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采用 WCSP 封装、具有双线制串行接口的 TMP108 低功耗数字温度传感器
ZHCSAV1A
April 2013 – September 2019
TMP108
PRODUCTION DATA.
CONTENTS
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采用 WCSP 封装、具有双线制串行接口的 TMP108 低功耗数字温度传感器
1
特性
2
应用
3
说明
Device Images
方框图
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Diagrams
6.6.1
Two-Wire Timing Diagrams
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Serial Interface
7.3.2
Serial Bus Address
7.3.3
Bus Overview
7.3.4
Writing and Reading Operation
7.3.5
Slave Mode Operations
7.3.5.1
Slave Receiver Mode:
7.3.5.2
Slave Transmitter Mode:
7.3.6
SMBus Alert Function
7.3.7
General Call
7.3.8
High-Speed (Hs) Mode
7.3.9
Timeout Function
7.4
Device Functional Modes
7.4.1
Shutdown Mode (M1 = 0, M0 = 0)
7.4.2
One-Shot Mode (M1 = 0, M0 = 1)
7.4.3
Continuous Conversion Mode (M1 = 1)
7.5
Programming
7.5.1
Pointer Register
7.5.2
Temperature Register
7.5.3
Configuration Register
7.5.3.1
Hysteresis Control (HYS1 and HYS0)
7.5.3.2
Polarity (POL)
7.5.3.3
Thermostat Mode (TM)
7.5.3.4
Temperature Watchdog Flags (FL and FH)
7.5.3.5
Conversion Rate
7.5.4
High- and Low-Limit Registers
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
器件和文档支持
11.1
接收文档更新通知
11.2
支持资源
11.3
商标
11.4
静电放电警告
11.5
Glossary
12
机械、封装和可订购信息
重要声明
封装选项
机械数据 (封装 | 引脚)
YFF|6
MXBG078Z
散热焊盘机械数据 (封装 | 引脚)
订购信息
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