ZHCSGC3E
March 2016 – April 2021
TCAN1051H
,
TCAN1051HG
,
TCAN1051HGV
,
TCAN1051HV
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
ESD Ratings, Specifications
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Power Rating
6.7
Electrical Characteristics
6.8
Switching Characteristics
6.9
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
TXD Dominant Timeout (DTO)
8.3.2
Thermal Shutdown (TSD)
8.3.3
Undervoltage Lockout
8.3.4
Unpowered Device
8.3.5
Floating Terminals
8.3.6
CAN Bus Short Circuit Current Limiting
8.3.7
Digital Inputs and Outputs
8.3.7.1
5-V VCC Only Devices (Devices without the "V" Suffix):
8.3.7.2
5 V VCC with VIO I/O Level Shifting (Devices with the "V" Suffix):
8.4
Device Functional Modes
8.4.1
CAN Bus States
8.4.2
Normal Mode
8.4.3
Silent Mode
8.4.4
Driver and Receiver Function Tables
9
Application Information Disclaimer
9.1
Application Information
9.2
Typical Applications
9.2.1
Design Requirements
9.2.1.1
Bus Loading, Length and Number of Nodes
9.2.2
Detailed Design Procedures
9.2.2.1
CAN Termination
9.2.3
Application Curves
10
Power Supply Recommendations
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
1
特性
符合 ISO 11898-2:2016 和
ISO 11898-5:2007 物理层标准
提供功能安全型
可帮助进行功能安全系统设计的文档
“Turbo”CAN:
所有器件均支持经典 CAN 和 2Mbps CAN FD(灵活数据速率),而“G”选项支持 5Mbps
具有较短的对称传播延迟时间和快速循环次数,可增加时序裕量
在有负载 CAN 网络中实现更快的数据速率
I/O 电压范围支持 3.3V 和 5V MCU
未供电时具有理想无源行为
总线和逻辑引脚处于高阻态(无负载)
在总线和 RXD 输出上实现上电/断电无干扰运行
保护特性
HBM ESD 保护:±16kV
IEC ESD 保护高达 ±15kV
总线故障保护:±58V(非 H 型号)和 ±70V(H 型号)
V
CC
和 V
IO
(仅限 V 型号)电源终端具有欠压保护
驱动器显性超时 (TXD DTO) - 数据速率低至 10kbps
热关断保护 (TSD)
接收器共模输入电压:±30V
典型循环延迟:110ns
结温范围为 –55°C 至 150°C
采用 SOIC (8) 封装和无引线 VSON (8) 封装 (3.0mm x 3.0mm),具有改进的自动光学检查 (AOI) 功能