standard switching-regulator topologies, including boost, SEPIC, and flyback. The device has a wide input voltage range to support application with input voltage from multicell batteries or regulated 5-V, 12-V power rails.
The TPS61175 regulates the output voltage with current mode pulse width modulation (PWM) control. The switching frequency of PWM is set by either an external resistor or an external clock signal. The user can program the switching frequency from 200 kHz to 2.2 MHz.
The device features a programmable soft-start function to limit inrush current during start-up, and has other built-in protection features, such as pulse-by-pulse overcurrent limit and thermal shutdown. The TPS61175 is available in 14-pin HTSSOP package with PowerPad.
Device Information(1)
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| TPS61175 | HTSSOP (14) | 5.00 mm × 4.40 mm |
Device Images
Simplified Schematic
4 Revision History
Changes from E Revision (February 2019) to F Revision
- Changed Soft Start figure reference to point to the correct soft start waveform. Go
- Changed "≤" sign in Equation 7 to "≥"Go
Changes from D Revision (April 2016) to E Revision
- Changed Handing Ratings table to ESD Ratings; moved Storage Temperature to Absolute Maximum RatingsGo
- Updated symbols in Thermal InformationGo
- Added the IIN(MAX) for the IOUT(max) calculation equation.Go
Changes from C Revision (August 2014) to D Revision
- Revised second paragraph of Minimum ON Time and Pulse Skipping section or clarity.Go
Changes from B Revision (February 2012) to C Revision
- Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
Changes from A Revision (October 2010) to B Revision
- Replaced the Dissipation Ratings Table with the Thermal Information TableGo
Changes from * Revision (December 2008) to A Revision
- Changed the Ordering Information table - Part Number From: TPS61175 To: TPS61175PWP; Removed the Package Marking column Go
5 Pin Configuration and Functions
TSSOP
14 Pins
Top View
Pin Functions
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| AGND | 7 | I | Signal ground of the IC |
| COMP | 8 | O | Output of the internal transconductance error amplifier. An external RC network is connected to this pin to compensate the regulator. |
| EN | 4 | I | Enable pin. When the voltage of this pin falls below the enable threshold for more than 10ms, the IC turns off. |
| FB | 9 | I | Feedback pin for positive voltage regulation. Connect to the center tap of a resistor divider to program the output voltage. |
| FREQ | 10 | O | Switch frequency program pin. An external resistor is connected to this pin to set switch frequency. See application section for information on how to size the FREQ resistor. |
| NC | 11 | I | Reserved pin. Must connect this pin to ground. |
| PGND | 12,13,14 | I | Power ground of the IC. It is connected to the source of the PWM switch. |
| SS | 5 | O | Soft start programming pin. A capacitor between the SS pin and GND pin programs soft start timing. See Application and Implementation for information on how to size the SS capacitor. |
| SW | 1,2 | I | This is the switching node of the IC. Connect SW to the switched side of the inductor. |
| SYNC | 6 | I | Switch frequency synchronous pin. Customers can use an external signal to set the IC switch frequency between 200-kHz and 2.2-MHz. If not used, this pin should be tied to AGND as short as possible to avoid noise coupling. |
| Thermal Pad | The thermal pad should be soldered to the analog ground. If possible, use thermal via to connect to top and internal ground plane layers for ideal power dissipation. | ||
| VIN | 3 | I | The input supply pin for the IC. Connect VIN to a supply voltage between 2.9 V and 18 V. It is acceptable for the voltage on the pin to be different from the boost power stage input for applications requiring voltage beyond VIN range. |
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)| MIN | MAX | UNIT | |
|---|---|---|---|
| Supply voltages on pin VIN(2) | –0.3 | 20 | V |
| Voltages on pins EN(2) | –0.3 | 20 | V |
| Voltage on pin FB, FREQ and COMP(2) | –0.3 | 3 | V |
| Voltage on pin SYNC, SS(2) | –0.3 | 7 | V |
| Voltage on pin SW(2) | –0.3 | 40 | V |
| Continuous power dissipation | See Thermal Information | ||
| Operating junction temperature range | –40 | 150 | °C |
| Storage temperature, Tstg | –65 | 150 | °C |
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VIN | Input voltage | 2.9 | 18 | V | |
| VO | Output voltage | VIN | 38 | V | |
| L | Inductor(1) | 4.7 | 47 | μH | |
| fSW | Switching frequency | 200 | 2200 | kHz | |
| CI | Input capacitor | 4.7 | μF | ||
| CO | Output capacitor | 4.7 | μF | ||
| VSYN | External switching frequency logic | 5 | V | ||
| TA | Operating ambient temperature | –40 | 85 | °C | |
| TJ | Operating junction temperature | –40 | 125 | °C | |
(1) The inductance value depends on the switching frequency and end application. While larger values may be used, values between 4.7-μH and 47-μH have been successfully tested in various applications. Refer to Selecting the Inductor for detail.
6.4 Thermal Information
| THERMAL METRIC(1) | TPS61175 | UNIT | |
|---|---|---|---|
| PWP (HTSSOP) | |||
| 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 45.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 34.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 30.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 29.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 5.8 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).