DRV8836 Dual Low-Voltage H-Bridge IC
1 Features
- Dual-H-Bridge Motor Driver
- Capable of Driving Two DC Motors or One Stepper Motor
- Low MOSFET On-Resistance:
HS + LS 305 mΩ
- 1.5-A Maximum Drive Current Per H-Bridge
- Configure Bridges Parallel for 3-A Drive Current
- 2-V to 7-V Operating Supply Voltage
- Flexible PWM or PHASE/ENABLE Interface
- Low-Power Sleep Mode With 95-nA Maximum Supply Current
- Dedicated nSLEEP Input Pin
- Tiny 2.00-mm × 3.00-mm WSON Package
2 Applications
- Battery-Powered:
- DSLR Lenses
- Consumer Products
- Toys
- Robotics
- Cameras
- Medical Devices
3 Description
The DRV8836 provides an integrated motor driver solution for cameras, consumer products, toys, and other low-voltage or battery-powered motion control applications. The device has two H-bridge drivers, and can drive two DC motors or one stepper motor, as well as other devices like solenoids. The output driver block for each consists of N-channel power MOSFET configured as an H-bridge to drive the motor winding. An internal charge pump generates gate drive voltages.
The DRV8836 supplies up to 1.5-A of output current per H-bridge. It operates on a power supply voltage from 2 V to 7 V.
PHASE/ENABLE and IN/IN interfaces can be selected which are compatible with industry-standard devices. A low-power sleep mode is provided which turns off all unnecessary logic to provide a very low current state.
Internal shutdown functions are provided for overcurrent protection, short-circuit protection, undervoltage lockout, and overtemperature.
The DRV8836 is packaged in a tiny 12-pin WSON package (Eco-friendly: RoHS and no Sb/Br).
Device Information(1)
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| DRV8836 | WSON (12) | 2.00 mm x 3.00 mm |
- For all available packages, see the orderable addendum at the end of the datasheet.
4 Revision History
Changes from C Revision (December 2015) to D Revision
- Deleted nFAULT from the Simplified Schematic in the Description section Go
Changes from B Revision (January 2014) to C Revision
- Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
Changes from A Revision (September 2013) to B Revision
- Added tOCR and tDEAD parameters to Electrical CharacteristicsGo
5 Pin Configuration and Functions
Pin Functions
| PIN | I/O(1) | DESCRIPTION | EXTERNAL COMPONENTS OR CONNECTIONS |
|
|---|---|---|---|---|
| NAME | NO. | |||
| POWER AND GROUND | ||||
| GND, Thermal pad | 6 | — | Device ground | |
| VCC | 1 | — | Device and motor supply | Bypass to GND with a 0.1-μF (minimum) ceramic capacitor |
| CONTROL | ||||
| AIN1/APHASE | 10 | I | Bridge A input 1/PHASE input | IN/IN mode: Logic high sets AOUT1 high PH/EN mode: Sets direction of H-bridge A Internal pulldown resistor |
| AIN2/AENBL | 9 | I | Bridge A input 2/ENABLE input | IN/IN mode: Logic high sets AOUT2 high PH/EN mode: Logic high enables H-bridge A Internal pulldown resistor |
| BIN1/BPHASE | 8 | I | Bridge B input 1/PHASE input | IN/IN mode: Logic high sets BOUT1 high PH/EN mode: Sets direction of H-bridge B Internal pulldown resistor |
| BIN2/BENBL | 7 | I | Bridge B input 2/ENABLE input | IN/IN mode: Logic high sets BOUT2 high PH/EN mode: Logic high enables H-bridge B Internal pulldown resistor |
| MODE | 11 | I | Input mode select | Logic low selects IN/IN mode Logic high selects PH/EN mode Internal pulldown resistor |
| nSLEEP | 12 | I | Sleep input | Active low places part in low-power sleep state Internal pulldown resistor |
| OUTPUT | ||||
| AOUT1 | 2 | O | Bridge A output 1 | Connect to motor winding A |
| AOUT2 | 3 | O | Bridge A output 2 | |
| BOUT1 | 4 | O | Bridge B output 1 | Connect to motor winding B |
| BOUT2 | 5 | O | Bridge B output 2 | |
6 Specifications
6.1 Absolute Maximum Ratings(1)(2)
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| Power supply voltage, VCC | –0.3 | 7 | V | ||
| Digital input pin voltage | –0.5 | VCC + 0.5 | V | ||
| Peak motor drive output current | Internally limited | A | |||
