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  • TMS320F2837xD Dual-Core Real-Time Microcontrollers

    • SPRS880P December   2013  – February 2024 TMS320F28374D , TMS320F28375D , TMS320F28376D , TMS320F28377D , TMS320F28377D-Q1 , TMS320F28378D , TMS320F28379D , TMS320F28379D-Q1

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  • TMS320F2837xD Dual-Core Real-Time Microcontrollers
  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Signal Descriptions
      1. 5.2.1 Signal Descriptions
    3. 5.3 Pins With Internal Pullup and Pulldown
    4. 5.4 Pin Multiplexing
      1. 5.4.1 GPIO Muxed Pins
      2. 5.4.2 Input X-BAR
      3. 5.4.3 Output X-BAR and ePWM X-BAR
      4. 5.4.4 USB Pin Muxing
      5. 5.4.5 High-Speed SPI Pin Muxing
    5. 5.5 Connections for Unused Pins
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings – Commercial
    3. 6.3  ESD Ratings – Automotive
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Consumption Summary
      1. 6.5.1 Device Current Consumption at 200-MHz SYSCLK
      2. 6.5.2 Current Consumption Graphs
      3. 6.5.3 Reducing Current Consumption
    6. 6.6  Electrical Characteristics
    7. 6.7  Thermal Resistance Characteristics
      1. 6.7.1 ZWT Package
      2. 6.7.2 PTP Package
      3. 6.7.3 PZP Package
    8. 6.8  Thermal Design Considerations
    9. 6.9  System
      1. 6.9.1  Power Sequencing
        1. 6.9.1.1 Signal Pin Requirements
        2. 6.9.1.2 VDDIO, VDDA, VDD3VFL, and VDDOSC Requirements
        3. 6.9.1.3 VDD Requirements
        4. 6.9.1.4 Supply Ramp Rate
          1. 6.9.1.4.1 Supply Ramp Rate
        5. 6.9.1.5 Supply Supervision
      2. 6.9.2  Reset Timing
        1. 6.9.2.1 Reset Sources
        2. 6.9.2.2 Reset Electrical Data and Timing
          1. 6.9.2.2.1 Reset ( XRS) Timing Requirements
          2. 6.9.2.2.2 Reset ( XRS) Switching Characteristics
      3. 6.9.3  Clock Specifications
        1. 6.9.3.1 Clock Sources
        2. 6.9.3.2 Clock Frequencies, Requirements, and Characteristics
          1. 6.9.3.2.1 Input Clock Frequency and Timing Requirements, PLL Lock Times
            1. 6.9.3.2.1.1 Input Clock Frequency
            2. 6.9.3.2.1.2 X1 Input Level Characteristics When Using an External Clock Source (Not a Crystal)
            3. 6.9.3.2.1.3 XTAL Oscillator Characteristics
            4. 6.9.3.2.1.4 X1 Timing Requirements
            5. 6.9.3.2.1.5 AUXCLKIN Timing Requirements
            6. 6.9.3.2.1.6 PLL Lock Times
          2. 6.9.3.2.2 Internal Clock Frequencies
            1. 6.9.3.2.2.1 Internal Clock Frequencies
          3. 6.9.3.2.3 Output Clock Frequency and Switching Characteristics
            1. 6.9.3.2.3.1 Output Clock Frequency
            2. 6.9.3.2.3.2 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
        3. 6.9.3.3 Input Clocks and PLLs
        4. 6.9.3.4 XTAL Oscillator
          1. 6.9.3.4.1 Introduction
          2. 6.9.3.4.2 Overview
            1. 6.9.3.4.2.1 Electrical Oscillator
              1. 6.9.3.4.2.1.1 Modes of Operation
                1. 6.9.3.4.2.1.1.1 Crystal Mode of Operation
                2. 6.9.3.4.2.1.1.2 Single-Ended Mode of Operation
              2. 6.9.3.4.2.1.2 XTAL Output on XCLKOUT
            2. 6.9.3.4.2.2 Quartz Crystal
          3. 6.9.3.4.3 Functional Operation
            1. 6.9.3.4.3.1 ESR – Effective Series Resistance
            2. 6.9.3.4.3.2 Rneg – Negative Resistance
            3. 6.9.3.4.3.3 Start-up Time
            4. 6.9.3.4.3.4 DL – Drive Level
          4. 6.9.3.4.4 How to Choose a Crystal
          5. 6.9.3.4.5 Testing
          6. 6.9.3.4.6 Common Problems and Debug Tips
          7. 6.9.3.4.7 Crystal Oscillator Specifications
            1. 6.9.3.4.7.1 Crystal Oscillator Electrical Characteristics
            2. 6.9.3.4.7.2 Crystal Equivalent Series Resistance (ESR) Requirements
        5. 6.9.3.5 Internal Oscillators
          1. 6.9.3.5.1 Internal Oscillator Electrical Characteristics
      4. 6.9.4  Flash Parameters
        1. 6.9.4.1 Flash Parameters
      5. 6.9.5  RAM Specifications
      6. 6.9.6  ROM Specifications
      7. 6.9.7  Emulation/JTAG
        1. 6.9.7.1 JTAG Electrical Data and Timing
          1. 6.9.7.1.1 JTAG Timing Requirements
          2. 6.9.7.1.2 JTAG Switching Characteristics
      8. 6.9.8  GPIO Electrical Data and Timing
        1. 6.9.8.1 GPIO - Output Timing
          1. 6.9.8.1.1 General-Purpose Output Switching Characteristics
        2. 6.9.8.2 GPIO - Input Timing
          1. 6.9.8.2.1 General-Purpose Input Timing Requirements
        3. 6.9.8.3 Sampling Window Width for Input Signals
      9. 6.9.9  Interrupts
        1. 6.9.9.1 External Interrupt (XINT) Electrical Data and Timing
          1. 6.9.9.1.1 External Interrupt Timing Requirements
          2. 6.9.9.1.2 External Interrupt Switching Characteristics
      10. 6.9.10 Low-Power Modes
        1. 6.9.10.1 Clock-Gating Low-Power Modes
        2. 6.9.10.2 Power-Gating Low-Power Modes
        3. 6.9.10.3 Low-Power Mode Wakeup Timing
          1. 6.9.10.3.1 IDLE Mode Timing Requirements
          2. 6.9.10.3.2 IDLE Mode Switching Characteristics
          3. 6.9.10.3.3 STANDBY Mode Timing Requirements
          4. 6.9.10.3.4 STANDBY Mode Switching Characteristics
          5. 6.9.10.3.5 HALT Mode Timing Requirements
          6. 6.9.10.3.6 HALT Mode Switching Characteristics
          7. 6.9.10.3.7 HIBERNATE Mode Timing Requirements
          8. 6.9.10.3.8 HIBERNATE Mode Switching Characteristics
      11. 6.9.11 External Memory Interface (EMIF)
        1. 6.9.11.1 Asynchronous Memory Support
        2. 6.9.11.2 Synchronous DRAM Support
        3. 6.9.11.3 EMIF Electrical Data and Timing
          1. 6.9.11.3.1 Asynchronous RAM
            1. 6.9.11.3.1.1 EMIF Asynchronous Memory Timing Requirements
            2. 6.9.11.3.1.2 EMIF Asynchronous Memory Switching Characteristics
          2. 6.9.11.3.2 Synchronous RAM
            1. 6.9.11.3.2.1 EMIF Synchronous Memory Timing Requirements
            2. 6.9.11.3.2.2 EMIF Synchronous Memory Switching Characteristics
    10. 6.10 Analog Peripherals
      1. 6.10.1 Analog-to-Digital Converter (ADC)
        1. 6.10.1.1 ADC Configurability
          1. 6.10.1.1.1 Signal Mode
        2. 6.10.1.2 ADC Electrical Data and Timing
          1. 6.10.1.2.1 ADC Operating Conditions (16-Bit Differential Mode)
          2. 6.10.1.2.2 ADC Characteristics (16-Bit Differential Mode)
          3. 6.10.1.2.3 ADC Operating Conditions (12-Bit Single-Ended Mode)
          4. 6.10.1.2.4 ADC Characteristics (12-Bit Single-Ended Mode)
          5. 6.10.1.2.5 ADCEXTSOC Timing Requirements
          6. 6.10.1.2.6 ADC Input Models
            1. 6.10.1.2.6.1 Differential Input Model Parameters
            2. 6.10.1.2.6.2 Single-Ended Input Model Parameters
          7. 6.10.1.2.7 ADC Timing Diagrams
            1. 6.10.1.2.7.1 ADC Timings in 12-Bit Mode (SYSCLK Cycles)
            2. 6.10.1.2.7.2 ADC Timings in 16-Bit Mode
        3. 6.10.1.3 Temperature Sensor Electrical Data and Timing
          1. 6.10.1.3.1 Temperature Sensor Electrical Characteristics
      2. 6.10.2 Comparator Subsystem (CMPSS)
        1. 6.10.2.1 CMPSS Electrical Data and Timing
          1. 6.10.2.1.1 Comparator Electrical Characteristics
          2. 6.10.2.1.2 CMPSS DAC Static Electrical Characteristics
      3. 6.10.3 Buffered Digital-to-Analog Converter (DAC)
        1. 6.10.3.1 Buffered DAC Electrical Data and Timing
          1. 6.10.3.1.1 Buffered DAC Electrical Characteristics
        2. 6.10.3.2 CMPSS DAC Dynamic Error
    11. 6.11 Control Peripherals
      1. 6.11.1 Enhanced Capture (eCAP)
        1. 6.11.1.1 eCAP Electrical Data and Timing
          1. 6.11.1.1.1 eCAP Timing Requirement
          2. 6.11.1.1.2 eCAP Switching Characteristics
      2. 6.11.2 Enhanced Pulse Width Modulator (ePWM)
        1. 6.11.2.1 Control Peripherals Synchronization
        2. 6.11.2.2 ePWM Electrical Data and Timing
          1. 6.11.2.2.1 ePWM Timing Requirements
          2. 6.11.2.2.2 ePWM Switching Characteristics
          3. 6.11.2.2.3 Trip-Zone Input Timing
            1. 6.11.2.2.3.1 Trip-Zone Input Timing Requirements
        3. 6.11.2.3 External ADC Start-of-Conversion Electrical Data and Timing
          1. 6.11.2.3.1 External ADC Start-of-Conversion Switching Characteristics
      3. 6.11.3 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 6.11.3.1 eQEP Electrical Data and Timing
          1. 6.11.3.1.1 eQEP Timing Requirements
          2. 6.11.3.1.2 eQEP Switching Characteristics
      4. 6.11.4 High-Resolution Pulse Width Modulator (HRPWM)
        1. 6.11.4.1 HRPWM Electrical Data and Timing
          1. 6.11.4.1.1 High-Resolution PWM Timing Requirements
          2. 6.11.4.1.2 High-Resolution PWM Characteristics
      5. 6.11.5 Sigma-Delta Filter Module (SDFM)
        1. 6.11.5.1 SDFM Electrical Data and Timing (Using ASYNC)
          1. 6.11.5.1.1 SDFM Timing Requirements When Using Asynchronous GPIO (ASYNC) Option
        2. 6.11.5.2 SDFM Electrical Data and Timing (Using 3-Sample GPIO Input Qualification)
          1. 6.11.5.2.1 SDFM Timing Requirements When Using GPIO Input Qualification (3-Sample Window) Option
    12. 6.12 Communications Peripherals
      1. 6.12.1 Controller Area Network (CAN)
      2. 6.12.2 Inter-Integrated Circuit (I2C)
        1. 6.12.2.1 I2C Electrical Data and Timing
          1. 6.12.2.1.1 I2C Timing Requirements
          2. 6.12.2.1.2 I2C Switching Characteristics
          3. 6.12.2.1.3 I2C Timing Diagram
      3. 6.12.3 Multichannel Buffered Serial Port (McBSP)
        1. 6.12.3.1 McBSP Electrical Data and Timing
          1. 6.12.3.1.1 McBSP Transmit and Receive Timing
            1. 6.12.3.1.1.1 McBSP Timing Requirements
            2. 6.12.3.1.1.2 McBSP Switching Characteristics
          2. 6.12.3.1.2 McBSP as SPI Master or Slave Timing
            1. 6.12.3.1.2.1 McBSP as SPI Master Timing Requirements
            2. 6.12.3.1.2.2 McBSP as SPI Master Switching Characteristics
            3. 6.12.3.1.2.3 McBSP as SPI Slave Timing Requirements
            4. 6.12.3.1.2.4 McBSP as SPI Slave Switching Characteristics
      4. 6.12.4 Serial Communications Interface (SCI)
      5. 6.12.5 Serial Peripheral Interface (SPI)
        1. 6.12.5.1 SPI Electrical Data and Timing
          1. 6.12.5.1.1 SPI Master Mode Timings
            1. 6.12.5.1.1.1 SPI Master Mode Timing Requirements
            2. 6.12.5.1.1.2 SPI Master Mode Switching Characteristics (Clock Phase = 0)
            3. 6.12.5.1.1.3 SPI Master Mode Switching Characteristics (Clock Phase = 1)
          2. 6.12.5.1.2 SPI Slave Mode Timings
            1. 6.12.5.1.2.1 SPI Slave Mode Timing Requirements
            2. 6.12.5.1.2.2 SPI Slave Mode Switching Characteristics
      6. 6.12.6 Universal Serial Bus (USB) Controller
        1. 6.12.6.1 USB Electrical Data and Timing
          1. 6.12.6.1.1 USB Input Ports DP and DM Timing Requirements
          2. 6.12.6.1.2 USB Output Ports DP and DM Switching Characteristics
      7. 6.12.7 Universal Parallel Port (uPP) Interface
        1. 6.12.7.1 uPP Electrical Data and Timing
          1. 6.12.7.1.1 uPP Timing Requirements
          2. 6.12.7.1.2 uPP Switching Characteristics
  8. 7 Detailed Description
    1. 7.1  Overview
    2. 7.2  Functional Block Diagram
    3. 7.3  Memory
      1. 7.3.1 C28x Memory Map
      2. 7.3.2 Flash Memory Map
      3. 7.3.3 EMIF Chip Select Memory Map
      4. 7.3.4 Peripheral Registers Memory Map
      5. 7.3.5 Memory Types
        1. 7.3.5.1 Dedicated RAM (Mx and Dx RAM)
        2. 7.3.5.2 Local Shared RAM (LSx RAM)
        3. 7.3.5.3 Global Shared RAM (GSx RAM)
        4. 7.3.5.4 CPU Message RAM (CPU MSGRAM)
        5. 7.3.5.5 CLA Message RAM (CLA MSGRAM)
    4. 7.4  Identification
    5. 7.5  Bus Architecture – Peripheral Connectivity
    6. 7.6  C28x Processor
      1. 7.6.1 Floating-Point Unit
      2. 7.6.2 Trigonometric Math Unit
      3. 7.6.3 Viterbi, Complex Math, and CRC Unit II (VCU-II)
    7. 7.7  Control Law Accelerator
    8. 7.8  Direct Memory Access
    9. 7.9  Interprocessor Communication Module
    10. 7.10 Boot ROM and Peripheral Booting
      1. 7.10.1 EMU Boot or Emulation Boot
      2. 7.10.2 WAIT Boot Mode
      3. 7.10.3 Get Mode
      4. 7.10.4 Peripheral Pins Used by Bootloaders
    11. 7.11 Dual Code Security Module
    12. 7.12 Timers
    13. 7.13 Nonmaskable Interrupt With Watchdog Timer (NMIWD)
    14. 7.14 Watchdog
    15. 7.15 Configurable Logic Block (CLB)
    16. 7.16 Functional Safety
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Application and Implementation
    2. 8.2 Key Device Features
    3. 8.3 Application Information
      1. 8.3.1 Typical Application
        1. 8.3.1.1 Servo Drive Control Module
          1. 8.3.1.1.1 System Block Diagram
          2. 8.3.1.1.2 Servo Drive Control Module Resources
        2. 8.3.1.2 Solar Micro Inverter
          1. 8.3.1.2.1 System Block Diagram
          2. 8.3.1.2.2 Solar Micro Inverter Resources
        3. 8.3.1.3 On-Board Charger (OBC)
          1. 8.3.1.3.1 System Block Diagram
          2. 8.3.1.3.2 OBC Resources
        4. 8.3.1.4 EV Charging Station Power Module
          1. 8.3.1.4.1 System Block Diagram
          2. 8.3.1.4.2 EV Charging Station Power Module Resources
        5. 8.3.1.5 High-Voltage Traction Inverter
          1. 8.3.1.5.1 System Block Diagram
          2. 8.3.1.5.2 High-Voltage Traction Inverter Resources
  10. 9 Device and Documentation Support
    1. 9.1 Device and Development Support Tool Nomenclature
    2. 9.2 Markings
    3. 9.3 Tools and Software
    4. 9.4 Documentation Support
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information
  13. IMPORTANT NOTICE
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Data Sheet

