ZHCSHX7B
November 2017 – May 2022
DLPC120-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
5.1
LED Driver Interface
5.2
DMD Temperature Interface
General Purpose I/O
5.3
Main Video and Data Control Interface
5.4
DMD Interface
5.5
Memory Interface
Board Level Test and Debug
Manufacturing Test Support
Test Point Interface
Power and Ground
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Electrical Characteristics for I/O
6.7
Power Supply and Reset Timing Requirements
6.8
Reference Clock PLL Timing Requirements
6.9
Parallel Interface General Timing Requirements
6.10
Parallel Interface Frame Timing Requirements
6.11
Flash Memory Interface Timing Requirements
6.12
DMD Interface Timing Requirements
6.13
JTAG Interface Timing Requirements
6.14
I2C Interface Timing Requirements
7
Parameter Measurement Information
7.1
Parallel Interface Input Source Timing
7.2
Design for Test Functions
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Serial Flash Interface
8.3.2
Serial Flash Programming
8.3.3
DDR2 Memory Interface
8.3.4
JTAG and DMD Interface Test
8.3.5
Temperature Monitor Function
8.3.6
Host Command Interface
8.4
Device Functional Modes
8.4.1
External Video Mode
8.4.2
Splash Screen Mode
8.4.3
Test Pattern Mode
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
10
Power Supply Recommendations
10.1
Power Supply Filtering
11
Layout
11.1
Layout Guidelines
11.1.1
PCB layout guidelines for internal ASIC PLL power
11.1.2
DLPC120-Q1 Reference Clock
11.1.2.1
Recommended Crystal Oscillator Configuration
11.1.3
General PCB Recommendations
11.1.4
PCB Routing Guidelines
11.1.5
Number of Layer Changes
11.1.6
Terminations
11.1.7
General Handling Guidelines for Unused CMOS-Type Pins
12
Device and Documentation Support
12.1
第三方产品免责声明
12.2
Device Support
12.2.1
Device Nomenclature
12.2.1.1
Device Markings
12.3
Documentation Support
12.3.1
Related Documentation
12.4
接收文档更新通知
12.5
支持资源
12.6
Trademarks
12.7
Electrostatic Discharge Caution
12.8
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
ZXS|216
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcshx7b_oa
1
特性
符合面向汽车应用的 AEC-Q100 标准:
温度等级 2:–40°C 至 105°C(环境温度)
与三个 DMD 器件兼容:
DLP3030-Q1:0.3 WVGA S450
DLP3020-Q1:0.3 WVGA S247
DLP3021-Q1:0.3 WVGA S247
视频输入接口:
24 位并行(RGB888、RGB666 或 RGB565)
60Hz 帧速率
从 QVGA 至 WVGA 的输入分辨率
像素时钟高达 40MHz
视频处理:
图像缩放
可编程去伽玛曲线
边框调整
水平和垂直图像翻转
DMD 接口:
78MHz DDR DMD 接口
一致的 DMD 数据加载和复位控制过热工作范围
断电时自动停止 DMD
DMD 温度管理
外部存储器支持
DDR2:312MHz 时钟(624MHz 数据速率)
串行闪存 39MHz 时钟
系统控制
I
2
C 通讯接口
可编程启动界面
DMD 电源和复位驱动器控制
基于闪存的可编程配置
测试支持
内置测试图形发生器
JTAG:支持边界扫描
采用 216 引脚 1.0mm 间距 BGA 封装