| Continuous motor drive output current per H-bridge(3) | –1.5 | 1.5 | A | ||
| TJ | Operating junction temperature | –40 | 150 | °C | |
| Tstg | Storage temperature | –60 | 150 | °C | |
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1500 | |||
6.3 Recommended Operating Conditions
TA = 25°C (unless otherwise noted)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VCC | Device power supply voltage | 2 | 7 | V |
| VIN | Logic level input voltage | 0 | VCC | V |
| IOUT | H-bridge output current(1) | 0 | 1.5 | A |
| fPWM | Externally applied PWM frequency | 0 | 250 | kHz |
6.4 Thermal Information
| THERMAL METRIC(1) | DRV8836 | UNIT | |
|---|---|---|---|
| DSS (WSON) | |||
| 12 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 50.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 58 | °C/W |
| RθJB | Junction-to-board thermal resistance | 19.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 20 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 6.9 | °C/W |
6.5 Electrical Characteristics
TA = 25°C, VCC = 5 V (unless otherwise noted)6.6 Timing Requirements(1)
TA = 25°C, VCC = 5 V, RL = 20 Ω| NO. | MIN | MAX | UNIT | ||
|---|---|---|---|---|---|
| 1 | t1 | Delay time, xPHASE high to xOUT1 low | 210 | ns | |
| 2 | t2 | Delay time, xPHASE high to xOUT2 high | 150 | ns | |
| 3 | t3 | Delay time, xPHASE low to xOUT1 high | 150 | ns | |
| 4 | t4 | Delay time, xPHASE low to xOUT2 low | 210 | ns | |
| 5 | t5 | Delay time, xENBL high to xOUTx high | 150 | ns | |
| 6 | t6 | Delay time, xENBL high to xOUTx low | 150 | ns | |
| 7 | t7 | Output enable time | 210 | ns | |
| 8 | t8 | Output disable time | 210 | ns | |
| 9 | t9 | Delay time, xINx high to xOUTx high | 125 | ns | |
| 10 | t10 | Delay time, xINx low to xOUTx low | 125 | ns | |
| 11 | tR | Output rise time | 20 | 188 | ns |
| 12 | tF | Output fall time | 8 | 30 | ns |
Figure 1. Timing Requirements
6.7 Typical Characteristics
Figure 2. RDS(ON) (HS + LS)
Figure 4. VCC Sleep Current
Figure 3. VCC Operating Current, fPWM = 50 kHz, No Load
7 Detailed Description
7.1 Overview
The DRV8836 is an integrated motor driver solution used for brushed motor control. The device integrates two
H-bridges, and can drive two DC motor or one stepper motor. The output driver block for each H-bridge consists of N-channel power MOSFETs. An internal charge pump generates the gate drive voltages. Protection features include overcurrent protection, short-circuit protection, undervoltage lockout, and overtemperature protection.
The bridges connect in parallel for additional current capability.
The mode pin allows selection of either a PHASE/ENABLE or IN/IN interface.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Sleep Mode
If the nSLEEP pin enters a logic-low state, the DRV8836 enters a low-power sleep mode. In this state all unnecessary internal circuitry is powered down.
7.3.2 Power Supplies and Input Pins
There is a weak pulldown resistor (approximately 100 kΩ) to ground on the input pins.
7.3.3 Protection Circuits
The DRV8836 is fully protected against undervoltage, overcurrent, and overtemperature events.
7.3.3.1 Overcurrent Protection (OCP)
An analog current limit circuit on each FET limits the current through the FET by removing the gate drive. If this analog current limit persists for longer than the OCP time, all FETs in the H-bridge disable. After approximately
1 ms, the bridge re-enables automatically.
Overcurrent conditions on both high and low side devices, like a short to ground, supply, or across the motor winding results in an overcurrent shutdown.
7.3.3.2 Thermal Shutdown (TSD)
If the die temperature exceeds safe limits, all FETs in the H-bridge disable. Once the die temperature has fallen to a safe level operation automatically resumes.
7.3.3.3 Undervoltage Lockout (UVLO)
If at any time the voltage on the VCC pins falls below the undervoltage lockout threshold voltage, all circuitry in the device disables, and internal logic resets. Operation resumes when VCC rises above the UVLO threshold.
