SBAS486F November   2009  – February 2016 ADS41B29 , ADS41B49

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: General
    6. 6.6  Electrical Characteristics: ADS41B29, ADS41B49
    7. 6.7  Digital Characteristics
    8. 6.8  Timing Requirements: LVDS and CMOS Modes
    9. 6.9  Timing Requirements: Reset
    10. 6.10 Timing Requirements: LVDS Timing Across Sampling Frequencies
    11. 6.11 Timing Requirements: CMOS Timing Across Sampling Frequencies
    12. 6.12 Timing Requirements: CMOS Timing Across Sampling Frequencies
    13. 6.13 Typical Characteristics: ADS41B49
    14. 6.14 Typical Characteristics: ADS41B29
    15. 6.15 Typical Characteristics: General
    16. 6.16 Typical Characteristics: Contour
  7. 7 Parameter Measurement Information
    1. 7.1 Timing Diagrams
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
      2. 8.3.2 Clock Input
      3. 8.3.3 Gain for SFDR, SNR Trade-Off
      4. 8.3.4 Offset Correction
      5. 8.3.5 Digital Output Information
        1. 8.3.5.1 Output Interface
        2. 8.3.5.2 DDR LVDS Outputs
        3. 8.3.5.3 LVDS Output Data and Clock Buffers
        4. 8.3.5.4 Parallel CMOS Interface
        5. 8.3.5.5 CMOS Interface Power Dissipation
        6. 8.3.5.6 Input Overvoltage Indication (OVR Pin)
        7. 8.3.5.7 Output Data Format
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Configuration
      2. 8.4.2 Power-Down
        1. 8.4.2.1 Power-Down Global
        2. 8.4.2.2 Standby
        3. 8.4.2.3 Output Buffer Disable
        4. 8.4.2.4 Input Clock Stop
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Register Initialization
      2. 8.5.2 Serial Register Readout
    6. 8.6 Register Maps
      1. 8.6.1 Serial Register Map
        1. 8.6.1.1 Summary of High-Performance Modes
        2. 8.6.1.2 Description of Serial Registers
          1. 8.6.1.2.1  Register Address 00h (address = 00h) [reset = 00h]
          2. 8.6.1.2.2  Register Address 01h (address = 01h) [reset = 00h]
          3. 8.6.1.2.3  Register Address 03h (address = 03h) [reset = 00h]
          4. 8.6.1.2.4  Register Address 25h (address = 25h) [reset = 50h]
          5. 8.6.1.2.5  Register Address 26h (address = 26h) [reset = 00h]
          6. 8.6.1.2.6  Register Address 3Dh (address = 3Dh) [reset = 00h]
          7. 8.6.1.2.7  Register Address 3Fh (address = 3Fh) [reset = 00h]
          8. 8.6.1.2.8  Register Address 40h (address = 40h) [reset = 00h]
          9. 8.6.1.2.9  Register Address 41h (address = 41h) [reset = 00h]
          10. 8.6.1.2.10 Register Address 42h (address = 42h) [reset = 08h]
          11. 8.6.1.2.11 Register Address 43h (address = 43h) [reset = 00h]
          12. 8.6.1.2.12 Register Address 4Ah (address = 4Ah) [reset = 00h]
          13. 8.6.1.2.13 Register Address BFh (address = BFh) [reset = 00h]
          14. 8.6.1.2.14 Register Address CFh (address = CFh) [reset = 00h]
          15. 8.6.1.2.15 Register Address DFh (address = DFh) [reset = 00h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Drive Circuit Requirements
      2. 9.1.2 Driving Circuit
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Sequence
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Board Design Considerations
        1. 11.1.1.1 Grounding
        2. 11.1.1.2 Supply Decoupling
        3. 11.1.1.3 Exposed Pad
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • ADS41B49: 14-Bit, 250 MSPS
    ADS41B29: 12-Bit, 250 MSPS
  • Integrated High-Impedance
    Analog Input Buffer:
    • Input Capacitance: 2 pF
    • 200-MHz Input Resistance: 3 kΩ
  • Maximum Sample Rate: 250 MSPS
  • Ultralow Power:
    • 1.8-V Analog Power: 180 mW
    • 3.3-V Buffer Power: 96 mW
    • I/O Power: 135 mW (DDR LVDS)
  • High Dynamic Performance:
    • SNR: 69 dBFS at 170 MHz
    • SFDR: 82.5 dBc at 170 MHz
  • Output Interface:
    • Double Data Rate (DDR) LVDS with Programmable Swing and Strength:
      • Standard Swing: 350 mV
      • Low Swing: 200 mV
      • Default Strength: 100-Ω Termination
      • 2x Strength: 50-Ω Termination
    • 1.8-V Parallel CMOS Interface Also Supported
  • Programmable Gain for SNR, SFDR Trade-Off
  • DC Offset Correction
  • Supports Low Input Clock Amplitude
  • Package: VQFN-48 (7 mm × 7 mm)

