Advisories that affect the device's operation, function, or parametrics.

✓ The check mark indicates that the issue is present in the specified revision.

Advisories that affect factory-programmed software.

✓ The check mark indicates that the issue is present in the specified revision.

The device does not have any errata for this category.

Advisories that affect only debug operation.

✓ The check mark indicates that the issue is present in the specified revision.

Advisories that are resolved by compiler workaround. Refer to each advisory for the IDE and compiler versions with a workaround.

✓ The check mark indicates that the issue is present in the specified revision.

Refer to the following MSP430 compiler documentation for more details about the CPU bugs workarounds.

TI MSP430 Compiler Tools (Code Composer Studio IDE)

• MSP430 Optimizing C/C++ Compiler: Check the --silicon_errata option
• MSP430 Assembly Language Tools

MSP430 GNU Compiler (MSP430-GCC)

• MSP430 GCC Options: Check -msilicon-errata= and -msilicon-errata-warn= options
• MSP430 GCC User's Guide

IAR Embedded Workbench

• IAR workarounds for msp430 hardware issues

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS. These prefixes represent evolutionary stages of product development from engineering prototypes (XMS) through fully qualified production devices (MSP).

XMS – Experimental device that is not necessarily representative of the final device's electrical specifications

MSP – Fully qualified production device

Support tool naming prefixes:

X: Development-support product that has not yet completed Texas Instruments internal qualification testing.

null: Fully-qualified development-support product.

XMS devices and X development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature range, package type, and distribution format.

This device does not support reading the hardware revision from memory.

Further guidance on how to locate the TLV structure and read out the HW_ID can be found in the device User's Guide.

Category

Functional

Function

ACLK divider modifications require delay before entering LPM3

Description

After modifying the DIVAx bits, immediately entering LPM3 can cause the modification to be ignored and the divider settings not to take effect. Reading back the DIVAx bits will indicate the intended setting even when the divider has not been correctly applied.

Workaround

When the DIVAx bits are modified, a delay of one complete ACLK (VLO or LFXT1CLK) period must elapse before entering LPM3. The delay is only necessary the first time LPM3 is entered after the DIVAx bits are modified. After the one-period delay, LPM3 may be entered and exited normally without additional delays.