MSP430F6459 Microcontroller
1 Functional Advisories
Advisories that affect the device's operation, function, or parametrics.
✓ The check mark indicates that the issue is present in the specified revision.
2 Preprogrammed Software Advisories
Advisories that affect factory-programmed software.
✓ The check mark indicates that the issue is present in the specified revision.
| Errata Number | Rev B | Rev A |
|---|---|---|
| BSL14 | ✓ | ✓ |
4 Fixed by Compiler Advisories
Advisories that are resolved by compiler workaround. Refer to each advisory for the IDE and compiler versions with a workaround.
✓ The check mark indicates that the issue is present in the specified revision.
Refer to the following MSP430 compiler documentation for more details about the CPU bugs workarounds.
TI MSP430 Compiler Tools (Code Composer Studio IDE)
- MSP430 Optimizing C/C++ Compiler: Check the --silicon_errata option
- MSP430 Assembly Language Tools
MSP430 GNU Compiler (MSP430-GCC)
- MSP430 GCC Options: Check -msilicon-errata= and -msilicon-errata-warn= options
- MSP430 GCC User's Guide
IAR Embedded Workbench
5 Nomenclature, Package Symbolization, and Revision Identification
The revision of the device can be identified by the revision letter on the Package Markings or by the HW_ID located inside the TLV structure of the device.
5.1 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS. These prefixes represent evolutionary stages of product development from engineering prototypes (XMS) through fully qualified production devices (MSP).
XMS – Experimental device that is not necessarily representative of the final device's electrical specifications
MSP – Fully qualified production device
Support tool naming prefixes:
X: Development-support product that has not yet completed Texas Instruments internal qualification testing.
null: Fully-qualified development-support product.
XMS devices and X development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature range, package type, and distribution format.
5.2 Package Markings
ZQW113
BGA (ZQW), 113 Pin
PZ100
LQFP (PZ) 100 Pin
5.3 Memory-Mapped Hardware Revision (TLV Structure)
| Die Revision | TLV Hardware Revision |
|---|---|
| Rev B | 11h |
| Rev A | 10h |
Further guidance on how to locate the TLV structure and read out the HW_ID can be found in the device User's Guide.
6 Advisory Descriptions
6.1 ADC25
ADC Module
Category
Functional
Function
Write to ADC12CTL0 triggers ADC12 when CONSEQ = 00
Description
If ADC conversions are triggered by the Timer_B module and the ADC12 is in single-channel single-conversion mode (CONSEQ = 00), ADC sampling is enabled by write access to any bit(s) in the ADC12CTL0 register. This is contrary to the expected behavior that only the ADC12 enable conversion bit (ADC12ENC) triggers a new ADC12 sample.
Workaround
When operating the ADC12 in CONSEQ=00 and a Timer_B output is selected as the sample and hold source, temporarily clear the ADC12ENC bit before writing to other bits in the ADC12CTL0 register. The following capture trigger can then be re-enabled by setting ADC12ENC = 1.
6.2 ADC42
ADC Module
Category
Functional
Function
ADC stops converting when successive ADC is triggered before the previous conversion ends
Description
Subsequent ADC conversions are halted if a new ADC conversion is triggered while ADC is busy. ADC conversions are triggered manually or by a timer. The affected ADC modes are:
- sequence-of-channels
- repeat-single-channel
- repeat-sequence-of-channels (ADC12CTL1.ADC12CONSEQx)
In addition, the timer overflow flag cannot be used to detect an overflow (ADC12IFGR2.ADC12TOVIFG).
Workaround
1. For manual trigger mode (ADC12CTL0.ADC12SC), ensure each ADC conversion is completed by first checking ADC12CTL1.ADC12BUSY bit before starting a new conversion.
2. For timer trigger mode (ADC12CTL1.ADC12SHP), ensure the timer period is greater than the ADC sample and conversion time.
To recover the conversion halt:
1. Disable ADC module (ADC12CTL0.ADC12ENC = 0 and ADC12CTL0.ADC12ON = 0)
2. Re-enable ADC module (ADC12CTL0.ADC12ON = 1 and ADC12CTL0.ADC12ENC = 1)
3. Re-enable conversion
6.3 ADC69
ADC Module
Category
Functional
Function
ADC stops operating if ADC clock source is changed from SMCLK to another source while SMCLKOFF = 1.
Description
When SMCLK is used as the clock source for the ADC (ADC12CTL1.ADC12SSELx = 11) and CSCTL4.SMCLKOFF = 1, the ADC will stop operating if the ADC clock source is changed by user software (e.g. in the ISR) from SMCLK to a different clock source. This issue appears only for the ADC12CTL1.ADC12DIVx settings /3/5/7. The hang state can be recovered by PUC/POR/BOR/Power cycle.
Workaround
1. Set CSCTL4.SMCLKOFF = 0 before switch ADC clock source.
OR
2. Only use ADC12CTL1.ADC12DIVx as /1, /2, /4, /6, /8