SPRADO8
March
2025
AM62L
-
1
-
Abstract
-
Trademarks
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1 Introduction
- 1.1
User's Guide Usage Guidelines
- 1.1.1
Custom Board Design - Implementation
References
- 1.1.2
Processor Family Specific User's Guide
- 1.1.3
Schematic Design Guidelines
- 1.1.4
Schematic Review Checklist
- 1.1.5
FAQ Reference for User's Guide Usage
Guidelines
- 1.2
List of Processors
- 1.2.1
AM62Lx Processor Family
-
2 Related Collaterals
- 2.1
Links to Commonly Available and Applicable Collaterals
- 2.2
Hardware Design Considerations for Custom Board Design
-
3 Processor Selection
- 3.1
AM62Lx Processor Family Change Summary (With Respect to AM62x Processor Family)
- 3.2
Data Sheet Use Case and Version Referenced
- 3.3
Processor Selection (OPN Orderable Part
Number)
- 3.4
Peripheral Instance Naming Convention
- 3.5
Unused Peripherals
- 3.6
Processor Ordering and Quality
- 3.7
Processor Selection Checklist
-
4 Power Architecture
- 4.1
Generating Supply Rails
- 4.1.1
AM62Lx
- 4.1.1.1
Power Management IC (PMIC)
- 4.1.1.1.1
PMIC Based Power Architecture Checklist for
TPS65214x
- 4.1.1.1.2
Additional References
- 4.1.1.2
Discrete Power
- 4.1.1.2.1
DC/DC Converter
- 4.1.1.2.2
LDO
- 4.1.1.2.3
Discrete Power Checklist
- 4.2
Power Control and Circuit
Protection
- 4.2.1
Load Switch (Power Switching)
- 4.2.1.1
Load Switch Checklist
- 4.2.2
eFuse IC (Power Switching and
Protection)
-
5 General Recommendations
- 5.1
Processor Performance Evaluation Module (EVM)
- 5.1.1
Evaluation Module Checklist
- 5.2
Processor-Specific EVM Versus Data
Sheet
- 5.2.1
Notes About Component Selection
- 5.2.1.1
Series Resistor
- 5.2.1.2
Parallel Pull Resistor
- 5.2.1.3
Drive Strength Configuration
- 5.2.1.4
Data Sheet Recommendations
- 5.2.1.5
Processor IOs - External ESD
Protection
- 5.2.1.6
Peripheral Clock Output Series
Resistor
- 5.2.1.7
Component Selection Checklist
- 5.2.2
Additional Information Regarding Reuse of EVM
Design
- 5.2.2.1
Updated EVM Schematic With Design, Review and CAD Notes Added
- 5.2.2.2
EVM Design Files Reuse
- 5.2.2.2.1
Modular Schematic Sections
- 5.2.2.2.2
Reuse of EVM Design Checklist
- 5.3
Before Beginning the Design
- 5.3.1
Documentation
- 5.3.2
Processor Pin Attributes (Pinout) Verification
- 5.3.3
Device Comparison, IOSET and Voltage Conflict
- 5.3.4
RSVD Reserved Pin (Signal)
- 5.3.5
Note on PADCONFIG Registers
- 5.3.6
Processor IO (Signal) Isolation for
Fail-Safe Operation
- 5.3.7
Reference to Processor-Specific EVM
- 5.3.8
High-Speed Interface Design Guidelines
- 5.3.9
Recommended Current Source or Sink for LVCMOS (GPIO) Outputs
- 5.3.10
Connection of Slow Ramp Inputs or Capacitors to LVCMOS IOs (Inputs or Outputs)
- 5.3.11
Queries and Clarifications Related to Processor During Custom Board Design
- 5.3.12
Before Beginning the Design Checklist
- 5.3.13
Device Recommendations
-
6 Processor-Specific Recommendations
- 6.1
Common (Processor Start-Up)
Connection
- 6.1.1
Power Supply
- 6.1.1.1
Supply for Core and Peripherals
- 6.1.1.1.1
