ZHCS311D
May 2009 – January 2018
ADS1113
,
ADS1114
,
ADS1115
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
简化的方框图
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements: I2C
7.7
Typical Characteristics
8
Parameter Measurement Information
8.1
Noise Performance
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagrams
9.3
Feature Description
9.3.1
Multiplexer
9.3.2
Analog Inputs
9.3.3
Full-Scale Range (FSR) and LSB Size
9.3.4
Voltage Reference
9.3.5
Oscillator
9.3.6
Output Data Rate and Conversion Time
9.3.7
Digital Comparator (ADS1114 and ADS1115 Only)
9.3.8
Conversion Ready Pin (ADS1114 and ADS1115 Only)
9.3.9
SMbus Alert Response
9.4
Device Functional Modes
9.4.1
Reset and Power-Up
9.4.2
Operating Modes
9.4.2.1
Single-Shot Mode
9.4.2.2
Continuous-Conversion Mode
9.4.3
Duty Cycling For Low Power
9.5
Programming
9.5.1
I2C Interface
9.5.1.1
I2C Address Selection
9.5.1.2
I2C General Call
9.5.1.3
I2C Speed Modes
9.5.2
Slave Mode Operations
9.5.2.1
Receive Mode
9.5.2.2
Transmit Mode
9.5.3
Writing To and Reading From the Registers
9.5.4
Data Format
9.6
Register Map
9.6.1
Address Pointer Register (address = N/A) [reset = N/A]
Table 6.
Address Pointer Register Field Descriptions
9.6.2
Conversion Register (P[1:0] = 0h) [reset = 0000h]
Table 7.
Conversion Register Field Descriptions
9.6.3
Config Register (P[1:0] = 1h) [reset = 8583h]
Table 8.
Config Register Field Descriptions
9.6.4
Lo_thresh (P[1:0] = 2h) [reset = 8000h] and Hi_thresh (P[1:0] = 3h) [reset = 7FFFh] Registers
Table 9.
Lo_thresh and Hi_thresh Register Field Descriptions
10
Application and Implementation
10.1
Application Information
10.1.1
Basic Connections
10.1.2
Single-Ended Inputs
10.1.3
Input Protection
10.1.4
Unused Inputs and Outputs
10.1.5
Analog Input Filtering
10.1.6
Connecting Multiple Devices
10.1.7
Quickstart Guide
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.2.1
Shunt Resistor Considerations
10.2.2.2
Operational Amplifier Considerations
10.2.2.3
ADC Input Common-Mode Considerations
10.2.2.4
Resistor (R1, R2, R3, R4) Considerations
10.2.2.5
Noise and Input Impedance Considerations
10.2.2.6
First-order RC Filter Considerations
10.2.2.7
Circuit Implementation
10.2.2.8
Results Summary
10.2.3
Application Curves
11
Power Supply Recommendations
11.1
Power-Supply Sequencing
11.2
Power-Supply Decoupling
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
器件和文档支持
13.1
Documentation Support
13.1.1
相关文档
13.2
相关链接
13.3
Receiving Notification of Documentation Updates
13.4
社区资源
13.5
商标
13.6
静电放电警告
13.7
Glossary
14
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
DGS|10
MPDS035C
RUG|10
MPQF216A
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcs311d_oa
zhcs311d_pm
1
特性
超小型 X2QFN 封装:
2mm × 1.5mm × 0.4mm
宽电源电压:2.0V 至 5.5V
低流耗:150μA
(连续转换模式)
可编程数据传输速率:
8SPS 至 860SPS
单周期稳定
内部低漂移电压基准
内部振荡器
I
2
C 接口:四个引脚可选地址
四个单端输入或两个差分输入 (ADS1115)
可编程比较器(ADS1114 和 ADS1115)
工作温度范围:
-40°C 至 +125°C