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MSPM0G3507 LaunchPad Development Kit (LP‑MSPM0G3507)
SLAU873D
January 2023 – October 2024
CONTENTS
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MSPM0G3507 LaunchPad Development Kit (LP‑MSPM0G3507)
1
Abstract
Trademarks
1
Getting Started
1.1
Introduction
1.2
Key Features
1.3
What's Included
1.3.1
Kit Contents
1.3.2
Software Examples
1.4
First Step: Out-of-Box Experience
1.4.1
Connecting to the Computer
1.4.2
Running the Out-of-Box Experience
1.5
Next Steps: Looking Into the Provided Code
2
Hardware
2.1
Jumper Map
2.2
Block Diagram
2.3
Hardware Features
2.3.1
MSPM0G3507 MCU
2.3.2
XDS110-ET Onboard Debug Probe With EnergyTrace Technology
2.3.3
Debug Probe Connection Isolation Jumper Block
2.3.4
Application (or Backchannel) UART
2.3.5
Using an External Debug Probe Instead of the Onboard XDS110-ET
2.3.6
Using the XDS110-ET Debug Probe With a Different Target
2.3.7
Special Features
2.3.7.1
Up to 4-Msps High-Speed Analog-to-Digital Converter
2.3.7.2
Thermistor
2.3.7.3
Light Sensor
2.4
Power
2.4.1
XDS110-ET USB Power
2.5
External Power Supply and BoosterPack Plug-in Module
2.6
Measure Current Draw of the MSPM0 MCU
2.7
Clocking
2.8
BoosterPack Plug-in Module Pinout
3
Software Examples
4
Resources
4.1
Integrated Development Environments
4.1.1
TI Cloud Development Tools
4.1.2
TI Resource Explorer Cloud
4.1.3
Code Composer Studio Cloud
4.1.4
Code Composer Studio IDE
4.2
MSPM0 SDK and TI Resource Explorer
4.3
MSPM0G3507 MCU
4.3.1
Device Documentation
4.3.2
MSPM0G3507 Code Examples
4.4
Community Resources
4.4.1
TI E2E™ Forums
5
Schematics
6
Revision History
IMPORTANT NOTICE
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