TMS320F2837xD Dual-Core Real-Time Microcontrollers

1 Features

  • Dual-core architecture
    • Two TMS320C28x 32-bit CPUs
    • 200MHz
    • IEEE 754 single-precision Floating-Point Unit (FPU)
    • Trigonometric Math Unit (TMU)
    • Viterbi/Complex Math Unit (VCU-II)
  • Two programmable Control Law Accelerators (CLAs)
    • 200MHz
    • IEEE 754 single-precision floating-point instructions
    • Executes code independently of main CPU
  • On-chip memory
    • 512KB (256KW) or 1MB (512KW) of flash (ECC-protected)
    • 172KB (86KW) or 204KB (102KW) of RAM (ECC-protected or parity-protected)
    • Dual-zone security supporting third-party development
    • Unique identification number
  • Clock and system control
    • Two internal zero-pin 10MHz oscillators
    • On-chip crystal oscillator
    • Windowed watchdog timer module
    • Missing clock detection circuitry
  • 1.2V core, 3.3V I/O design
  • System peripherals
    • Two External Memory Interfaces (EMIFs) with ASRAM and SDRAM support
    • Dual 6-channel Direct Memory Access (DMA) controllers
    • Up to 169 individually programmable, multiplexed General-Purpose Input/Output (GPIO) pins with input filtering
    • Expanded Peripheral Interrupt controller (ePIE)
    • Multiple Low-Power Mode (LPM) support with external wakeup
  • Communications peripherals
    • USB 2.0 (MAC + PHY)
    • Support for 12-pin 3.3V-compatible Universal Parallel Port (uPP) interface
    • Two Controller Area Network (CAN) modules (pin-bootable)
    • Three high-speed (up to 50MHz) SPI ports (pin-bootable)
    • Two Multichannel Buffered Serial Ports (McBSPs)
    • Four Serial Communications Interfaces (SCI/UART) (pin-bootable)
    • Two I2C interfaces (pin-bootable)
  • Analog subsystem
    • Up to four Analog-to-Digital Converters (ADCs)
      • 16-bit mode
        • 1.1MSPS each (up to 4.4MSPS system throughput)
        • Differential inputs
        • Up to 12 external channels
      • 12-bit mode
        • 3.5MSPS each (up to 14MSPS system throughput)
        • Single-ended inputs
        • Up to 24 external channels
      • Single Sample-and-Hold (S/H) on each ADC
      • Hardware-integrated post-processing of ADC conversions
        • Saturating offset calibration
        • Error from setpoint calculation
        • High, low, and zero-crossing compare, with interrupt capability
        • Trigger-to-sample delay capture
    • Eight windowed comparators with 12-bit Digital-to-Analog Converter (DAC) references
    • Three 12-bit buffered DAC outputs
  • Enhanced control peripherals
    • 24 Pulse Width Modulator (PWM) channels with enhanced features
    • 16 High-Resolution Pulse Width Modulator (HRPWM) channels
      • High resolution on both A and B channels of 8 PWM modules
      • Dead-band support (on both standard and high resolution)
    • Six Enhanced Capture (eCAP) modules
    • Three Enhanced Quadrature Encoder Pulse (eQEP) modules
    • Eight Sigma-Delta Filter Module (SDFM) input channels, 2 parallel filters per channel
      • Standard SDFM data filtering
      • Comparator filter for fast action for out of range
  • Configurable Logic Block (CLB)
    • Augments existing peripheral capability
    • Supports position manager solutions
  • Functional Safety-Compliant
    • Developed for functional safety applications
    • Documentation available to aid ISO 26262 system design up to ASIL D; IEC 61508 up to SIL 3; IEC 60730 up to Class C; and UL 1998 up to Class 2
    • Hardware integrity up to ASIL B, SIL 2
  • Safety-related certification
    • ISO 26262 certified up to ASIL B and IEC 61508 certified up to SIL 2 by TUV SUD
  • Package options:
    • Lead-free, green packaging
    • 337-ball New Fine Pitch Ball Grid Array (nFBGA) [ZWT suffix]
    • 176-pin PowerPAD™ Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) [PTP suffix]
    • 100-pin PowerPAD Thermally Enhanced Thin Quad Flatpack (HTQFP) [PZP suffix]
  • Hardware Built-in Self Test (HWBIST)
  • Temperature options:
    • T: –40°C to 105°C junction
    • S: –40°C to 125°C junction
    • Q: –40°C to 125°C free-air
      (AEC Q100 qualification for automotive applications)

2 Applications

  • Medium/short range radar
  • Traction inverter motor control
  • HVAC large commercial motor control
  • Automated sorting equipment
  • CNC control
  • AC charging (pile) station
  • DC charging (pile) station
  • EV charging station power module
  • Energy storage power conversion system (PCS)
  • Central inverter
  • Solar power optimizer
  • String inverter
  • Inverter & motor control
  • On-board (OBC) & wireless charger
  • Linear motor segment controller
  • Servo drive control module
  • AC-input BLDC motor drive
  • DC-input BLDC motor drive
  • Industrial AC-DC
  • Three phase UPS

3 Description

C2000™ 32-bit microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop performance in real-time control applications such as industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; motor control; and sensing and signal processing. The C2000 line includes the Premium performance MCUs and the Entry performance MCUs.

The TMS320F2837xD is a powerful 32-bit floating-point microcontroller unit (MCU) designed for advanced closed-loop control applications such as industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; and sensing and signal processing. To accelerate application development, the DigitalPower software development kit (SDK) for C2000 MCUs and the MotorControl software development kit (SDK) for C2000™ MCUs are available. The F2837xD supports a new dual-core C28x architecture that significantly boosts system performance. The integrated analog and control peripherals also let designers consolidate control architectures and eliminate multiprocessor use in high-end systems.

