• Up to 2× Dual-core Arm Cortex®-R5F MCU subsystems operating at up to 800MHz, highly-integrated for real-time processing
  • Dual-core Arm Cortex®-R5F clusters support dual-core and single-core operation
  • 32KB I-cache and 32KB D-cache per R5F core with SECDED ECC on all memories
  • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
  • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
• 1× Single-core Arm Cortex®-M4F MCU at up to 400MHz
  • 256KB SRAM with SECDED ECC

• Up to 2MB of On-chip RAM (OCSRAM) with SECDED ECC:
  • Can be divided into smaller banks in increments of 256KB for as many as 8 separate memory banks
  • Each memory bank can be allocated to a single core to facilitate software task partitioning
• DDR Subsystem (DDRSS)
  • Supports LPDDR4, DDR4 memory types
  • 16-bit data bus with inline ECC
  • Supports speeds up to 1600 MT/s

• Device Management Security Controller (DMSC-L)
  • Centralized SoC system controller
  • Manages system services including initial boot, security, and clock/reset/power management
  • Communication with various processing units over message manager
  • Simplified interface for optimizing unused peripherals
  • On-Chip Debug functionality through JTAG and Trace interfaces)
• Data Movement Subsystem (DMSS)
  • Block Copy DMA (BCDMA)
  • Packet DMA (PKTDMA)
  • Secure Proxy (SEC_PROXY)
  • Ring Accelerator (RINGACC)
• Time Sync Subsystem
  • Central Platform Time Sync (CPTS) module
  • Timer Manager (TIMERMANAGER) with 1024 timers
  • Time Sync and Compare event interrupt routers

• 2× Gigabit Industrial Communication Subsystems (PRU_ICSSG)
  • Optional support for Profinet IRT, Profinet RT, EtherNet/IP, EtherCAT, Time-Sensitive Networking (TSN), and other Networking Protocols
  • Backwards compatibility with 10/100Mb PRU-ICSS
  • Each PRU_ICSSG contains:
    • 3× PRU RISC Cores per Slice (2× Slice per PRU_ICSSG)
      • PRU General Use core (PRU)
      • PRU Real-Time Unit core (PRU-RTU)
      • PRU Transmit core (PRU-TX)
    • Each PRU core supports the following features:
      • Instruction RAM with ECC
      • Broadside RAM
      • Multiplier with optional accumulator (MAC)
      • CRC16/32 hardware accelerator
      • Byte swap for Big/Little Endian conversion
      • SUM32 hardware accelerator for UDP checksum
      • Task Manager for preemption support
    • Up to 2× Ethernet ports
      • RGMII (10/100/1000)
      • MII (10/100)
    • Three Data RAMs with ECC
    • 8 banks of 30 × 32-bit register scratchpad memory
    • Interrupt controller and task manager
    • 2× 64-bit Industrial Ethernet Peripherals (IEPs) for time stamping and other time synchronization functions
    • 18× Sigma-Delta Filter Module (SDFM) interfaces
      • Short circuit logic
      • Over-current logic
    • 6× Multi-protocol position encoder interfaces
    • 1× Enhanced Capture Module (ECAP)
    • 16550-compatible UART
      • Dedicated 192MHz clock to support 12Mbps PROFIBUS

• Secure boot supported
  • Hardware-enforced Root-of-Trust (RoT)
  • Support to switch RoT via backup key
  • Support for takeover protection, IP protection, and anti-roll back protection
    • Cryptographic acceleration supported
  • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
• Supports cryptographic cores
  • AES – 128-/192-/256-Bit key sizes
  • 3DES – 56-/112-/168-Bit key sizes
  • MD5, SHA1
  • SHA2 – 224-/256-/384-/512-Bit key sizes
  • DRBG with true random number generator
  • PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
• DMA support
  • Debugging security
• Extensive firewall support for isolation
• Secure watchdog/timer/IPC
  • Secure storage support
  • On-the-Fly encryption support for OSPI interface in XIP mode
  • Networking security support for data (Payload) encryption/authentication via packet based hardware cryptographic engine
  • Security co-processor (DMSC-L) for key and security management, with dedicated device level interconnect for security