Power Supply Ramp (Slew Rate) Requirement and
Dynamic Voltage Scaling / Change
- 6.1.1.1.2
AM62Lx
- 6.1.1.1.3
Additional Information
- 6.1.1.1.4
Processor Core and Peripheral Core Power
Supply Checklist
- 6.1.1.1.5
Peripheral Analog Power Supply
Checklist
- 6.1.1.2
IO Supply for IO Groups
- 6.1.1.2.1
Dual-voltage 1.8V/3.3V IO Supply for IO
Groups
- 6.1.1.2.1.1
Dual-voltage IO Supply for IO Groups Checklist
- 6.1.1.2.2
Fixed-voltage 1.8V IO Supply for (Peripheral)
IO Groups
- 6.1.1.2.2.1
Fixed-voltage 1.8V IO Supply for (Peripheral)
IO Groups Checklist
- 6.1.1.2.3
Additional Information
- 6.1.1.3
Supply for VPP (eFuse ROM Programming)
- 6.1.1.3.1
VPP Checklist
- 6.1.1.4
Supply Connection for Configuring Low-Power
Modes
- 6.1.1.4.1
RTC Only Low-power Mode
- 6.1.1.4.1.1
RTC Only Mode Used
- 6.1.1.4.1.1.1
RTC_PORz Delay When RTC Only Mode is
Used
- 6.1.1.4.1.1.2
EVM Implementation of RTC Only Mode Power
Supply Architecture
- 6.1.1.4.1.2
RTC Only Mode Not Used
- 6.1.1.4.1.2.1
32kHz LFOSC0 Clock When RTC Mode is not
Used
- 6.1.1.4.1.3
RTC Only Low-power Mode Checklist
- 6.1.1.4.2
RTC + IO + DDR Self-refresh Low-power Mode
- 6.1.1.4.2.1
RTC + IO + DDR Self-refresh Mode Used
- 6.1.1.4.2.2
RTC + IO + DDR Self-refresh Mode Not
Used
- 6.1.1.4.2.3
RTC + IO + DDR Self-refresh Low-power Mode
Checklist
- 6.1.1.4.3
DeepSleep, Standby
- 6.1.1.5
Additional Information
- 6.1.2
Capacitors for Supply Rails
- 6.1.2.1
AM62Lx
- 6.1.2.2
Additional Information
- 6.1.2.2.1
AM62Lx
- 6.1.2.3
Capacitors for Supply Rails Checklist
- 6.1.3
Processor Clock
- 6.1.3.1
Clock Inputs
- 6.1.3.1.1
High Frequency Oscillator (WKUP_OSC0_XI / WKUP_OSC0_XO)
- 6.1.3.1.2
Low Frequency Oscillator (LFOSC0_XI,
LFOSC0_XO)
- 6.1.3.1.3
EXT_REFCLK1 (External Clock Input to Main Domain)
- 6.1.3.1.4
Additional Information
- 6.1.3.1.5
Clock Input Checklist - WKUP_OSC0
- 6.1.3.1.6
Clock Input Checklist - LFOSC0
- 6.1.3.2
Clock Outputs
- 6.1.3.2.1
Clock Output Checklist
- 6.1.4
Processor Reset
- 6.1.4.1
External Reset Inputs
- 6.1.4.2
Reset Status Outputs
- 6.1.4.3
Additional Information
- 6.1.4.4
Processor Reset Input Checklist
- 6.1.4.5
Processor Reset Status Output
Checklist
- 6.1.5
Configuration of Boot Modes for
Processor
- 6.1.5.1
Processor Boot Mode Inputs Isolation Buffers Use Case and Optimization
- 6.1.5.2
Boot Mode Selection
- 6.1.5.2.1
Notes for USB Boot Mode
- 6.1.5.3
Boot Mode Implementation Approaches
- 6.1.5.4
Additional Information
- 6.1.5.5
Configuration of Boot Modes (for Processor) Checklist
- 6.2
Board Debug Using JTAG and EMU
- 6.2.1
JTAG and EMU Used
- 6.2.2
JTAG and EMU Not Used
- 6.2.3
Additional Information
- 6.2.4
Board Debug Using JTAG and EMU Checklist
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7 Processor Peripherals
- 7.1
Supply Connections for IO Supply for IO Groups
- 7.1.1
Dual-voltage IO Supplies and Fixed-voltage Supplies for IO Groups
- 7.1.2
Fixed 1.8V
- 7.1.3
Supply Connections for IO Supply for IO Groups Checklist
- 7.2
Memory Interface (DDRSS (DDR4/LPDDR4), MMCSD
(eMMC/SD/SDIO), OSPI/QSPI and GPMC)
