SCAS643I September   2000  – October  2017 CDCV304

PRODUCTION DATA.  

  1. 1Features
  2. 2Description
  3. 3Revision History
  4. 4Pin Configuration and Functions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Timing Requirements
    6. 5.6 Switching Characteristics: VDD = 2.5 V ± 10%
    7. 5.7 Switching Characteristics: VDD = 3.3 V ± 10%
    8. 5.8 Typical Characteristics
  6. 6Parameter Measurement Information
  7. 7Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • General-Purpose and PCI-X 1:4 Clock Buffer
  • Operating Frequency
    • 0 MHz to 200 MHz General-Purpose
  • Low Output Skew: <100 ps
  • Distributes One Clock Input to One Bank of Four Outputs
  • Output Enable Control that Drives Outputs Low when OE is Low
  • Operates from Single 3.3-V Supply or 2.5-V Supply
  • PCI-X Compliant
  • 8-Pin TSSOP Package

2 Description

The CDCV304 is a high-performance, low-skew, general-purpose PCI-X compliant clock buffer. It distributes one input clock signal (CLKIN) to the output clocks (1Y[0:3]). It is specifically designed for use with PCI-X applications. The CDCV304 operates at 3.3 V and 2.5 V and is therefore compliant to the 3.3-V PCI-X specifications.

The CDCV304 is characterized for operation from –40°C to 85°C for automotive and industrial applications.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
CDCV304 TSSOP (8) 3.00 mm × 4.40 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Functional Block Diagram

CDCV304 fbd_cas643.gif

3 Revision History

Changes from H Revision (February 2011) to I Revision

  • Changed datasheet layout Go
  • Added Junction temperature, Tj, max125 °CGo

Changes from G Revision (January 2011) to H Revision

  • Added missing characteristics graphs.Go

Changes from F Revision (April 2009) to G Revision

  • Added ψ JT and ψ JB specs to the Thermal Information Table and changed RθJB and RθJC specs from 65 and 69 °C/W respectively.Go