• 6× Inter-Integrated Circuit (I²C) ports
• 9× Universal Asynchronous Receive/Transmit (UART) modules
• 1× 12-bit Analog-to-Digital Converters (ADC)
  • Configurable sample rate up to 4MSPS
  • 8× multiplexed analog inputs
• 7× Multichannel Serial Peripheral Interfaces (SPI) controllers
• 3× General-Purpose I/O (GPIO) modules

• 9× Enhanced Pulse-Width Modulator (EPWM) modules
• 3× Enhanced Capture (ECAP) modules
• 3× Enhanced Quadrature Encoder Pulse (EQEP) modules
• 2× Modular Controller Area Network (MCAN) modules with full CAN-FD support
• 2× Fast Serial Interface Transmitter (FSITX) cores
• 6× Fast Serial Interface Receiver (FSIRX) cores

High-speed interfaces:

• 1× Integrated Ethernet switch supporting: (CPSW)
  • Up to 2 external Ethernet ports
    • RGMII (10/100/1000)
    • RMII (10/100)
  • IEEE 1588 (2008 Annex D, Annex E, Annex F) with 802.1AS PTP
  • Clause 45 MDIO PHY management
  • Energy efficient Ethernet (802.3az)
• 1× PCI-Express® Gen2 controller (PCIE)
  • Supports Gen2 Single Lane operation
• 1× USB 3.1 Dual-Role Device (DRD) Subsystem (USBSS)
  • Port configurable as USB Host, USB Device, or USB Dual-Role device
  • USB Device: High-speed (480Mbps) and Full-speed (12Mbps)
  • USB Host: SuperSpeed Gen1 (5Gbps), High-speed (480Mbps), Full-speed (12Mbps), and Low-speed (1.5Mbps)
  • Integrated USB VBUS detection
• 1× Serializer/Deserializer (SERDES)
  • One SERDES PHY lane to support either
    PCI-Express® Gen2 or USB SuperSpeed Gen1

• 2× Multimedia Card/Secure Digital (MMCSD) interfaces
  • One 8-bit for eMMC (MMCSD0)
  • One 4-bit for MMCSD/SDIO (MMCSD1)
  • Integrated analog switch for voltage switching from 3.3V to 1.8V for high-speed cards
• 1× General-Purpose Memory Controller (GPMC)
  • 16-bit parallel bus with 133MHz clock or
  • 32-bit parallel bus with 100MHz clock
  • Error Location Module (ELM) support
• 1× Flash Subsystem (FSS) for external memory configurable as either:
  • 1× Octal SPI (OSPI) flash interface
  • or 1× Quad SPI (QSPI) flash interface

• Simplified power sequencing requirements
• Dual-voltage I/O Support (3.3V / 1.8V)
• Integrated SDIO LDO for handling automatic voltage transition for SD interface
• Integrated voltage supervisor for monitoring over-voltage and under-voltage conditions
• Integrated power supply glitch detector for detecting fast supply transients

Functional safety:

• Functional Safety-Compliant
  • Developed for functional safety applications
  • Documentation available to aid IEC 61508 functional safety system design
  • Systematic capability up to SIL 3
  • Hardware integrity up to SIL 2
  • Safety-related certification
    • IEC 61508 certification by TUV SUD
  • ECC or parity on calculation-critical memories
  • Built-In Self-Test (BIST) for CPU and on-chip RAM
  • Error Signaling Module (ESM) with dedicated error pin
  • ECC and parity on select internal bus interconnects
  • Run-time safety diagnostics, including:
    • Voltage, Temperature, and Clock Monitoring
    • Windowed Watchdog Timers
    • CRC Engine for memory integrity checks
  • MCU domain with dedicated memory, interfaces, and M4FSS capable of isolation from the larger SoC with Freedom From Interference (FFI) features:
    • Separate interconnect
    • Firewalls and timeout gaskets
    • Controlled reset isolation
    • Dedicated MCU PLL and MMR control
    • Separate I/O voltage supply rail

• Supports boot from OSPI/QSPI Flash, SPI Flash, parallel NOR Flash, parallel NAND Flash, UART, I2C, MMCSD, eMMC, USB, PCIe, and Ethernet interfaces.
• 16-nm FinFET technology

• ALV: 17.2mm × 17.2mm, 0.8mm pitch
  (441-pin) [Lidded] Flip-Chip Ball Grid Array
  (FCBGA)
• ALX: 11.0mm × 11.0mm, 0.5mm pitch
  (293-pin) [Overmolded] Flip-Chip Chip Scale Package
  (FCCSP)