- 7.2.1
DDR Subsystem (DDRSS)
- 7.2.1.1
DDR4 SDRAM (Double Data Rate 4 Synchronous
Dynamic Random-Access Memory)
- 7.2.1.1.1
AM62Lx
- 7.2.1.1.1.1
Memory Interface Configuration
- 7.2.1.1.1.2
Routing Topology and Terminations
- 7.2.1.1.1.3
Resistors for Control and
Calibration
- 7.2.1.1.1.4
Capacitors for the Power Supply
Rails
- 7.2.1.1.1.5
Data Bit or Byte Swapping
- 7.2.1.1.1.6
VTT Termination Schematics Reference
- 7.2.1.1.1.7
DDR4 Implementation Checklist
- 7.2.1.2
LPDDR4 SDRAM (Low-Power Double Data Rate 4
Synchronous Dynamic Random-Access Memory)
- 7.2.1.2.1
AM62Lx
- 7.2.1.2.1.1
Memory Interface Configuration
- 7.2.1.2.1.2
Routing Topology and Terminations
- 7.2.1.2.1.3
Resistors for Control and
Calibration
- 7.2.1.2.1.4
Capacitors for the Power Supply
Rails
- 7.2.1.2.1.5
Data Bit or Byte Swapping
- 7.2.1.2.1.6
LPDDR4 Implementation Checklist
- 7.2.2
Multi-Media Card/Secure Digital (MMCSD)
- 7.2.2.1
MMC0 - eMMC (Embedded Multi-Media Card) Interface
- 7.2.2.1.1
AM62Lx
- 7.2.2.1.1.1
IO Power Supply
- 7.2.2.1.1.2
eMMC (Attached Device) Reset
- 7.2.2.1.1.3
Signals Connection
- 7.2.2.1.1.4
Capacitors for the Power Supply
Rails
- 7.2.2.1.1.5
MMC0 (eMMC) Checklist
- 7.2.2.1.2
Additional Information on eMMC PHY
- 7.2.2.1.3
MMC0 – SD (Secure Digital) Card Interface
- 7.2.2.2
MMC1/MMC2 – SD (Secure Digital) Card Interface
- 7.2.2.2.1
IO Power Supply
- 7.2.2.2.2
SD Card Supply Reset and Boot Configuration
- 7.2.2.2.3
Signals Connection
- 7.2.2.2.4
ESD Protection
- 7.2.2.2.5
Capacitors for the Power Supply Rails
- 7.2.2.2.6
MMC1 SD Card Interface Checklist
- 7.2.2.3
MMC1 / MMC2 SDIO (Embedded) Interface
- 7.2.2.3.1
IO Power Supply
- 7.2.2.3.2
Signals Connection
- 7.2.2.3.3
MMC2 SDIO (Embedded) Interface Checklist
- 7.2.2.4
Additional Information
- 7.2.3
Octal Serial Peripheral Interface (OSPI) or Quad Serial Peripheral Interface (QSPI)
- 7.2.3.1
OSPI0 Interfaced to Single Device
- 7.2.3.1.1
IO Power Supply
- 7.2.3.1.2
OSPI or QSPI Device Reset
- 7.2.3.1.3
Signals Connection
- 7.2.3.1.4
Loopback Clock
- 7.2.3.2
Interfaced to x2 Devices
- 7.2.3.3
Capacitors for the Power Supply
Rails
- 7.2.3.4
OSPI or QSPI Interface Implementation Checklist
- 7.2.4
General-Purpose Memory Controller
(GPMC)
- 7.2.4.1
IO Power Supply
- 7.2.4.2
GPMC Interface
- 7.2.4.3
Memory (Attached Device) Reset
- 7.2.4.4
Signals Connection
- 7.2.4.4.1
GPMC NAND
- 7.2.4.5
Capacitors for the Power Supply
Rails
- 7.2.4.6
GPMC Interface Checklist
- 7.3
External Communication Interface (Ethernet (CPSW3G0), USB2.0, UART and MCAN)
- 7.3.1
Ethernet Interface Using CPSW3G0 (Common Platform Ethernet Switch 3-Port Gigabit)
- 7.3.1.1
IO Power Supply
- 7.3.1.2
Ethernet PHY Reset
- 7.3.1.3
Ethernet PHY Pin Strapping
- 7.3.1.4
Ethernet PHY (and MAC) Operation and Media
Independent Interface (MII) Clock
- 7.3.1.4.1
Crystal
- 7.3.1.4.2
Oscillator
- 7.3.1.4.3
Processor Clock Output (CLKOUT0)
- 7.3.1.5
MAC (Data, Control and Clock) Interface
Signals Connection
- 7.3.1.6
External Interrupt (EXTINTn)
- 7.3.1.6.1
