SLASEQ6A Septmeber   2018  – June 2019 HD3SS3212-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 High-Speed Performance Parameters
    7. 6.7 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Enable and Power Savings
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Down Facing Port for USB3.1 Type C
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Systems Examples
      1. 9.3.1 Up Facing Port for USB 3.2 Type C
      2. 9.3.2 PCIe/SATA/USB
      3. 9.3.3 PCIE/eSATA
      4. 9.3.4 USB/eSATA
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RKS|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 Qualified for automotive applications
    • Temperature grade 2: –40°C to +105°C, TA
  • Provides MUX/DEMUX solution for USB Type-C™ ecosystem for USB 3.2 Gen 1 and Gen 2 data rates
  • Compatible with MIPI DSI/CSI, FPD-Link III, LVDS, and PCIe Gen II, III
  • Operates up to 10 Gbps
  • Wide –3-dB Differential BW of over 8 GHz
  • Excellent dynamic characteristics (at 5 GHz)
    • Crosstalk = –28 dB
    • Off isolation = –19 dB
    • Insertion loss = –2 dB
    • Return loss = –8 dB
  • Bidirectional "Mux/De-Mux" differential switch
  • Supports common mode voltage 0 V to 2 V
  • Single supply voltage VCC of 3.3 V
  • Available in automotive friendly QFN package
    (2.5 mm x 4.5 mm at 0.5 mm pitch)