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DLP2010NIR (.2 WVGA Near-Infrared DMD)
DLPS119B
December 2018 – May 2022
DLP2010NIR
PRODUCTION DATA
CONTENTS
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DLP2010NIR (.2 WVGA Near-Infrared DMD)
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
6.8
Switching Characteristics
6.9
System Mounting Interface Loads
6.10
Physical Characteristics of the Micromirror Array
6.11
Micromirror Array Optical Characteristics
6.12
Window Characteristics
6.13
Chipset Component Usage Specification
6.13.1
Software Requirements
6.14
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power Interface
7.3.2
Low-Speed Interface
7.3.3
High-Speed Interface
7.3.4
Timing
7.4
Device Functional Modes
7.5
Optical Interface and System Image Quality Considerations
7.5.1
Optical Interface and System Image Quality
7.5.1.1
Numerical Aperture and Stray Light Control
7.5.1.2
Pupil Match
7.5.1.3
Illumination Overfill
7.6
Micromirror Array Temperature Calculation
7.7
Micromirror Landed-On/Landed-Off Duty Cycle
7.7.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7.7.2
Landed Duty Cycle and Useful Life of the DMD
7.7.3
Landed Duty Cycle and Operational DMD Temperature
7.7.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
9
Power Supply Recommendations
9.1
Power Supply Power-Up Procedure
9.2
Power Supply Power-Down Procedure
9.3
Power Supply Sequencing Requirements
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Third-Party Products Disclaimer
11.1.2
Device Nomenclature
11.1.3
Device Markings
11.2
Related Links
11.3
Receiving Notification of Documentation Updates
11.4
Support Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Mechanical, Packaging, and Orderable Information
IMPORTANT NOTICE
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
FQJ|40
散热焊盘机械数据 (封装 | 引脚)
订购信息
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