The dual real-time control subsystems are based on TI’s 32-bit C28x floating-point CPUs, which provide 200MHz of signal processing performance in each core. The C28x CPUs are further boosted by the new TMU accelerator, which enables fast execution of algorithms with trigonometric operations common in transforms and torque loop calculations; and the VCU accelerator, which reduces the time for complex math operations common in encoded applications.

The F2837xD microcontroller family features two CLA real-time control coprocessors. The CLA is an independent 32-bit floating-point processor that runs at the same speed as the main CPU. The CLA responds to peripheral triggers and executes code concurrently with the main C28x CPU. This parallel processing capability can effectively double the computational performance of a real-time control system. By using the CLA to service time-critical functions, the main C28x CPU is free to perform other tasks, such as communications and diagnostics. The dual C28x+CLA architecture enables intelligent partitioning between various system tasks. For example, one C28x+CLA core can be used to track speed and position, while the other C28x+CLA core can be used to control torque and current loops.

The TMS320F2837xD supports up to 1MB (512KW) of onboard flash memory with error correction code (ECC) and up to 204KB (102KW) of SRAM. Two 128-bit secure zones are also available on each CPU for code protection.

Performance analog and control peripherals are also integrated on the F2837xD MCU to further enable system consolidation. Four independent 16-bit ADCs provide precise and efficient management of multiple analog signals, which ultimately boosts system throughput. The new sigma-delta filter module (SDFM) works in conjunction with the sigma-delta modulator to enable isolated current shunt measurements. The Comparator Subsystem (CMPSS) with windowed comparators allows for protection of power stages when current limit conditions are exceeded or not met. Other analog and control peripherals include DACs, PWMs, eCAPs, eQEPs, and other peripherals.

Peripherals such as EMIFs, CAN modules (ISO 11898-1/CAN 2.0B-compliant), and a new uPP interface extend the connectivity of the F2837xD. The uPP interface is a new feature of the C2000™ MCUs and supports high-speed parallel connection to FPGAs or other processors with similar uPP interfaces. Lastly, a USB 2.0 port with MAC and PHY lets users easily add universal serial bus (USB) connectivity to their application.

Want to learn more about features that make C2000 MCUs the right choice for your real-time control system? Check out The Essential Guide for Developing With C2000™ Real-Time Microcontrollers and visit the C2000™ real-time control MCUs page.

The Getting Started With C2000™ Real-Time Control Microcontrollers (MCUs) Getting Started Guide covers all aspects of development with C2000 devices from hardware to support resources. In addition to key reference documents, each section provides relevant links and resources to further expand on the information covered.

Ready to get started? Check out the TMDSCNCD28379D or LAUNCHXL-F28379D evaluation board sand download C2000Ware.

To learn more about the C2000 MCUs, visit the C2000 Overview at www.ti.com/c2000.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE
TMS320F28379D ZWT (nFBGA, 337) 16mm × 16mm 16mm × 16mm
PTP (HLQFP, 176) 26mm × 26mm 24mm × 24mm
TMS320F28378D PTP (HLQFP, 176) 26mm × 26mm 24mm × 24mm
TMS320F28377D ZWT (nFBGA, 337) 16mm × 16mm 16mm × 16mm
PTP (HLQFP, 176) 26mm × 26mm 24mm × 24mm
TMS320F28376D ZWT (nFBGA, 337) 16mm × 16mm 16mm × 16mm
PTP (HLQFP, 176) 26mm × 26mm 24mm × 24mm
TMS320F28375D ZWT (nFBGA, 337) 16mm × 16mm 16mm × 16mm
PTP (HLQFP, 176) 26mm × 26mm 24mm × 24mm
PZP (HTQFP, 100) 16mm × 16mm 14mm × 14mm
TMS320F28374D ZWT (nFBGA, 337) 16mm × 16mm 16mm × 16mm
PTP (HLQFP, 176) 26mm × 26mm 24mm × 24mm
(1) For more information, see Mechanical, Packaging, and Orderable Information.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.

3.1 Functional Block Diagram

The Functional Block Diagram shows the CPU system and associated peripherals.

GUID-3AC77E62-67B2-4C09-A5D4-44970DF3DEC0-low.gif Figure 3-1 Functional Block Diagram

4 Device Comparison

Table 4-1 lists the features of each 2837xD device.

Table 4-1 Device Comparison
FEATURE(1) 28379D
28379D-Q1		 28378D 28377D
28377D-Q1		 28376D 28375D 28374D
Package Type
(ZWT is an nFBGA package.
PTP is an HLQFP package.
PZP is an HTQFP package.)		 337-Ball
ZWT		 176-Pin
PTP		 176-Pin
PTP		 337-Ball
ZWT		 176-Pin
PTP		 337-Ball
ZWT		 176-Pin
PTP		 337-Ball
ZWT		 176-Pin
PTP		 100-Pin
PZP		 337-Ball
ZWT		 176-Pin
PTP
Processor and Accelerators
C28x Number 2
Frequency (MHz) 200
Floating-Point Unit (FPU) Yes
VCU-II Yes
TMU – Type 0 Yes
CLA – Type 1 Number 2
Frequency (MHz) 200
6-Channel DMA – Type 0 2
Memory
Flash (16-bit words) 1MB (512KW)
[512KB (256KW) per CPU]		 1MB (512KW)
[512KB (256KW) per CPU]		 1MB (512KW)
[512KB (256KW) per CPU]		 512KB (256KW)
[256KB (128KW) per CPU]		 1MB (512KW)
[512KB (256KW) per CPU]		 512KB (256KW)
[256KB (128KW) per CPU]
RAM (16-bit words) Dedicated and Local Shared RAM 72KB (36KW)
[36KB (18KW) per CPU]
Global Shared RAM 128KB (64KW) 128KB (64KW) 128KB (64KW) 96KB (48KW) 128KB (64KW) 96KB (48KW)
Message RAM 4KB (2KW)
[2KB (1KW) per CPU]
Total RAM 204KB (102KW) 204KB (102KW) 204KB (102KW) 172KB (86KW) 204KB (102KW) 172KB (86KW)
Code security for on-chip flash, RAM, and OTP blocks Yes
Boot ROM Yes
System
Configurable Logic Block (CLB) 4 tiles No
32-bit CPU timers 6 (3 per CPU)
Watchdog timers 2 (1 per CPU)
Nonmaskable Interrupt Watchdog (NMIWD) timers 2 (1 per CPU)
Crystal oscillator/External clock input 1
0-pin internal oscillator 2
I/O pins (shared) GPIO 169 97 97 169 97 169 97 169 97 41 169 97
External interrupts 5
EMIF EMIF1 (16-bit or 32-bit) 1 1 – 1
EMIF2 (16-bit) 1 – – 1 – 1 – 1 – – 1 –
Analog Peripherals
ADC 16-bit mode MSPS 1.1 – 1.1 –
Conversion Time (ns)(2) 915 – 915 –
Input pins 24 20 – 24 20 24 20 –
Channels (differential) 12 9 – 12 9 12 9 –
ADC 12-bit mode MSPS 3.5
Conversion Time (ns)(2) 280
Input pins 24 20 20 24 20 24 20 24 20 14 24 20
Channels (single-ended) 24 20 20 24 20 24 20 24 20 14 24 20
Number of 16-bit or 12-bit ADCs 4 – 4 –
Number of 12-bit only ADCs – 4 – 4 2 4
Temperature sensor 1
CMPSS (each CMPSS has two comparators and two internal DACs) 8 8 4 8
Buffered DAC 3
Control Peripherals(3)
eCAP inputs – Type 0 6
Enhanced Pulse Width Modulator (ePWM) channels – Type 4 24 24 15 24
eQEP modules – Type 0 3 3 2 3
High-resolution ePWM channels – Type 4 16 16 9 16
SDFM channels – Type 0 8 8 6 8
Communication Peripherals(3)
Controller Area Network (CAN) – Type 0(4) 2
Inter-Integrated Circuit (I2C) – Type 0 2
Multichannel Buffered Serial Port (McBSP) – Type 1 2
Serial Communications Interface (SCI) - Type 0 (UART Compatible) 4 4 3 4
Serial Peripheral Interface (SPI) – Type 2 3
USB – Type 0 1
uPP – Type 0 1
Temperature and Qualification
Junction Temperature (TJ) T: –40°C to 105°C Yes No Yes Yes No Yes
S: –40°C to 125°C Yes
Q: –40°C to 150°C(5) Yes Yes No Yes No
Free-Air Temperature (TA) Q: –40°C to 125°C(5) Yes Yes No Yes No
(1) A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor differences between devices that do not affect the basic functionality of the module. For more information, see the C2000 Real-Time Control Peripherals Reference Guide.
(2) Time between start of sample-and-hold window to start of sample-and-hold window of the next conversion.
(3) For devices that are available in more than one package, the peripheral count listed in the smaller package is reduced because the smaller package has less device pins available. The number of peripherals internally present on the device is not reduced compared to the largest package offered within a part number. See Section 5 to identify which peripheral instances are accessible on pins in the smaller package.
(4) The CAN module uses the IP known as D_CAN. This document uses the names CAN and D_CAN interchangeably to reference this peripheral.
(5) The letter Q refers to AEC Q100 qualification for automotive applications.

4.1 Related Products

For information about similar products, see the following links:

TMS320F2837xD Microcontrollers
The F2837xD series sets a new standard for performance with dual subsystems. Each subsystem consists of a C28x CPU and a parallel control law accelerator (CLA), each running at 200 MHz. Enhancing performance are TMU and VCU accelerators. New capabilities include multiple 16-bit/12-bit mode ADCs, DAC, Sigma-Delta filters, USB, configurable logic block (CLB), on-chip oscillators, and enhanced versions of all peripherals. The F2837xD is available with up to 1MB of Flash. It is available in a 176-pin QFP or 337-pin BGA package.

TMS320F2837xS Microcontrollers
The F2837xS series is a pin-to-pin compatible version of F2837xD but with only one C28x-CPU-and-CLA subsystem enabled. It is also available in a 100-pin QFP to enable compatibility with the TMS320F2807x series.

5 Pin Configuration and Functions

5.1 Pin Diagrams

Figure 5-1 to Figure 5-4 show the terminal assignments on the 337-ball ZWT New Fine Pitch Ball Grid Array. Each figure shows a quadrant of the terminal assignments. Figure 5-5 shows the pin assignments on the 176-pin PTP PowerPAD Thermally Enhanced Low-Profile Quad Flatpack. Figure 5-6 shows the pin assignments on the 100-pin PZP PowerPAD Thermally Enhanced Thin Quad Flatpack.