Table 1. Device Protection
| FAULT | CONDITION | ERROR REPORT | H-BRIDGE | INTERNAL CIRCUITS | RECOVERY |
|---|---|---|---|---|---|
| VCC undervoltage (UVLO) | VCC < VUVLO | None | Disabled | Disabled | VCC > VUVLO |
| Overcurrent (OCP) | IOUT > IOCP | None | Disabled | Operating | tOCR |
| Thermal shutdown (TSD) | TJ > TTSD | None | Disabled | Operating | TJ < TTSD – THYS |
7.4 Device Functional Modes
The DRV8836 is active when the nSLEEP pin is set to a logic high. When in sleep mode, the H-bridge FETs disable (Hi-Z).
Table 2. Device Operating Modes
| OPERATING MODE | CONDITION | H-BRIDGE | INTERNAL CIRCUITS |
|---|---|---|---|
| Operating | nSLEEP high | Operating | Operating |
| Sleep mode | nSLEEP low | Disabled | Disabled |
| Fault encountered | Any fault condition met | Disabled | See Table 1 |
7.4.1 Bridge Control
Two control modes are available in the DRV8836: IN/IN mode and PHASE/ENABLE mode. IN/IN mode is selected if the MODE pin is driven low or left unconnected; PHASE/ENABLE mode is selected if the MODE pin is driven to logic high. The following tables show the logic for these modes.
Table 3. IN/IN Mode
| MODE | xIN1 | xIN2 | xOUT1 | xOUT2 | FUNCTION (DC MOTOR) |
|---|---|---|---|---|---|
| 0 | 0 | 0 | Z | Z | Coast |
| 0 | 0 | 1 | L | H | Reverse |
| 0 | 1 | 0 | H | L | Forward |
| 0 | 1 | 1 | L | L | Brake |
Table 4. PHASE/ENABLE Mode
| MODE | xENABLE | xPHASE | xOUT1 | xOUT2 | FUNCTION (DC MOTOR) |
|---|---|---|---|---|---|
| 1 | 0 | X | L | L | Brake |
| 1 | 1 | 1 | L | H | Reverse |
| 1 | 1 | 0 | H | L | Forward |
8 Application and Implementation
NOTE
The information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
8.1 Application Information
The DRV8836 is used in one or two motor control applications. When configured in parallel, the DRV8836 provides double the current to one motor.
8.2 Typical Application
The two H-bridges in the DRV8836 can be connected in parallel for double the current of a single H-bridge. Figure 5 shows the connections.
The following design is a common application of the DRV8836.
Figure 5. Parallel Mode Connections
8.2.1 Design Requirements
The design requirements are shown in Table 5.
Table 5. Design Requirements
| DESIGN PARAMETER | REFERENCE | EXAMPLE VALUE |
|---|---|---|
| Motor voltage | VCC | 4 V |
| Motor RMS current | IRMS | 0.3 A |
| Motor startup current | ISTART | 0.6 A |
| Motor current trip point | ILIMIT | 0.5 A |
8.2.2 Detailed Design Procedure
The following design procedure can be used to configure the DRV8836 in a brushed motor application.
8.2.2.1 Motor Voltage
The appropriate motor voltage depends on the ratings of the motor selected and the desired RPM. A higher voltage spins a brushed DC motor faster with the same PWM duty cycle applied to the power FETs. A higher voltage also increases the rate of current change through the inductive motor windings.
8.2.2.2 Low-Power Operation
When entering sleep mode, TI recommends setting all inputs as a logic low to minimize system power.
8.2.3 Application Curve
The following scope captures motor startup as VCC ramps from 0 V to 6 V. Channel 1 is VCC, and Channel 4 is the motor current of an unloaded motor during startup. The motor used is a NMB Technologies Corporation OOB7PA12C, PPN7PA12C1. As VCC ramps the current in the motor increases until the motor speed builds up. The motor current then reduces for normal operation.
Inputs are set as follows:
- Mode: IN/IN
- AIN1: High
- AIN2: Low
Figure 6. Motor Startup With No Load
9 Power Supply Recommendations
9.1 Bulk Capacitance
The appropriate local bulk capacitance is an important factor in motor drive system design. More bulk capacitance is generally beneficial but may increase costs and physical size.
