ZHCSQX3M
March 2002 – August 2022
SN74AUC1G125
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics: CL = 15 pF
6.7
Switching Characteristics: CL = 30 pF
6.8
Operating Characteristics
6.9
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
ULTTL CMOS Outputs
8.3.2
Standard CMOS Inputs
8.3.3
Partial Power Down (Ioff)
8.3.4
Clamp Diode Structure
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
接收文档更新通知
12.3
支持资源
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DCK|5
MPDS025K
YZP|5
MXBG018L
DBV|5
MPDS018T
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsqx3m_oa
zhcsqx3m_pm
1
特性
针对 1.8V 运行进行了优化
1.8V 下的输出驱动为 ±8mA
电压为 1.8V 且负载为 30pF 时的最大 t
pd
为 2.5ns
0.8V 至 2.7V 的宽工作电压范围
耐过压 I/O 支持高达 3.6V 的电压(独立于 V
CC
)
采用德州仪器 (TI)
NanoFree™
封装
I
off
特性支持局部关断模式和后驱动保护
低功耗,I
CC
最大值为 10µA
闩锁性能超过 100 mA,符合 JESD 78 II 类规范