GUID-0211E546-5A82-4A3B-B030-815E089A4CD5-low.gif
A. Only the GPIO function is shown on GPIO terminals. See Section 5.2.1 for the complete, muxed signal name.
Figure 5-1 337-Ball ZWT New Fine Pitch Ball Grid Array (Bottom View) – [Quadrant A]
GUID-FD11FF5A-5F95-4FFC-9591-9B68280683B6-low.gif
A. Only the GPIO function is shown on GPIO terminals. See Section 5.2.1 for the complete, muxed signal name.
Figure 5-2 337-Ball ZWT New Fine Pitch Ball Grid Array (Bottom View) – [Quadrant B]
GUID-D27BCC18-A28E-433E-9299-2511D2A1578B-low.gif
A. Only the GPIO function is shown on GPIO terminals. See Section 5.2.1 for the complete, muxed signal name.
Figure 5-3 337-Ball ZWT New Fine Pitch Ball Grid Array (Bottom View) – [Quadrant C]
GUID-5B9422A2-46E8-4217-B328-A635FA4A56F0-low.gif
A. Only the GPIO function is shown on GPIO terminals. See Section 5.2.1 for the complete, muxed signal name.
Figure 5-4 337-Ball ZWT New Fine Pitch Ball Grid Array (Bottom View) – [Quadrant D]
GUID-2CDA2601-DF9D-405D-BBBC-1E35DE7D6BE0-low.gif
A. Only the GPIO function is shown on GPIO pins. See Section 5.2.1 for the complete, muxed signal name.
Figure 5-5 176-Pin PTP PowerPAD Thermally Enhanced Low-Profile Quad Flatpack (Top View)
GUID-B3E885A1-0636-462B-B56D-511CF0EB036F-low.gif
A. Only the GPIO function is shown on GPIO pins. See Section 5.2.1 for the complete, muxed signal name.
Figure 5-6 100-Pin PZP PowerPAD HTQFP (Top View)
Note:

The exposed lead frame die pad of the PowerPAD™ package serves two functions: to remove heat from the die and to provide ground path for the digital ground (analog ground is provided through dedicated pins). Thus, the PowerPAD should be soldered to the ground (GND) plane of the PCB because this will provide both the digital ground path and good thermal conduction path. To make optimum use of the thermal efficiencies designed into the PowerPAD package, the PCB must be designed with this technology in mind. A thermal land is required on the surface of the PCB directly underneath the body of the PowerPAD. The thermal land should be soldered to the exposed lead frame die pad of the PowerPAD package; the thermal land should be as large as needed to dissipate the required heat. An array of thermal vias should be used to connect the thermal pad to the internal GND plane of the board. See PowerPAD™ Thermally Enhanced Package for more details on using the PowerPAD package.

Note:

PCB footprints and schematic symbols are available for download in a vendor-neutral format, which can be exported to the leading EDA CAD/CAE design tools. See the CAD/CAE Symbols section in the product folder for each device, under the Packaging section. These footprints and symbols can also be searched for at https://webench.ti.com/cad/.

5.2 Signal Descriptions

Section 5.2.1 describes the signals. The GPIO function is the default at reset, unless otherwise mentioned. The peripheral signals that are listed under them are alternate functions. Some peripheral functions may not be available in all devices. See Table 4-1 for details. All GPIO pins are I/O/Z and have an internal pullup, which can be selectively enabled or disabled on a per-pin basis. This feature only applies to the GPIO pins. The pullups are not enabled at reset.

