SLAS834C November   2012  – December 2014 RF430FRL152H , RF430FRL153H , RF430FRL154H

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
    3. 4.3 Pin Multiplexing
    4. 4.4 Connections for Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Recommended Operating Conditions, Resonant Circuit
    5. 5.5  Active Mode Supply Current Into VDDB Excluding External Current
    6. 5.6  Low-Power Mode Supply Current (Into VDDB) Excluding External Current
    7. 5.7  Digital I/Os (P1, RST/NMI)
    8. 5.8  High-Frequency Oscillator (4 MHz), HFOSC
    9. 5.9  Low-Frequency Oscillator (256 kHz), LFOSC
    10. 5.10 Wake-Up From Low-Power Modes
    11. 5.11 Timer_A
    12. 5.12 eUSCI (SPI Master Mode) Recommended Operating Conditions
    13. 5.13 eUSCI (SPI Master Mode)
    14. 5.14 eUSCI (SPI Slave Mode)
    15. 5.15 eUSCI (I2C Mode)
    16. 5.16 FRAM
    17. 5.17 JTAG
    18. 5.18 RFPMM, Power Supply Switch
    19. 5.19 RFPMM, Bandgap Reference
    20. 5.20 RFPMM, Voltage Doubler
    21. 5.21 RFPMM, Voltage Supervision
    22. 5.22 SD14, Performance
    23. 5.23 SVSS Generator
    24. 5.24 Thermistor Bias Generator
    25. 5.25 Temperature Sensor
    26. 5.26 RF13M, Power Supply and Recommended Operating Conditions
    27. 5.27 RF13M, ISO/IEC 15693 ASK Demodulator
    28. 5.28 RF13M, ISO/IEC 15693 Compliant Load Modulator
  6. 6Detailed Description
    1. 6.1 CPU
    2. 6.2 Instruction Set
    3. 6.3 Operating Modes
    4. 6.4 Interrupt Vector Addresses
    5. 6.5 Memory
      1. 6.5.1 FRAM
      2. 6.5.2 SRAM
      3. 6.5.3 Application ROM
    6. 6.6 Peripherals
      1. 6.6.1  Digital I/O, (P1.x)
      2. 6.6.2  Versatile I/O Port P1
      3. 6.6.3  Oscillator and System Clock
      4. 6.6.4  Compact System Module (C-SYS_A)
      5. 6.6.5  Watchdog Timer (WDT_A)
      6. 6.6.6  Reset, NMI, SVMOUT System
      7. 6.6.7  Timer_A (Timer0_A3)
      8. 6.6.8  Enhanced Universal Serial Communication Interface (eUSCI_B0)
      9. 6.6.9  ISO/IEC 15693 Analog Front End (RF13M)
      10. 6.6.10 ISO/IEC 15693 Decoder/Encoder (RF13M)
      11. 6.6.11 CRC16 Module (CRC16)
      12. 6.6.12 14-Bit Sigma-Delta ADC (SD14)
      13. 6.6.13 Programmable Gain Amplifier (SD14)
      14. 6.6.14 Peripheral Register Map
    7. 6.7 Port Schematics
      1. 6.7.1 Port P1.0 Input/Output
      2. 6.7.2 Port P1.1 Input/Output
      3. 6.7.3 Port P1.2 Input/Output
      4. 6.7.4 Port P1.3 Input/Output
      5. 6.7.5 Port P1.4 Input/Output
      6. 6.7.6 Port P1.5 Input/Output
      7. 6.7.7 Port P1.6 Input/Output
      8. 6.7.8 Port P1.7 Input/Output
    8. 6.8 Device Descriptors (TLV)
  7. 7Applications, Implementation, and Layout
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device and Development Tool Nomenclature
    2. 8.2 Documentation Support
    3. 8.3 Related Links
    4. 8.4 Community Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information

1 Device Overview

1.1 Features

  • ISO/IEC 15693, ISO/IEC 18000-3 (Mode 1) Compliant RF Interface
  • Power Supply System With Either Battery or 13.56-MHz H-Field Supply
  • 14-Bit Sigma-Delta Analog-to-Digital Converter (ADC)
  • Internal Temperature Sensor
  • Resistive Sensor Bias Interface
  • CRC16 CCITT Generator
  • MSP430™ Mixed-Signal Microcontroller
    • 2KB of FRAM
    • 4KB of SRAM
    • 8KB of ROM
    • Supply Voltage Range: 1.45 V to 1.65 V
    • Low Power Consumption
      • Active Mode (AM): 140 µA/MHz (1.5 V)
      • Standby Mode (LPM3): 16 µA
    • 16-Bit RISC Architecture
    • Up to 2-MHz CPU System Clock
    • Compact Clock System
      • 4-MHz High-Frequency Clock
      • 256-kHz Internal Low-Frequency Clock Source
      • External Clock Input
    • 16-Bit Timer_A With Three Capture/Compare Registers
    • LV Port Logic
      • VOL Lower Than 0.15 V at 400 µA
      • VOH Higher Than (VDDB – 0.15 V) at 400 µA
      • Timer_A PWM Signal Available on All Ports
    • eUSCI_B Module Supports 3-Wire and 4-Wire SPI and I2C
    • 32-Bit Watchdog Timer (WDT_A)
    • ROM Development Mode (Map ROM Addresses to SRAM to Enable Firmware Development)
    • Full 4-Wire JTAG Debug Interface
  • For Complete Module Descriptions, See the RF430FRL15xH Family Technical Reference Manual (SLAU506)
  • For Application Operation and Programming, See the RF430FRL15xH Firmware User's Guide (SLAU603)

1.2 Applications

  • Industrial Wireless Sensors
  • Medical Wireless Sensors

1.3 Description

The RF430FRL15xH device is a 13.56-MHz transponder chip with a programmable 16-bit MSP430™ low-power microcontroller. The device features embedded universal FRAM nonvolatile memory for storage of program code or user data such as calibration and measurement data. The RF430FRL15xH supports communication, parameter setting, and configuration through the ISO/IEC 15693, ISO/IEC 18000-3 compliant RFID interface and the SPI or I2C interface. Sensor measurements are supported by the internal temperature sensor and the onboard 14-bit sigma-delta analog-to-digital converter (ADC), and digital sensors can be connected through SPI or I2C.

The RF430FRL15xH device is optimized for operation in fully passive (battery-less) or single-cell battery-powered (semi-active) mode to achieve extended battery life in portable and wireless sensing applications. FRAM is a nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE(2)
RF430FRL152H VQFN (24) 4 mm x 4 mm
RF430FRL153H VQFN (24) 4 mm x 4 mm
RF430FRL154H VQFN (24) 4 mm x 4 mm
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 9, or see the TI web site at www.ti.com.
(2) The sizes shown here are approximations. For the package dimensions with tolerances, see the Mechanical Data in Section 9.

1.4 Functional Block Diagram

Figure 1-1 shows the block diagram of the RF430FRL15xH device.

fbd_rf430frl152h_slas833.gifFigure 1-1 Functional Block Diagram