2 Applications

  • Power Amplifier Linearization
  • Software Defined Radio
  • Wireless Communications Infrastructure

3 Description

The ADS41Bx9 are members of the ultralow-power ADS4xxx analog-to-digital converter (ADC) family, featuring integrated analog input buffers. These devices use innovative design techniques to achieve high dynamic performance, and consume extremely low power. The analog input pins have buffers, with benefits of constant performance and input impedance across a wide frequency range. The devices are well-suited for multi-carrier, wide bandwidth communications applications such as PA linearization.

The ADS41Bx9 have features such as digital gain and offset correction. The gain option can be used to improve SFDR performance at lower full-scale input ranges, especially at high input frequencies. The integrated dc offset correction loop can be used to estimate and cancel the ADC offset. At lower sampling rates, the ADC automatically operates at scaled-down power with no loss in performance.

The devices support both double data rate (DDR) low-voltage differential signaling (LVDS) and parallel CMOS digital output interfaces. The low data rate of the DDR LVDS interface (maximum 500 MBPS) makes using low-cost field-programmable gate array (FPGA)-based receivers possible. The devices have a low-swing LVDS mode that can be used to further reduce the power consumption. The strength of the LVDS output buffers can also be increased to support 50-Ω differential termination.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
ADS41Bx9 VQFN (48) 7.00 mm × 7.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

ADS41B49 Block Diagram

ADS41B29 ADS41B49 fbd_41b49_bas486.gif

4 Revision History

Changes from E Revision (July 2012) to F Revision

  • Changed title and changed ADS41B49/29 to ADS41Bx9 and QFN to VQFN throughout documentGo
  • Added Applications section, Device Information table, front-page figure, ESD Ratings table, Feature Description section, Device Functional Modes section, Programming section, Register Maps section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Ordering Information table Go
  • Changed Pin Functions table: changed title and format Go
  • Added Added last row to Voltage applied to input pins section in Absolute Maximum Ratings tableGo
  • Changed Temperature parameters in Absolute Maximum Ratings table: changed format of Temperature section and changed maximum specifications for TA and TJGo
  • Changed TYP column header to NOM in Recommended Operating Conditions tableGo
  • Changed Digital Outputs, TJ parameter in Recommended Operating Conditions tableGo
  • Deleted High-Performance Modes section from Recommended Operating Conditions tableGo
  • Changed conditions of Electrical Characteristics: General table from temperature to ambient temperatureGo
  • Changed conditions of Electrical Characteristics: ADS41B29, ADS41B49 table from temperature to ambient temperatureGo
  • Added footnote 1 to Electrical Characteristics: ADS41B29, ADS41B49 tableGo
  • Changed conditions of Timing Requirements: LVDS and CMOS Modes table from temperature to ambient temperatureGo
  • Added footnotes 6 and 7 to Timing Requirements: LVDS and CMOS Modes tableGo
  • Added footnote 1 to Timing Requirements: Reset table Go
  • Changed title of Figure 13 and Figure 14 Go
  • Changed title of Figure 31 and Figure 32 Go
  • Changed conditions of Table 6 Go
  • Added Summary of High-Performance Modes sectionGo
  • Changed bit registers to satisfy new standard requirements Go

Changes from D Revision (December 2010) to E Revision

  • Updated Thermal Information table valuesGo
  • Changed Analog Inputs, Differential input capacitance parameter typical specification in Electrical Characteristics: General tableGo
  • Changed value of input capacitance in Analog Input sectionGo
  • Updated Figure 54 and footnotesGo
  • Changed register 25h default value in Table 7Go
  • Changed register 42 default and bit D3 values in Table 7Go
  • Changed default value for Register Address 25hGo
  • Changed default and bit 3 values for Register Address 42hGo
  • Updated Figure 83Go
  • Updated Figure 84Go