5.2.1 Signal Descriptions

Table 5-1 Signal Descriptions
TERMINALI/O/Z(1)DESCRIPTION
NAMEMUX POSITIONZWT
BALL
NO.		PTP
PIN
NO.		PZP
PIN
NO.
ADC, DAC, AND COMPARATOR SIGNALS
VREFHIAV13719IADC-A high reference. This voltage must be driven into the pin from external circuitry. Place at least a 1-µF capacitor on this pin for the 12-bit mode, or at least a 22-µF capacitor for the 16-bit mode. This capacitor should be placed as close to the device as possible between the VREFHIA and VREFLOA pins.
NOTE: Do not load this pin externally.
VREFHIBW55337IADC-B high reference. This voltage must be driven into the pin from external circuitry. Place at least a 1-µF capacitor on this pin for the 12-bit mode, or at least a 22-µF capacitor for the 16-bit mode. This capacitor should be placed as close to the device as possible between the VREFHIB and VREFLOB pins.
NOTE: Do not load this pin externally.
VREFHICR135–IADC-C high reference. This voltage must be driven into the pin from external circuitry. Place at least a 1-µF capacitor on this pin for the 12-bit mode, or at least a 22-µF capacitor for the 16-bit mode. This capacitor should be placed as close to the device as possible between the VREFHIC and VREFLOC pins.
NOTE: Do not load this pin externally.
VREFHIDV555–IADC-D high reference. This voltage must be driven into the pin from external circuitry. Place at least a 1-µF capacitor on this pin for the 12-bit mode, or at least a 22-µF capacitor for the 16-bit mode. This capacitor should be placed as close to the device as possible between the VREFHID and VREFLOD pins.
NOTE: Do not load this pin externally.
VREFLOAR23317IADC-A low reference.
On the PZP package, pin 17 is double-bonded to VSSA and VREFLOA. On the PZP package, pin 17 must be connected to VSSA on the system board.
VREFLOBV65034IADC-B low reference
VREFLOCP232–IADC-C low reference
VREFLODW651–IADC-D low reference
ADCIN14T44426IInput 14 to all ADCs. This pin can be used as a general-purpose ADCIN pin or it can be used to calibrate all ADCs together (either single-ended or differential) from an external reference.
CMPIN4PIComparator 4 positive input
ADCIN15U44527IInput 15 to all ADCs. This pin can be used as a general-purpose ADCIN pin or it can be used to calibrate all ADCs together (either single-ended or differential) from an external reference.
CMPIN4NIComparator 4 negative input
ADCINA0U14325IADC-A input 0. There is a 50-kΩ internal pulldown on this pin in both an ADC input or DAC output mode which cannot be disabled.
DACOUTAODAC-A output
ADCINA1T14224IADC-A input 1. There is a 50-kΩ internal pulldown on this pin in both an ADC input or DAC output mode which cannot be disabled.
DACOUTBODAC-B output
ADCINA2U24123IADC-A input 2
CMPIN1PIComparator 1 positive input
ADCINA3T24022IADC-A input 3
CMPIN1NIComparator 1 negative input
ADCINA4U33921IADC-A input 4
CMPIN2PIComparator 2 positive input
ADCINA5T33820IADC-A input 5
CMPIN2NIComparator 2 negative input
ADCINB0V24628IADC-B input 0. There is a 100-pF capacitor to VSSA on this pin in both ADC input or DAC reference mode which cannot be disabled. If this pin is being used as a reference for the on-chip DACs, place at least a 1-µF capacitor on this pin.
VDACIOptional external reference voltage for on-chip DACs. There is a 100-pF capacitor to VSSA on this pin in both ADC input or DAC reference mode which cannot be disabled. If this pin is being used as a reference for the on-chip DACs, place at least a 1-µF capacitor on this pin.
ADCINB1W24729IADC-B input 1. There is a 50-kΩ internal pulldown on this pin in both an ADC input or DAC output mode which cannot be disabled.
DACOUTCODAC-C output
ADCINB2V34830IADC-B input 2
CMPIN3PIComparator 3 positive input
ADCINB3W34931IADC-B input 3
CMPIN3NIComparator 3 negative input
ADCINB4V4–32IADC-B input 4
ADCINB5W4–33IADC-B input 5
ADCINC2R331–IADC-C input 2
CMPIN6PIComparator 6 positive input
ADCINC3P330–IADC-C input 3
CMPIN6NIComparator 6 negative input
ADCINC4R429–IADC-C input 4
CMPIN5PIComparator 5 positive input
ADCINC5P4––IADC-C input 5
CMPIN5NIComparator 5 negative input
ADCIND0T556–IADC-D input 0
CMPIN7PIComparator 7 positive input
ADCIND1U557–IADC-D input 1
CMPIN7NIComparator 7 negative input
ADCIND2T658–IADC-D input 2
CMPIN8PIComparator 8 positive input
ADCIND3U659–IADC-D input 3
CMPIN8NIComparator 8 negative input
ADCIND4T760–IADC-D input 4
ADCIND5U7––IADC-D input 5
GPIO AND PERIPHERAL SIGNALS
GPIO00, 4, 8, 12C8160–I/OGeneral-purpose input/output 0
EPWM1A1OEnhanced PWM1 output A (HRPWM-capable)
SDAA6I/ODI2C-A data open-drain bidirectional port
GPIO10, 4, 8, 12D8161–I/OGeneral-purpose input/output 1
EPWM1B1OEnhanced PWM1 output B (HRPWM-capable)
MFSRB3I/OMcBSP-B receive frame synch
SCLA6I/ODI2C-A clock open-drain bidirectional port
GPIO20, 4, 8, 12A716291I/OGeneral-purpose input/output 2
EPWM2A1OEnhanced PWM2 output A (HRPWM-capable)
OUTPUTXBAR15OOutput 1 of the output XBAR
SDAB6I/ODI2C-B data open-drain bidirectional port
GPIO30, 4, 8, 12B716392I/OGeneral-purpose input/output 3
EPWM2B1OEnhanced PWM2 output B (HRPWM-capable)
OUTPUTXBAR22OOutput 2 of the output XBAR
MCLKRB3I/OMcBSP-B receive clock
OUTPUTXBAR25OOutput 2 of the output XBAR
SCLB6I/ODI2C-B clock open-drain bidirectional port
GPIO40, 4, 8, 12C716493I/OGeneral-purpose input/output 4
EPWM3A1OEnhanced PWM3 output A (HRPWM-capable)
OUTPUTXBAR35OOutput 3 of the output XBAR
CANTXA6OCAN-A transmit
GPIO50, 4, 8, 12D7165–I/OGeneral-purpose input/output 5
EPWM3B1OEnhanced PWM3 output B (HRPWM-capable)
MFSRA2I/OMcBSP-A receive frame synch
OUTPUTXBAR33OOutput 3 of the output XBAR
CANRXA6ICAN-A receive
GPIO60, 4, 8, 12A6166–I/OGeneral-purpose input/output 6
EPWM4A1OEnhanced PWM4 output A (HRPWM-capable)
OUTPUTXBAR42OOutput 4 of the output XBAR
EXTSYNCOUT3OExternal ePWM synch pulse output
EQEP3A5IEnhanced QEP3 input A
CANTXB6OCAN-B transmit
GPIO70, 4, 8, 12B6167–I/OGeneral-purpose input/output 7
EPWM4B1OEnhanced PWM4 output B (HRPWM-capable)
MCLKRA2I/OMcBSP-A receive clock
OUTPUTXBAR53OOutput 5 of the output XBAR
EQEP3B5IEnhanced QEP3 input B
CANRXB6ICAN-B receive
GPIO80, 4, 8, 12G218–I/OGeneral-purpose input/output 8
EPWM5A1OEnhanced PWM5 output A (HRPWM-capable)
CANTXB2OCAN-B transmit
ADCSOCAO3OADC start-of-conversion A output for external ADC
EQEP3S5I/OEnhanced QEP3 strobe
SCITXDA6OSCI-A transmit data
GPIO90, 4, 8, 12G319–I/OGeneral-purpose input/output 9
EPWM5B1OEnhanced PWM5 output B (HRPWM-capable)
SCITXDB2OSCI-B transmit data
OUTPUTXBAR63OOutput 6 of the output XBAR
EQEP3I5I/OEnhanced QEP3 index
SCIRXDA6ISCI-A receive data
GPIO100, 4, 8, 12B21100I/OGeneral-purpose input/output 10
EPWM6A1OEnhanced PWM6 output A (HRPWM-capable)
CANRXB2ICAN-B receive
ADCSOCBO3OADC start-of-conversion B output for external ADC
EQEP1A5IEnhanced QEP1 input A
SCITXDB6OSCI-B transmit data
UPP-WAIT15I/OUniversal parallel port wait. Receiver asserts to request a pause in transfer.
GPIO110, 4, 8, 12C121I/OGeneral-purpose input/output 11
EPWM6B1OEnhanced PWM6 output B (HRPWM-capable)
SCIRXDB2, 6ISCI-B receive data
OUTPUTXBAR73OOutput 7 of the output XBAR
EQEP1B5IEnhanced QEP1 input B
UPP-START15I/OUniversal parallel port start. Transmitter asserts at start of DMA line.
GPIO120, 4, 8, 12C243I/OGeneral-purpose input/output 12
EPWM7A1OEnhanced PWM7 output A (HRPWM-capable)
CANTXB2OCAN-B transmit
MDXB3OMcBSP-B transmit serial data
EQEP1S5I/OEnhanced QEP1 strobe
SCITXDC6OSCI-C transmit data
UPP-ENA15I/OUniversal parallel port enable. Transmitter asserts while data bus is active.
GPIO130, 4, 8, 12D154I/OGeneral-purpose input/output 13
EPWM7B1OEnhanced PWM7 output B (HRPWM-capable)
CANRXB2ICAN-B receive
MDRB3IMcBSP-B receive serial data
EQEP1I5I/OEnhanced QEP1 index
SCIRXDC6ISCI-C receive data
UPP-D715I/OUniversal parallel port data line 7
GPIO140, 4, 8, 12D265I/OGeneral-purpose input/output 14
EPWM8A1OEnhanced PWM8 output A (HRPWM-capable)
SCITXDB2OSCI-B transmit data
MCLKXB3I/OMcBSP-B transmit clock
OUTPUTXBAR36OOutput 3 of the output XBAR
UPP-D615I/OUniversal parallel port data line 6
GPIO150, 4, 8, 12D376I/OGeneral-purpose input/output 15
EPWM8B1OEnhanced PWM8 output B (HRPWM-capable)
SCIRXDB2ISCI-B receive data
MFSXB3I/OMcBSP-B transmit frame synch
OUTPUTXBAR46OOutput 4 of the output XBAR
UPP-D515I/OUniversal parallel port data line 5
GPIO160, 4, 8, 12E187I/OGeneral-purpose input/output 16
SPISIMOA1I/OSPI-A slave in, master out
CANTXB2OCAN-B transmit
OUTPUTXBAR73OOutput 7 of the output XBAR
EPWM9A5OEnhanced PWM9 output A
SD1_D17ISigma-Delta 1 channel 1 data input
UPP-D415I/OUniversal parallel port data line 4
GPIO170, 4, 8, 12E298I/OGeneral-purpose input/output 17
SPISOMIA1I/OSPI-A slave out, master in
CANRXB2ICAN-B receive
OUTPUTXBAR83OOutput 8 of the output XBAR
EPWM9B5OEnhanced PWM9 output B
SD1_C17ISigma-Delta 1 channel 1 clock input
UPP-D315I/OUniversal parallel port data line 3
GPIO180, 4, 8, 12E3109I/OGeneral-purpose input/output 18
SPICLKA1I/OSPI-A clock
SCITXDB2OSCI-B transmit data
CANRXA3ICAN-A receive
EPWM10A5OEnhanced PWM10 output A
SD1_D27ISigma-Delta 1 channel 2 data input
UPP-D215I/OUniversal parallel port data line 2
GPIO190, 4, 8, 12E41211I/OGeneral-purpose input/output 19
SPISTEA1I/OSPI-A slave transmit enable
SCIRXDB2ISCI-B receive data
CANTXA3OCAN-A transmit
EPWM10B5OEnhanced PWM10 output B
SD1_C27ISigma-Delta 1 channel 2 clock input
UPP-D115I/OUniversal parallel port data line 1
GPIO200, 4, 8, 12F21312I/OGeneral-purpose input/output 20
EQEP1A1IEnhanced QEP1 input A
MDXA2OMcBSP-A transmit serial data
CANTXB3OCAN-B transmit
EPWM11A5OEnhanced PWM11 output A
SD1_D37ISigma-Delta 1 channel 3 data input
UPP-D015I/OUniversal parallel port data line 0
GPIO210, 4, 8, 12F31413I/OGeneral-purpose input/output 21
EQEP1B1IEnhanced QEP1 input B
MDRA2IMcBSP-A receive serial data
CANRXB3ICAN-B receive
EPWM11B5OEnhanced PWM11 output B
SD1_C37ISigma-Delta 1 channel 3 clock input
UPP-CLK15I/OUniversal parallel port transmit clock
GPIO220, 4, 8, 12J422–I/OGeneral-purpose input/output 22
EQEP1S1I/OEnhanced QEP1 strobe
MCLKXA2I/OMcBSP-A transmit clock
SCITXDB3OSCI-B transmit data
EPWM12A5OEnhanced PWM12 output A
SPICLKB6I/OSPI-B clock
SD1_D47ISigma-Delta 1 channel 4 data input
GPIO230, 4, 8, 12K423–I/OGeneral-purpose input/output 23
EQEP1I1I/OEnhanced QEP1 index
MFSXA2I/OMcBSP-A transmit frame synch
SCIRXDB3ISCI-B receive data
