AM570x Sitara™ Processors

1 Device Overview

1.1 Features

• Arm®Cortex®-A15 microprocessor subsystem
• C66x floating-point VLIW DSP
  • Fully object-code compatible with C67x and C64x+
  • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
• Up to 512KB of on-chip L3 RAM
• Level 3 (L3) and Level 4 (L4) interconnects
• DDR3/DDR3L Memory Interface (EMIF) module
  • Supports up to DDR-1333 (667 MHz)
  • Up to 2GB across single chip select
• 2x dual Arm® Cortex®-M4 co-processors (IPU1 and IPU2)
• IVA-HD subsystem
  • 4K @ 15fps encode and decode support for H.264 CODEC
  • Other CODECs are up to 1080p60
• Display subsystem
  • Full-HD video (1920 × 1080p, 60 fps)
  • Multiple video input and video output
  • 2D and 3D graphics
  • Display controller with DMA engine and up to three pipelines
  • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
• 2x dual-core programmable real-time unit and industrial communication subsystem (PRU-ICSS)
• Accelerator (BB2D) subsystem
  • Vivante® GC320 core
• Video Processing Engine (VPE)
• Available single-core PowerVR™ SGX544 3D GPU
• Secure boot support
  • Hardware-enforced root-of-trust
  • Customer programmable keys
  • Support for takeover protection, IP protection, and anti-roll back protection
• Cryptographic acceleration support
  • Supports cryptographic cores
    • AES – 128/192/256-bits key sizes
    • 3DES – 56/112/168-bits key sizes
    • MD5, SHA1
    • SHA2 – 224/256/384/512
    • True random number generator
  • DMA support
• Debug security
  • Secure software controlled debug access
  • Security aware debugging
• Trusted execution environment (TEE) support
  • Arm TrustZone™ based TEE
  • Extensive firewall support for isolation
  • Secure DMA path and interconnect
  • Secure watchdog/timer/IPC
• One Video Input Port (VIP) module
  • Support for up to four multiplexed input ports
• General-Purpose Memory Controller (GPMC)
• Enhanced Direct Memory Access (EDMA) controller
• Ethernet subsystem
• Sixteen 32-bit general-purpose timers
• 32-bit MPU watchdog timer
• Five high-speed inter-integrated circuit (I²C) ports
• HDQ™/1-wire® interface
• Ten configurable UART/IrDA/CIR modules
• Four Multichannel Serial Peripheral Interfaces (McSPI)
• Quad SPI Interface (QSPI)
• Eight Multichannel Audio Serial Port (McASP) modules
• SuperSpeed USB 3.0 dual-role device
• High-Speed USB 2.0 dual-role device
• Four MultiMedia Card/Secure Digital/Secure Digital Input Output Interfaces (MMC™/SD®/SDIO)
• PCI Express® 3.0 subsystem with 5-Gbps lane
  • One 2-lane Gen2-compliant port
  • or two 1-lane Gen2-compliant ports
• Dual Controller Area Network (DCAN) modules
  • CAN 2.0B protocol
• MIPI™ CSI-2 camera serial interface
• Up to 186 General-Purpose I/O (GPIO) pins
• Power, reset, and clock management
• On-chip debug with CTools technology
• 28-nm CMOS technology
• 17 mm × 17 mm, 0.65-mm pitch, 538-pin BGA (CBD)