JAJSPG0 December   2022 BQ34Z100-R2

PRODUCTION DATA  

1. 1 特長
2. 2 アプリケーション
3. 3 概要
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  ESD Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information
   5. 6.5  Electrical Characteristics: Power-On Reset
   6. 6.6  Electrical Characteristics: LDO Regulator
   7. 6.7  Electrical Characteristics: Internal Temperature Sensor Characteristics
   8. 6.8  Electrical Characteristics: Low-Frequency Oscillator
   9. 6.9  Electrical Characteristics: High-Frequency Oscillator
   10. 6.10 Electrical Characteristics: Integrating ADC (Coulomb Counter) Characteristics
   11. 6.11 Electrical Characteristics: ADC (Temperature and Cell Measurement) Characteristics
   12. 6.12 Electrical Characteristics: Data Flash Memory Characteristics
   13. 6.13 Timing Requirements: HDQ Communication
   14. 6.14 Timing Requirements: I2C-Compatible Interface
   15. 6.15 Typical Characteristics
7. 7 Functional Block Diagram
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 Step-by-Step Design Procedure
            1. 8.2.2.1.1 STEP 1: Review and Modify the Data Flash Configuration Data.
            2. 8.2.2.1.2 STEP 2: Review and Modify the Data Flash Configuration Registers.
            3. 8.2.2.1.3 STEP 3: Design and Configure the Voltage Divider.
            4. 8.2.2.1.4 STEP 4: Determine the Sense Resistor Value.
            5. 8.2.2.1.5 STEP 5: Review and Modify the Data Flash Gas Gauging Configuration, Data, and State.
            6. 8.2.2.1.6 STEP 6: Determine and Program the Chemical ID.
            7. 8.2.2.1.7 STEP 7: Calibrate.
            8. 8.2.2.1.8 STEP 8: Run an Optimization Cycle.
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 Introduction
       2. 10.1.2 Power Supply Decoupling Capacitor
       3. 10.1.3 Capacitors
       4. 10.1.4 Communication Line Protection Components
    2. 10.2 Layout Example
       1. 10.2.1 Ground System
       2. 10.2.2 Kelvin Connections
       3. 10.2.3 Board Offset Considerations
       4. 10.2.4 ESD Spark Gap
11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
12. 12Mechanical, Packaging, and Orderable Information