EPWM12B5OEnhanced PWM12 output B
SPISTEB6I/OSPI-B slave transmit enable
SD1_C47ISigma-Delta 1 channel 4 clock input
GPIO240, 4, 8, 12K324–I/OGeneral-purpose input/output 24
OUTPUTXBAR11OOutput 1 of the output XBAR
EQEP2A2IEnhanced QEP2 input A
MDXB3OMcBSP-B transmit serial data
SPISIMOB6I/OSPI-B slave in, master out
SD2_D17ISigma-Delta 2 channel 1 data input
GPIO250, 4, 8, 12K225–I/OGeneral-purpose input/output 25
OUTPUTXBAR21OOutput 2 of the output XBAR
EQEP2B2IEnhanced QEP2 input B
MDRB3IMcBSP-B receive serial data
SPISOMIB6I/OSPI-B slave out, master in
SD2_C17ISigma-Delta 2 channel 1 clock input
GPIO260, 4, 8, 12K127–I/OGeneral-purpose input/output 26
OUTPUTXBAR31OOutput 3 of the output XBAR
EQEP2I2I/OEnhanced QEP2 index
MCLKXB3I/OMcBSP-B transmit clock
OUTPUTXBAR35OOutput 3 of the output XBAR
SPICLKB6I/OSPI-B clock
SD2_D27ISigma-Delta 2 channel 2 data input
GPIO270, 4, 8, 12L128–I/OGeneral-purpose input/output 27
OUTPUTXBAR41OOutput 4 of the output XBAR
EQEP2S2I/OEnhanced QEP2 strobe
MFSXB3I/OMcBSP-B transmit frame synch
OUTPUTXBAR45OOutput 4 of the output XBAR
SPISTEB6I/OSPI-B slave transmit enable
SD2_C27ISigma-Delta 2 channel 2 clock input
GPIO280, 4, 8, 12V1164–I/OGeneral-purpose input/output 28
SCIRXDA1ISCI-A receive data
EM1CS42OExternal memory interface 1 chip select 4
OUTPUTXBAR55OOutput 5 of the output XBAR
EQEP3A6IEnhanced QEP3 input A
SD2_D37ISigma-Delta 2 channel 3 data input
GPIO290, 4, 8, 12W1165–I/OGeneral-purpose input/output 29
SCITXDA1OSCI-A transmit data
EM1SDCKE2OExternal memory interface 1 SDRAM clock enable
OUTPUTXBAR65OOutput 6 of the output XBAR
EQEP3B6IEnhanced QEP3 input B
SD2_C37ISigma-Delta 2 channel 3 clock input
GPIO300, 4, 8, 12T1163–I/OGeneral-purpose input/output 30
CANRXA1ICAN-A receive
EM1CLK2OExternal memory interface 1 clock
OUTPUTXBAR75OOutput 7 of the output XBAR
EQEP3S6I/OEnhanced QEP3 strobe
SD2_D47ISigma-Delta 2 channel 4 data input
GPIO310, 4, 8, 12U1166–I/OGeneral-purpose input/output 31
CANTXA1OCAN-A transmit
EM1WE2OExternal memory interface 1 write enable
OUTPUTXBAR85OOutput 8 of the output XBAR
EQEP3I6I/OEnhanced QEP3 index
SD2_C47ISigma-Delta 2 channel 4 clock input
GPIO320, 4, 8, 12U1367–I/OGeneral-purpose input/output 32
SDAA1I/ODI2C-A data open-drain bidirectional port
EM1CS02OExternal memory interface 1 chip select 0
GPIO330, 4, 8, 12T1369–I/OGeneral-purpose input/output 33
SCLA1I/ODI2C-A clock open-drain bidirectional port
EM1RNW2OExternal memory interface 1 read not write
GPIO340, 4, 8, 12U1470–I/OGeneral-purpose input/output 34
OUTPUTXBAR11OOutput 1 of the output XBAR
EM1CS22OExternal memory interface 1 chip select 2
SDAB6I/ODI2C-B data open-drain bidirectional port
GPIO350, 4, 8, 12T1471–I/OGeneral-purpose input/output 35
SCIRXDA1ISCI-A receive data
EM1CS32OExternal memory interface 1 chip select 3
SCLB6I/ODI2C-B clock open-drain bidirectional port
GPIO360, 4, 8, 12V1683–I/OGeneral-purpose input/output 36
SCITXDA1OSCI-A transmit data
EM1WAIT2IExternal memory interface 1 Asynchronous SRAM WAIT
CANRXA6ICAN-A receive
GPIO370, 4, 8, 12U1684–I/OGeneral-purpose input/output 37
OUTPUTXBAR21OOutput 2 of the output XBAR
EM1OE2OExternal memory interface 1 output enable
CANTXA6OCAN-A transmit
GPIO380, 4, 8, 12T1685–I/OGeneral-purpose input/output 38
EM1A02OExternal memory interface 1 address line 0
SCITXDC5OSCI-C transmit data
CANTXB6OCAN-B transmit
GPIO390, 4, 8, 12W1786–I/OGeneral-purpose input/output 39
EM1A12OExternal memory interface 1 address line 1
SCIRXDC5ISCI-C receive data
CANRXB6ICAN-B receive
GPIO400, 4, 8, 12V1787–I/OGeneral-purpose input/output 40
EM1A22OExternal memory interface 1 address line 2
SDAB6I/ODI2C-B data open-drain bidirectional port
GPIO410, 4, 8, 12U178951I/OGeneral-purpose input/output 41. For applications using the Hibernate low-power mode, this pin serves as the GPIOHIBWAKE signal. For details, see the Low Power Modes section of the System Control chapter in the TMS320F2837xD Dual-Core Real-Time Microcontrollers Technical Reference Manual.
EM1A32OExternal memory interface 1 address line 3
SCLB6I/ODI2C-B clock open-drain bidirectional port
GPIO420, 4, 8, 12D1913073I/OGeneral-purpose input/output 42
SDAA6I/ODI2C-A data open-drain bidirectional port
SCITXDA15OSCI-A transmit data
USB0DMAnalogI/OUSB PHY differential data
GPIO430, 4, 8, 12C1913174I/OGeneral-purpose input/output 43
SCLA6I/ODI2C-A clock open-drain bidirectional port
SCIRXDA15ISCI-A receive data
USB0DPAnalogI/OUSB PHY differential data
GPIO440, 4, 8, 12K18113–I/OGeneral-purpose input/output 44
EM1A42OExternal memory interface 1 address line 4
GPIO450, 4, 8, 12K19115–I/OGeneral-purpose input/output 45
EM1A52OExternal memory interface 1 address line 5
GPIO460, 4, 8, 12E19128–I/OGeneral-purpose input/output 46
EM1A62OExternal memory interface 1 address line 6
SCIRXDD6ISCI-D receive data
GPIO470, 4, 8, 12E18129–I/OGeneral-purpose input/output 47
EM1A72OExternal memory interface 1 address line 7
SCITXDD6OSCI-D transmit data
GPIO480, 4, 8, 12R1690–I/OGeneral-purpose input/output 48
OUTPUTXBAR31OOutput 3 of the output XBAR
EM1A82OExternal memory interface 1 address line 8
SCITXDA6OSCI-A transmit data
SD1_D17ISigma-Delta 1 channel 1 data input
GPIO490, 4, 8, 12R1793–I/OGeneral-purpose input/output 49
OUTPUTXBAR41OOutput 4 of the output XBAR
EM1A92OExternal memory interface 1 address line 9
SCIRXDA6ISCI-A receive data
SD1_C17ISigma-Delta 1 channel 1 clock input
GPIO500, 4, 8, 12R1894–I/OGeneral-purpose input/output 50
EQEP1A1IEnhanced QEP1 input A
EM1A102OExternal memory interface 1 address line 10
SPISIMOC6I/OSPI-C slave in, master out
SD1_D27ISigma-Delta 1 channel 2 data input
GPIO510, 4, 8, 12R1995–I/OGeneral-purpose input/output 51
EQEP1B1IEnhanced QEP1 input B
EM1A112OExternal memory interface 1 address line 11
SPISOMIC6I/OSPI-C slave out, master in
SD1_C27ISigma-Delta 1 channel 2 clock input
GPIO520, 4, 8, 12P1696–I/OGeneral-purpose input/output 52
EQEP1S1I/OEnhanced QEP1 strobe
EM1A122OExternal memory interface 1 address line 12
SPICLKC6I/OSPI-C clock
SD1_D37ISigma-Delta 1 channel 3 data input
GPIO530, 4, 8, 12P1797–I/OGeneral-purpose input/output 53
EQEP1I1I/OEnhanced QEP1 index
EM1D312I/OExternal memory interface 1 data line 31
EM2D153I/OExternal memory interface 2 data line 15
SPISTEC6I/OSPI-C slave transmit enable
SD1_C37ISigma-Delta 1 channel 3 clock input
GPIO540, 4, 8, 12P1898–I/OGeneral-purpose input/output 54
SPISIMOA1I/OSPI-A slave in, master out
EM1D302I/OExternal memory interface 1 data line 30
EM2D143I/OExternal memory interface 2 data line 14
EQEP2A5IEnhanced QEP2 input A
SCITXDB6OSCI-B transmit data
SD1_D47ISigma-Delta 1 channel 4 data input
GPIO550, 4, 8, 12P19100–I/OGeneral-purpose input/output 55
SPISOMIA1I/OSPI-A slave out, master in
EM1D292I/OExternal memory interface 1 data line 29
EM2D133I/OExternal memory interface 2 data line 13
EQEP2B5IEnhanced QEP2 input B
SCIRXDB6ISCI-B receive data
SD1_C47ISigma-Delta 1 channel 4 clock input
GPIO560, 4, 8, 12N16101–I/OGeneral-purpose input/output 56
SPICLKA1I/OSPI-A clock
EM1D282I/OExternal memory interface 1 data line 28
EM2D123I/OExternal memory interface 2 data line 12
EQEP2S5I/OEnhanced QEP2 strobe
SCITXDC6OSCI-C transmit data
SD2_D17ISigma-Delta 2 channel 1 data input
GPIO570, 4, 8, 12N18102–I/OGeneral-purpose input/output 57
SPISTEA1I/OSPI-A slave transmit enable
EM1D272I/OExternal memory interface 1 data line 27
EM2D113I/OExternal memory interface 2 data line 11
EQEP2I5I/OEnhanced QEP2 index
SCIRXDC6ISCI-C receive data
SD2_C17ISigma-Delta 2 channel 1 clock input
GPIO580, 4, 8, 12N1710352I/OGeneral-purpose input/output 58
MCLKRA1I/OMcBSP-A receive clock
EM1D262I/OExternal memory interface 1 data line 26
EM2D103I/OExternal memory interface 2 data line 10
OUTPUTXBAR15OOutput 1 of the output XBAR
SPICLKB6I/OSPI-B clock
SD2_D27ISigma-Delta 2 channel 2 data input
SPISIMOA15I/OSPI-A slave in, master out(2)
GPIO590, 4, 8, 12M1610453I/OGeneral-purpose input/output 59(3)
MFSRA1I/OMcBSP-A receive frame synch
EM1D252I/OExternal memory interface 1 data line 25
EM2D93I/OExternal memory interface 2 data line 9
OUTPUTXBAR25OOutput 2 of the output XBAR
SPISTEB6I/OSPI-B slave transmit enable
SD2_C27ISigma-Delta 2 channel 2 clock input
SPISOMIA15I/OSPI-A slave out, master in(2)
GPIO600, 4, 8, 12M1710554I/OGeneral-purpose input/output 60
MCLKRB1I/OMcBSP-B receive clock
EM1D242I/OExternal memory interface 1 data line 24
EM2D83I/OExternal memory interface 2 data line 8
OUTPUTXBAR35OOutput 3 of the output XBAR
SPISIMOB6I/OSPI-B slave in, master out
SD2_D37ISigma-Delta 2 channel 3 data input
SPICLKA15I/OSPI-A clock(2)
GPIO610, 4, 8, 12L1610756I/OGeneral-purpose input/output 61(3)
MFSRB1I/OMcBSP-B receive frame synch
EM1D232I/OExternal memory interface 1 data line 23
EM2D73I/OExternal memory interface 2 data line 7
OUTPUTXBAR45OOutput 4 of the output XBAR
SPISOMIB6I/OSPI-B slave out, master in
SD2_C37ISigma-Delta 2 channel 3 clock input
SPISTEA15I/OSPI-A slave transmit enable(2)
GPIO620, 4, 8, 12J1710857I/OGeneral-purpose input/output 62
SCIRXDC1ISCI-C receive data
EM1D222I/OExternal memory interface 1 data line 22
EM2D63I/OExternal memory interface 2 data line 6
EQEP3A5IEnhanced QEP3 input A
CANRXA6ICAN-A receive
SD2_D47ISigma-Delta 2 channel 4 data input
GPIO630, 4, 8, 12J1610958I/OGeneral-purpose input/output 63
SCITXDC1OSCI-C transmit data
EM1D212I/OExternal memory interface 1 data line 21
EM2D53I/OExternal memory interface 2 data line 5
EQEP3B5IEnhanced QEP3 input B
CANTXA6OCAN-A transmit
SD2_C47ISigma-Delta 2 channel 4 clock input
SPISIMOB15I/OSPI-B slave in, master out(2)
GPIO640, 4, 8, 12L1711059I/OGeneral-purpose input/output 64(3)
EM1D202I/OExternal memory interface 1 data line 20
EM2D43I/OExternal memory interface 2 data line 4
EQEP3S5I/OEnhanced QEP3 strobe
SCIRXDA6ISCI-A receive data
SPISOMIB15I/OSPI-B slave out, master in(2)
GPIO650, 4, 8, 12K1611160I/OGeneral-purpose input/output 65
EM1D192I/OExternal memory interface 1 data line 19
EM2D33I/OExternal memory interface 2 data line 3
EQEP3I5I/OEnhanced QEP3 index
SCITXDA6OSCI-A transmit data
SPICLKB15I/OSPI-B clock(2)
GPIO660, 4, 8, 12K1711261I/OGeneral-purpose input/output 66(3)
EM1D182I/OExternal memory interface 1 data line 18
EM2D23I/OExternal memory interface 2 data line 2
SDAB6I/ODI2C-B data open-drain bidirectional port
SPISTEB15I/OSPI-B slave transmit enable(2)