The amount of local capacitance needed depends on a variety of factors, including:
- The highest current required by the motor system
- The power supply’s capacitance and ability to source current
- The amount of parasitic inductance between the power supply and motor system
- The acceptable voltage ripple
- The type of motor used (brushed DC, brushless DC, stepper)
- The motor braking method
The inductance between the power supply and motor drive system limits the rate current changes from the power supply. If the local bulk capacitance is too small, the system responds to excessive current demands or dumps from the motor with a change in voltage. When adequate bulk capacitance is used, the motor voltage remains stable and high current can be quickly supplied.
The datasheet provides a recommended value, but system-level testing is required to determine the appropriate sized bulk capacitor.
Figure 7. Bulk Capacitor
10 Layout
10.1 Layout Guidelines
The VCC pin should be bypassed to GND using low-ESR ceramic bypass capacitors with a recommended value of 0.1-μF rated for VCC. This capacitor should be placed as close to the VCC pin as possible with a thick trace or ground plane connection to the device GND pin.
The VCC pin must bypass to ground using an appropriate bulk capacitor. This component may be an electrolytic and should be located close to the DRV8836.
10.2 Layout Example
Figure 8. Layout Recommendation
10.3 Thermal Considerations
The DRV8836 has thermal shutdown (TSD) as described in Thermal Shutdown (TSD). If the die temperature exceeds approximately 150°C, the device disables until the temperature drops to a safe level.
Any tendency of the device to enter thermal shutdown is an indication of either excessive power dissipation, insufficient heatsinking, or an ambient temperature that is too high.
10.3.1 Power Dissipation
The power dissipated in the output FET resistance or RDS(on) dominates the power dissipation in the DRV8836. The average power dissipation when running both H-bridges can be roughly estimated by Equation 1:
where
- PTOT is the total power dissipation, RDS(ON) is the resistance of the HS plus LS FETs, and IOUT(RMS) is the RMS output current being applied to each winding. IOUT(RMS) is equal to approximately 0.7× the full-scale output current setting. The factor of 2 comes from the fact that there are two H-bridges.
The maximum amount of power dissipated in the device is dependent on ambient temperature and heatsinking.
NOTE
RDS(ON) increases with temperature. As the device heats, the power dissipation increases. This must be taken into consideration when sizing the heatsink.
10.3.2 Heatsinking
The PowerPAD™ package uses an exposed pad to remove heat from the device. For proper operation, this pad must be thermally connected to copper on the PCB to dissipate heat. On a multi-layer PCB with a ground plane, this can be accomplished by adding a number of vias to connect the thermal pad to the ground plane. On PCBs without internal planes, copper area can be added on either side of the PCB to dissipate heat. If the copper area is on the opposite side of the PCB from the device, thermal vias are used to transfer the heat between top and bottom layers.
For more information on PCB design, refer to TI application report SLMA002, PowerPAD™ Thermally Enhanced Package, and TI application brief SLMA004, PowerPAD™ Made Easy, available at www.ti.com.
In general, the more copper area that can be provided, the more power can be dissipated.
11 Device and Documentation Support
11.1 Documentation Support
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
-
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
-
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.3 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.
TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
- Audio: www.ti.com/audio
- Amplifiers: amplifier.ti.com
- Data Converters: dataconverter.ti.com
- DLP® Products: www.dlp.com
- DSP: dsp.ti.com
- Clocks and Timers: www.ti.com/clocks
- Interface: interface.ti.com
- Logic: logic.ti.com
- Power Mgmt: power.ti.com
- Microcontrollers: microcontroller.ti.com
- RFID: www.ti.rfid.com
- OMAP Application Processors: www.ti.com/omap
- Wireless Connectivity: www.ti.com/wirelessconnectivity
Applications
- Automotive and Transportation: www.ti.com/automotive
- Communications and Telecom: www.ti.com/communications
- Computers and Peripherals: www.ti.com/computers
- Consumer Electronics: www.ti.com/consumer-apps
- Energy and Lighting: www.ti.com/energy
- Industrial: www.ti.com/industrial
- Medical: www.ti.com/medical
- Security: www.ti.com/security
- Space, Avionics and Defense: www.ti.com/space-avionics-defense
- Video & Imaging: www.ti.com/video
TI E2E Community : e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright© 2016, Texas Instruments Incorporated