External Interrupt (EXTINTn) Checklist
- 7.3.1.7
MAC (Media Access Controller) to MAC
Interface
- 7.3.1.8
MDIO (Management Data Input/Output) Interface
- 7.3.1.9
Ethernet MDI (Medium Dependent Interface)
Including Magnetics
- 7.3.1.10
Capacitors for the Power Supply
Rails
- 7.3.1.11
Ethernet Interface Checklist
- 7.3.2
Universal Serial Bus (USB2.0)
- 7.3.2.1
USBn (n = 0-1) Used
- 7.3.2.1.1
USB Host Interface
- 7.3.2.1.2
USB Device Interface
- 7.3.2.1.3
USB Dual-Role-Device Interface
- 7.3.2.1.4
USB Type-C®
- 7.3.2.2
USBn (n = 0-1) Not Used
- 7.3.2.3
Additional Information
- 7.3.2.4
USB Interface Checklist
- 7.3.3
Universal Asynchronous Receiver/Transmitter (UART)
- 7.3.3.1
Universal Asynchronous Receiver/Transmitter (UART) Checklist
- 7.3.4
Modular Controller Area Network (MCAN)
- 7.3.4.1
Modular Controller Area Network Checklist
- 7.4
On-board Synchronous Communication Interface
(MCSPI, MCASP and I2C)
- 7.4.1
Multichannel Serial Peripheral Interface (MCSPI) and Multichannel Audio Serial Ports (MCASP)
- 7.4.1.1
MCSPI Checklist
- 7.4.1.2
MCASP Checklist
- 7.4.2
Inter-Integrated Circuit (I2C)
- 7.4.2.1
I2C (Open-drain Output Type Buffer) Interface
Checklist
- 7.4.2.2
I2C (Emulated Open-drain Output Type Buffer)
Interface Checklist
- 7.5
User Interface (DPI, DSI), GPIO and Hardware
Diagnostics
- 7.5.1
Display Subsystem
- 7.5.1.1
Display Parallel Interface (DPI)
- 7.5.1.1.1
AM62Lx
- 7.5.1.1.1.1
IO Power Supply
- 7.5.1.1.1.2
DPI (Attached Device) Reset
- 7.5.1.1.1.3
Connection
- 7.5.1.1.1.4
Signals Connection
- 7.5.1.1.1.5
Capacitors for the Power Supply
Rails
- 7.5.1.1.1.6
DPI (VOUT0) Checklist
- 7.5.1.2
Display Serial Interface (DSI)
- 7.5.1.2.1
AM62Lx
- 7.5.1.2.1.1
DSITX0 Used
- 7.5.1.2.1.1.1
DSITX0 Checklist
- 7.5.1.2.1.2
DSITX0 Not Used
- 7.5.2
General Purpose Input and Output
(GPIO)
- 7.5.2.1
Availability of CLKOUT on Processor
GPIO
- 7.5.2.2
Connection and External Buffering
- 7.5.2.3
Additional Information
- 7.5.2.4
GPIO Checklist
- 7.5.3
On-board Hardware Diagnostics
- 7.5.3.1
Internal Temperature Monitoring
- 7.6
Analog to Digital Converter (ADC)
- 7.6.1
ADC0 Used
- 7.6.2
ADC0 Not Used
- 7.6.3
ADC0 Checklist
- 7.7
Verifying Board Level Design
Issues
- 7.7.1
Processor Pin Configuration Using PinMux Tool
- 7.7.2
Schematics Configurations
- 7.7.3
Connecting Supply Rails to Pullups
- 7.7.4
Peripheral (Subsystem) Clock Outputs
- 7.7.5
General Board Bring-up and Debug
- 7.7.5.1
Clock Output for Board Bring-Up, Test, or
Debug
- 7.7.5.2
Additional Information
- 7.7.5.3
General Board Bring-up and Debug Checklist
-
8 Self-Review of the Custom Board Schematics Design
-
9 Layout Notes (Added on the Schematic)
- 9.1
Layout Checklist
-
10Custom Board Design Simulation
-
11Additional References
- 11.1
FAQ Covering AM6xx Processor Family
- 11.2
FAQs - Processor Product Family Wise and Sitara Processor Families
- 11.3
Processor Attached Devices
-
12Summary
-
13Terminology
User's Guide
AM62L (AM62L32, AM62L31) Processor Family Schematic Design Guidelines and Schematic Review Checklist