GPIO670, 4, 8, 12B19132–I/OGeneral-purpose input/output 67
EM1D172I/OExternal memory interface 1 data line 17
EM2D13I/OExternal memory interface 2 data line 1
GPIO680, 4, 8, 12C18133–I/OGeneral-purpose input/output 68
EM1D162I/OExternal memory interface 1 data line 16
EM2D03I/OExternal memory interface 2 data line 0
GPIO690, 4, 8, 12B1813475I/OGeneral-purpose input/output 69
EM1D152I/OExternal memory interface 1 data line 15
SCLB6I/ODI2C-B clock open-drain bidirectional port
SPISIMOC15I/OSPI-C slave in, master out(2)
GPIO700, 4, 8, 12A1713576I/OGeneral-purpose input/output 70(3)
EM1D142I/OExternal memory interface 1 data line 14
CANRXA5ICAN-A receive
SCITXDB6OSCI-B transmit data
SPISOMIC15I/OSPI-C slave out, master in(2)
GPIO710, 4, 8, 12B1713677I/OGeneral-purpose input/output 71
EM1D132I/OExternal memory interface 1 data line 13
CANTXA5OCAN-A transmit
SCIRXDB6ISCI-B receive data
SPICLKC15I/OSPI-C clock(2)
GPIO720, 4, 8, 12B1613980I/OGeneral-purpose input/output 72.(3) This is the factory default boot mode select pin 1.
EM1D122I/OExternal memory interface 1 data line 12
CANTXB5OCAN-B transmit
SCITXDC6OSCI-C transmit data
SPISTEC15I/OSPI-C slave transmit enable(2)
GPIO730, 4, 8, 12A1614081I/OGeneral-purpose input/output 73
EM1D112I/OExternal memory interface 1 data line 11
XCLKOUT3O/ZExternal clock output. This pin outputs a divided-down version of a chosen clock signal from within the device. The clock signal is chosen using the CLKSRCCTL3.XCLKOUTSEL bit field while the divide ratio is chosen using the XCLKOUTDIVSEL.XCLKOUTDIV bit field.
CANRXB5ICAN-B receive
SCIRXDC6ISCI-C receive
GPIO740, 4, 8, 12C17141–I/OGeneral-purpose input/output 74
EM1D102I/OExternal memory interface 1 data line 10
GPIO750, 4, 8, 12D16142–I/OGeneral-purpose input/output 75
EM1D92I/OExternal memory interface 1 data line 9
GPIO760, 4, 8, 12C16143–I/OGeneral-purpose input/output 76
EM1D82I/OExternal memory interface 1 data line 8
SCITXDD6OSCI-D transmit data
GPIO770, 4, 8, 12A15144–I/OGeneral-purpose input/output 77
EM1D72I/OExternal memory interface 1 data line 7
SCIRXDD6ISCI-D receive data
GPIO780, 4, 8, 12B1514582I/OGeneral-purpose input/output 78
EM1D62I/OExternal memory interface 1 data line 6
EQEP2A6IEnhanced QEP2 input A
GPIO790, 4, 8, 12C15146–I/OGeneral-purpose input/output 79
EM1D52I/OExternal memory interface 1 data line 5
EQEP2B6IEnhanced QEP2 input B
GPIO800, 4, 8, 12D15148–I/OGeneral-purpose input/output 80
EM1D42I/OExternal memory interface 1 data line 4
EQEP2S6I/OEnhanced QEP2 strobe
GPIO810, 4, 8, 12A14149–I/OGeneral-purpose input/output 81
EM1D32I/OExternal memory interface 1 data line 3
EQEP2I6I/OEnhanced QEP2 index
GPIO820, 4, 8, 12B14150–I/OGeneral-purpose input/output 82
EM1D22I/OExternal memory interface 1 data line 2
GPIO830, 4, 8, 12C14151–I/OGeneral-purpose input/output 83
EM1D12I/OExternal memory interface 1 data line 1
GPIO840, 4, 8, 12A1115485I/OGeneral-purpose input/output 84. This is the factory default boot mode select pin 0.
SCITXDA5OSCI-A transmit data
MDXB6OMcBSP-B transmit serial data
MDXA15OMcBSP-A transmit serial data
GPIO850, 4, 8, 12B1115586I/OGeneral-purpose input/output 85
EM1D02I/OExternal memory interface 1 data line 0
SCIRXDA5ISCI-A receive data
MDRB6IMcBSP-B receive serial data
MDRA15IMcBSP-A receive serial data
GPIO860, 4, 8, 12C1115687I/OGeneral-purpose input/output 86
EM1A132OExternal memory interface 1 address line 13
EM1CAS3OExternal memory interface 1 column address strobe
SCITXDB5OSCI-B transmit data
MCLKXB6I/OMcBSP-B transmit clock
MCLKXA15I/OMcBSP-A transmit clock
GPIO870, 4, 8, 12D1115788I/OGeneral-purpose input/output 87
EM1A142OExternal memory interface 1 address line 14
EM1RAS3OExternal memory interface 1 row address strobe
SCIRXDB5ISCI-B receive data
MFSXB6I/OMcBSP-B transmit frame synch
MFSXA15I/OMcBSP-A transmit frame synch
GPIO880, 4, 8, 12C6170–I/OGeneral-purpose input/output 88
EM1A152OExternal memory interface 1 address line 15
EM1DQM03OExternal memory interface 1 Input/output mask for byte 0
GPIO890, 4, 8, 12D617196I/OGeneral-purpose input/output 89
EM1A162OExternal memory interface 1 address line 16
EM1DQM13OExternal memory interface 1 Input/output mask for byte 1
SCITXDC6OSCI-C transmit data
GPIO900, 4, 8, 12A517297I/OGeneral-purpose input/output 90
EM1A172OExternal memory interface 1 address line 17
EM1DQM23OExternal memory interface 1 Input/output mask for byte 2
SCIRXDC6ISCI-C receive data
GPIO910, 4, 8, 12B517398I/OGeneral-purpose input/output 91
EM1A182OExternal memory interface 1 address line 18
EM1DQM33OExternal memory interface 1 Input/output mask for byte 3
SDAA6I/ODI2C-A data open-drain bidirectional port
GPIO920, 4, 8, 12A417499I/OGeneral-purpose input/output 92
EM1A192OExternal memory interface 1 address line 19
EM1BA13OExternal memory interface 1 bank address 1
SCLA6I/ODI2C-A clock open-drain bidirectional port
GPIO930, 4, 8, 12B4175–I/OGeneral-purpose input/output 93
EM1BA03OExternal memory interface 1 bank address 0
SCITXDD6OSCI-D transmit data
GPIO940, 4, 8, 12A3176–I/OGeneral-purpose input/output 94
SCIRXDD6ISCI-D receive data
GPIO950, 4, 8, 12B3––I/OGeneral-purpose input/output 95
GPIO960, 4, 8, 12C3––I/OGeneral-purpose input/output 96
EM2DQM13OExternal memory interface 2 Input/output mask for byte 1
EQEP1A5IEnhanced QEP1 input A
GPIO970, 4, 8, 12A2––I/OGeneral-purpose input/output 97
EM2DQM03OExternal memory interface 2 Input/output mask for byte 0
EQEP1B5IEnhanced QEP1 input B
GPIO980, 4, 8, 12F1––I/OGeneral-purpose input/output 98
EM2A03OExternal memory interface 2 address line 0
EQEP1S5I/OEnhanced QEP1 strobe
GPIO990, 4, 8, 12G11714I/OGeneral-purpose input/output 99
EM2A13OExternal memory interface 2 address line 1
EQEP1I5I/OEnhanced QEP1 index
GPIO1000, 4, 8, 12H1––I/OGeneral-purpose input/output 100
EM2A23OExternal memory interface 2 address line 2
EQEP2A5IEnhanced QEP2 input A
SPISIMOC6I/OSPI-C slave in, master out
GPIO1010, 4, 8, 12H2––I/OGeneral-purpose input/output 101
EM2A33OExternal memory interface 2 address line 3
EQEP2B5IEnhanced QEP2 input B
SPISOMIC6I/OSPI-C slave out, master in
GPIO1020, 4, 8, 12H3––I/OGeneral-purpose input/output 102
EM2A43OExternal memory interface 2 address line 4
EQEP2S5I/OEnhanced QEP2 strobe
SPICLKC6I/OSPI-C clock
GPIO1030, 4, 8, 12J1––I/OGeneral-purpose input/output 103
EM2A53OExternal memory interface 2 address line 5
EQEP2I5I/OEnhanced QEP2 index
SPISTEC6I/OSPI-C slave transmit enable
GPIO1040, 4, 8, 12J2––I/OGeneral-purpose input/output 104
SDAA1I/ODI2C-A data open-drain bidirectional port
EM2A63OExternal memory interface 2 address line 6
EQEP3A5IEnhanced QEP3 input A
SCITXDD6OSCI-D transmit data
GPIO1050, 4, 8, 12J3––I/OGeneral-purpose input/output 105
SCLA1I/ODI2C-A clock open-drain bidirectional port
EM2A73OExternal memory interface 2 address line 7
EQEP3B5IEnhanced QEP3 input B
SCIRXDD6ISCI-D receive data
GPIO1060, 4, 8, 12L2––I/OGeneral-purpose input/output 106
EM2A83OExternal memory interface 2 address line 8
EQEP3S5I/OEnhanced QEP3 strobe
SCITXDC6OSCI-C transmit data
GPIO1070, 4, 8, 12L3––I/OGeneral-purpose input/output 107
EM2A93OExternal memory interface 2 address line 9
EQEP3I5I/OEnhanced QEP3 index
SCIRXDC6ISCI-C receive data
GPIO1080, 4, 8, 12L4––I/OGeneral-purpose input/output 108
EM2A103OExternal memory interface 2 address line 10
GPIO1090, 4, 8, 12N2––I/OGeneral-purpose input/output 109
EM2A113OExternal memory interface 2 address line 11
GPIO1100, 4, 8, 12M2––I/OGeneral-purpose input/output 110
EM2WAIT3IExternal memory interface 2 Asynchronous SRAM WAIT
GPIO1110, 4, 8, 12M4––I/OGeneral-purpose input/output 111
EM2BA03OExternal memory interface 2 bank address 0
GPIO1120, 4, 8, 12M3––I/OGeneral-purpose input/output 112
EM2BA13OExternal memory interface 2 bank address 1
GPIO1130, 4, 8, 12N4––I/OGeneral-purpose input/output 113
EM2CAS3OExternal memory interface 2 column address strobe
GPIO1140, 4, 8, 12N3––I/OGeneral-purpose input/output 114
EM2RAS3OExternal memory interface 2 row address strobe
GPIO1150, 4, 8, 12V12––I/OGeneral-purpose input/output 115
EM2CS03OExternal memory interface 2 chip select 0
GPIO1160, 4, 8, 12W10––I/OGeneral-purpose input/output 116
EM2CS23OExternal memory interface 2 chip select 2
GPIO1170, 4, 8, 12U12––I/OGeneral-purpose input/output 117
EM2SDCKE3OExternal memory interface 2 SDRAM clock enable
GPIO1180, 4, 8, 12T12––I/OGeneral-purpose input/output 118
EM2CLK3OExternal memory interface 2 clock
GPIO1190, 4, 8, 12T15––I/OGeneral-purpose input/output 119
EM2RNW3OExternal memory interface 2 read not write
GPIO1200, 4, 8, 12U15––I/OGeneral-purpose input/output 120
EM2WE3OExternal memory interface 2 write enable
USB0PFLT15I/OUSB external regulator power fault indicator
GPIO1210, 4, 8, 12W16––I/OGeneral-purpose input/output 121
EM2OE3OExternal memory interface 2 output enable
USB0EPEN15I/OUSB external regulator enable
GPIO1220, 4, 8, 12T8––I/OGeneral-purpose input/output 122
SPISIMOC6I/OSPI-C slave in, master out
SD1_D17ISigma-Delta 1 channel 1 data input
GPIO1230, 4, 8, 12U8––I/OGeneral-purpose input/output 123
SPISOMIC6I/OSPI-C slave out, master in
SD1_C17ISigma-Delta 1 channel 1 clock input
GPIO1240, 4, 8, 12V8––I/OGeneral-purpose input/output 124
SPICLKC6I/OSPI-C clock
SD1_D27ISigma-Delta 1 channel 2 data input
GPIO1250, 4, 8, 12T9––I/OGeneral-purpose input/output 125
SPISTEC6I/OSPI-C slave transmit enable
SD1_C27ISigma-Delta 1 channel 2 clock input
GPIO1260, 4, 8, 12U9––I/OGeneral-purpose input/output 126
SD1_D37ISigma-Delta 1 channel 3 data input
GPIO1270, 4, 8, 12V9––I/OGeneral-purpose input/output 127
SD1_C37ISigma-Delta 1 channel 3 clock input
GPIO1280, 4, 8, 12W9––I/OGeneral-purpose input/output 128
SD1_D47ISigma-Delta 1 channel 4 data input
GPIO1290, 4, 8, 12T10––I/OGeneral-purpose input/output 129
SD1_C47ISigma-Delta 1 channel 4 clock input
GPIO1300, 4, 8, 12U10––I/OGeneral-purpose input/output 130
SD2_D17ISigma-Delta 2 channel 1 data input
GPIO1310, 4, 8, 12V10––I/OGeneral-purpose input/output 131
SD2_C17ISigma-Delta 2 channel 1 clock input
GPIO1320, 4, 8, 12W18––I/OGeneral-purpose input/output 132
SD2_D27ISigma-Delta 2 channel 2 data input
GPIO133/AUXCLKIN0, 4, 8, 12G18118–I/OGeneral-purpose input/output 133. The AUXCLKIN function of this GPIO pin could be used to provide a single-ended 3.3-V level clock signal to the Auxiliary Phase-Locked Loop (AUXPLL), whose output is used for the USB module. The AUXCLKIN clock may also be used for the CAN module.
SD2_C27ISigma-Delta 2 channel 2 clock input
GPIO1340, 4, 8, 12V18––I/OGeneral-purpose input/output 134
SD2_D37ISigma-Delta 2 channel 3 data input
GPIO1350, 4, 8, 12U18––I/OGeneral-purpose input/output 135
SCITXDA6OSCI-A transmit data
SD2_C37ISigma-Delta 2 channel 3 clock input
GPIO1360, 4, 8, 12T17––I/OGeneral-purpose input/output 136
SCIRXDA6ISCI-A receive data
SD2_D47ISigma-Delta 2 channel 4 data input
GPIO1370, 4, 8, 12T18––I/OGeneral-purpose input/output 137
SCITXDB6OSCI-B transmit data
SD2_C47ISigma-Delta 2 channel 4 clock input
GPIO1380, 4, 8, 12T19––I/OGeneral-purpose input/output 138
SCIRXDB6ISCI-B receive data
GPIO1390, 4, 8, 12N19––I/OGeneral-purpose input/output 139
SCIRXDC6ISCI-C receive data
GPIO1400, 4, 8, 12M19––I/OGeneral-purpose input/output 140
SCITXDC6OSCI-C transmit data
GPIO1410, 4, 8, 12M18––I/OGeneral-purpose input/output 141
SCIRXDD6ISCI-D receive data
GPIO1420, 4, 8, 12L19––I/OGeneral-purpose input/output 142
SCITXDD6OSCI-D transmit data
GPIO1430, 4, 8, 12F18––I/OGeneral-purpose input/output 143
GPIO1440, 4, 8, 12F17––I/OGeneral-purpose input/output 144
GPIO1450, 4, 8, 12E17––I/OGeneral-purpose input/output 145
EPWM1A1OEnhanced PWM1 output A (HRPWM-capable)
GPIO1460, 4, 8, 12D18––I/OGeneral-purpose input/output 146
EPWM1B1OEnhanced PWM1 output B (HRPWM-capable)
GPIO1470, 4, 8, 12D17––I/OGeneral-purpose input/output 147
EPWM2A1OEnhanced PWM2 output A (HRPWM-capable)
GPIO1480, 4, 8, 12D14––I/OGeneral-purpose input/output 148
EPWM2B1OEnhanced PWM2 output B (HRPWM-capable)
GPIO1490, 4, 8, 12A13––I/OGeneral-purpose input/output 149
EPWM3A1OEnhanced PWM3 output A (HRPWM-capable)
GPIO1500, 4, 8, 12B13––I/OGeneral-purpose input/output 150
EPWM3B1OEnhanced PWM3 output B (HRPWM-capable)
GPIO1510, 4, 8, 12C13––I/OGeneral-purpose input/output 151
EPWM4A1OEnhanced PWM4 output A (HRPWM-capable)
GPIO1520, 4, 8, 12D13––I/OGeneral-purpose input/output 152
EPWM4B1OEnhanced PWM4 output B (HRPWM-capable)
GPIO1530, 4, 8, 12A12––I/OGeneral-purpose input/output 153
EPWM5A1OEnhanced PWM5 output A (HRPWM-capable)
GPIO1540, 4, 8, 12B12––I/OGeneral-purpose input/output 154
EPWM5B1OEnhanced PWM5 output B (HRPWM-capable)
GPIO1550, 4, 8, 12C12––I/OGeneral-purpose input/output 155
EPWM6A1OEnhanced PWM6 output A (HRPWM-capable)
GPIO1560, 4, 8, 12D12––I/OGeneral-purpose input/output 156
EPWM6B1OEnhanced PWM6 output B (HRPWM-capable)
GPIO1570, 4, 8, 12B10––I/OGeneral-purpose input/output 157
EPWM7A1OEnhanced PWM7 output A (HRPWM-capable)
GPIO1580, 4, 8, 12C10––I/OGeneral-purpose input/output 158
EPWM7B1OEnhanced PWM7 output B (HRPWM-capable)
GPIO1590, 4, 8, 12D10––I/OGeneral-purpose input/output 159
EPWM8A1OEnhanced PWM8 output A (HRPWM-capable)
GPIO1600, 4, 8, 12B9––I/OGeneral-purpose input/output 160
EPWM8B1OEnhanced PWM8 output B (HRPWM-capable)
GPIO1610, 4, 8, 12C9––I/OGeneral-purpose input/output 161
EPWM9A1OEnhanced PWM9 output A
GPIO1620, 4, 8, 12D9––I/OGeneral-purpose input/output 162
EPWM9B1OEnhanced PWM9 output B
GPIO1630, 4, 8, 12A8––I/OGeneral-purpose input/output 163
EPWM10A1OEnhanced PWM10 output A
GPIO1640, 4, 8, 12B8––I/OGeneral-purpose input/output 164
EPWM10B1OEnhanced PWM10 output B
GPIO1650, 4, 8, 12C5––I/OGeneral-purpose input/output 165
EPWM11A1OEnhanced PWM11 output A
GPIO1660, 4, 8, 12D5––I/OGeneral-purpose input/output 166
EPWM11B1OEnhanced PWM11 output B
GPIO1670, 4, 8, 12C4––I/OGeneral-purpose input/output 167
EPWM12A1OEnhanced PWM12 output A
GPIO1680, 4, 8, 12D4––I/OGeneral-purpose input/output 168
EPWM12B1OEnhanced PWM12 output B
RESET
XRSF1912469I/ODDevice Reset (in) and Watchdog Reset (out). The devices have a built-in power-on reset (POR) circuit. During a power-on condition, this pin is driven low by the device. An external circuit may also drive this pin to assert a device reset. This pin is also driven low by the MCU when a watchdog reset or NMI watchdog reset occurs. During watchdog reset, the XRS pin is driven low for the watchdog reset duration of 512 OSCCLK cycles. A resistor with a value from 2.2 kΩ to 10 kΩ should be placed between XRS and VDDIO. If a capacitor is placed between XRS and VSS for noise filtering, it should be 100 nF or smaller. These values will allow the watchdog to properly drive the XRS pin to VOL within 512 OSCCLK cycles when the watchdog reset is asserted. The output buffer of this pin is an open drain with an internal pullup. If this pin is driven by an external device, it should be done using an open-drain device.
CLOCKS
X1G1912368IOn-chip crystal-oscillator input. To use this oscillator, a quartz crystal must be connected across X1 and X2. If this pin is not used, it must be tied to GND.
This pin can also be used to feed a single-ended 3.3-V level clock. In this case, X2 is a No Connect (NC).
X2J1912166OOn-chip crystal-oscillator output. A quartz crystal may be connected across X1 and X2. If X2 is not used, it must be left unconnected.
NO CONNECT
NCH4––No connect. BGA ball is electrically open and not connected to the die.
JTAG
TCKV158150IJTAG test clock with internal pullup (see Section 6.6)
TDIW137746IJTAG test data input (TDI) with internal pullup. TDI is clocked into the selected register (instruction or data) on a rising edge of TCK.
TDOW157847O/ZJTAG scan out, test data output (TDO). The contents of the selected register (instruction or data) are shifted out of TDO on the falling edge of TCK.(3)
TMSW148049IJTAG test-mode select (TMS) with internal pullup. This serial control input is clocked into the TAP controller on the rising edge of TCK.
TRSTV147948IJTAG test reset with internal pulldown. TRST, when driven high, gives the scan system control of the operations of the device. If this signal is driven low, the device operates in its functional mode, and the test reset signals are ignored. NOTE: TRST must be maintained low at all times during normal device operation, so an external pulldown resistor is required on this pin for protection against noise spikes. The value of this resistor should be as small as possible, so long as the JTAG debug probe is still able to drive the TRST pin high. A resistor between 2.2-kΩ and 10-kΩ generally offers adequate protection. Since the value of the resistor is application-specific, TI recommends that each target board be validated for proper operation of the debug probe and the application. This pin has an internal 50-ns (nominal) glitch filter.
INTERNAL VOLTAGE REGULATOR CONTROL
VREGENZJ1811964IInternal voltage regulator enable with internal pulldown. The internal VREG is not supported and must be disabled. Connect VREGENZ to VDDIO.
ANALOG, DIGITAL, AND I/O POWER
VDDE916161.2-V digital logic power pins. There are two options for placing the decoupling capacitors.
  • Option 1 - Even Distribution: Distribute decoupling capacitance evenly across each VDD pin with a minimum total capacitance of approximately 20uF.
  • Option 2 - Bulk Capacitance: Place a 1uF capacitor near each VDD pin and place the remainder of the minimum total 20uF capacitance as bulk capacitance on the VDD net .
The exact value of the decoupling capacitance should be determined by your system voltage regulation solution.
E112139
F96145
F117663
G1411771
G1512678
J1413784
J1515389
K515895
K6169–
P10––
P13––
R10––
R13––
VDD3VFLR1172413.3-V Flash power pin. Place a minimum 0.1-µF decoupling capacitor on each pin.
R12––
VDDAP636183.3-V analog power pins. Place a minimum 2.2-µF decoupling capacitor to VSSA on each pin.
R65438
VDDIOA9323.3-V digital I/O power pins. Place a minimum 0.1-µF decoupling capacitor on each pin. The exact value of the decoupling capacitance should be determined by your system voltage regulation solution.
A181110
B11515
E72040
E102644
E136255
E166862
F47572
F78279
F108883
F139190
F169994
G4106–
G5114–
G6116–
H5127–
H6138–
L14147–
L15152–
M1159–
M5168–
M6––
N14––
N15––
P9––
R9––
V19––
W8––
VDDOSCH1612065Power pins for the 3.3-V on-chip crystal oscillator (X1 and X2) and the two zero-pin internal oscillators (INTOSC). Place a 0.1-μF (minimum) decoupling capacitor on each pin.
H1712570
VSSA1PWR
PAD
(177)		PWR
PAD
(101)		Device ground. For Quad Flatpacks (QFPs), the PowerPAD on the bottom of the package must be soldered to the ground plane of the PCB.
A10
A19
E5
E6
E8
E12
E14
E15
F5
F6
F8
F12
F14
F15
G16
G17
H8
H9
H10
H11
H12
H14
H15
J5
J6
J8
J9
J10
J11
J12
K8
K9
K10
K11
K12
K14
K15
L5
L6
L8
L9
VSSL10PWR
PAD
(177)		PWR
PAD
(101)		Device ground. For Quad Flatpacks (QFPs), the PowerPAD on the bottom of the package must be soldered to the ground plane of the PCB.
L11
L12
L18
M8
M9
M10
M11
M12
M14
M15
N1
N5
N6
P7
P8
P11
P12
P14
P15
R7
R8
R14
R15
W7
W19
VSSOSCH1812267Crystal oscillator (X1 and X2) ground pin. When using an external crystal, do not connect this pin to the board ground. Instead, connect it to the ground reference of the external crystal oscillator circuit.
If an external crystal is not used, this pin may be connected to the board ground.
H19––
VSSAP13417Analog ground.
On the PZP package, pin 17 is double-bonded to VSSA and VREFLOA. This pin must be connect to VSSA.
P55235
R5–36
V7––
W1––
SPECIAL FUNCTIONS
ERRORSTSU1992–OError status output. This pin has an internal pulldown.
TEST PINS
FLT1W127342I/OFlash test pin 1. Reserved for TI. Must be left unconnected.
FLT2V137443I/OFlash test pin 2. Reserved for TI. Must be left unconnected.
(1) I = Input, O = Output, OD = Open Drain, Z = High Impedance
(2) High-Speed SPI-enabled GPIO mux option. This pin mux option is required when using the SPI in High-Speed Mode (HS_MODE = 1 in SPICCR). This mux option is still available when not using the SPI in High-Speed Mode (HS_MODE = 0 in SPICCR).
(3) This pin has output impedance that can be as low as 22 Ω. This output could have fast edges and ringing depending on the system PCB characteristics. If this is a concern, the user should take precautions such as adding a 39Ω (10% tolerance) series termination resistor or implement some other termination scheme. It is also recommended that a system-level signal integrity analysis be performed with the provided IBIS models. The termination is not required if this pin is used for input function.

 
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