SWAS035C September   2016  – May 2021 CC3220R , CC3220S , CC3220SF

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes and Pin Multiplexing
      1. 7.2.1 Pin Descriptions
    3. 7.3 Signal Descriptions
      1. 7.3.1 Signal Descriptions
    4. 7.4 Pin Multiplexing
    5. 7.5 Drive Strength and Reset States for Analog and Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Chip But Before Reset Release
    7. 7.7 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary (CC3220R, CC3220S)
    6. 8.6  Current Consumption Summary (CC3220SF)
    7. 8.7  TX Power and IBAT versus TX Power Level Settings
    8. 8.8  Brownout and Blackout Conditions
    9. 8.9  Electrical Characteristics (3.3 V, 25°C)
    10. 8.10 WLAN Receiver Characteristics
    11. 8.11 WLAN Transmitter Characteristics
    12. 8.12 WLAN Filter Requirements
      1. 8.12.1 WLAN Filter Requirements
    13. 8.13 Thermal Resistance Characteristics
      1. 8.13.1 Thermal Resistance Characteristics for RGK Package
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Power Supply Sequencing
      2. 8.14.2 Device Reset
      3. 8.14.3 Reset Timing
        1. 8.14.3.1 nRESET (32-kHz Crystal)
        2. 8.14.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 8.14.3.3 nRESET (External 32-kHz)
          1. 8.14.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz)
      4. 8.14.4 Wakeup From HIBERNATE Mode
      5. 8.14.5 Clock Specifications
        1. 8.14.5.1 Slow Clock Using Internal Oscillator
          1. 8.14.5.1.1 RTC Crystal Requirements
        2. 8.14.5.2 Slow Clock Using an External Clock
          1. 8.14.5.2.1 External RTC Digital Clock Requirements
        3. 8.14.5.3 Fast Clock (Fref) Using an External Crystal
          1. 8.14.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 8.14.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 8.14.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 8.14.6 Peripherals Timing
        1. 8.14.6.1  SPI
          1. 8.14.6.1.1 SPI Master
            1. 8.14.6.1.1.1 SPI Master Timing Parameters
          2. 8.14.6.1.2 SPI Slave
            1. 8.14.6.1.2.1 SPI Slave Timing Parameters
        2. 8.14.6.2  I2S
          1. 8.14.6.2.1 I2S Transmit Mode
            1. 8.14.6.2.1.1 I2S Transmit Mode Timing Parameters
          2. 8.14.6.2.2 I2S Receive Mode
            1. 8.14.6.2.2.1 I2S Receive Mode Timing Parameters
        3. 8.14.6.3  GPIOs
          1. 8.14.6.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1. 8.14.6.3.1.1 GPIO Output Transition Times (Vsupply = 3.3 V) (1) (1)
          2. 8.14.6.3.2 GPIO Output Transition Time Parameters (Vsupply = 1.85 V)
            1. 8.14.6.3.2.1 GPIO Output Transition Times (Vsupply = 1.85 V) (1) (1)
          3. 8.14.6.3.3 GPIO Input Transition Time Parameters
            1. 8.14.6.3.3.1 GPIO Input Transition Time Parameters'
        4. 8.14.6.4  I2C
          1. 8.14.6.4.1 I2C Timing Parameters (1)
        5. 8.14.6.5  IEEE 1149.1 JTAG
          1. 8.14.6.5.1 JTAG Timing Parameters
        6. 8.14.6.6  ADC
          1. 8.14.6.6.1 ADC Electrical Specifications
        7. 8.14.6.7  Camera Parallel Port
          1. 8.14.6.7.1 Camera Parallel Port Timing Parameters
        8. 8.14.6.8  UART
        9. 8.14.6.9  SD Host
        10. 8.14.6.10 Timers
  9. 9 Detailed Description
    1. 9.1 Arm® Cortex®-M4 Processor Core Subsystem
    2. 9.2 Wi-Fi Network Processor Subsystem
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
    3. 9.3 Security
    4. 9.4 Power-Management Subsystem
      1. 9.4.1 VBAT Wide-Voltage Connection
      2. 9.4.2 Preregulated 1.85-V Connection
    5. 9.5 Low-Power Operating Mode
    6. 9.6 Memory
      1. 9.6.1 External Memory Requirements
      2. 9.6.2 Internal Memory
        1. 9.6.2.1 SRAM
        2. 9.6.2.2 ROM
        3. 9.6.2.3 Flash Memory
        4. 9.6.2.4 Memory Map
    7. 9.7 Restoring Factory Default Configuration
    8. 9.8 Boot Modes
      1. 9.8.1 Boot Mode List
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application —CC3220x Wide-Voltage Mode
      2. 10.1.2 Typical Application Schematic—CC3220x Preregulated, 1.85-V Mode
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interfaces
      4. 10.2.4 Digital Input and Output
      5. 10.2.5 RF Interface
  11. 11Device and Documentation Support
    1. 11.1 Development Tools and Software
    2. 11.2 Firmware Updates
    3. 11.3 Device Nomenclature
    4. 11.4 Documentation Support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

1 Features

  • Dual-Core Architecture:
    • User-Dedicated Application MCU Subsystem
    • Highly-Integrated Wi-Fi Network Processor
  • Rich Set of IoT Security Features:
    • Enhanced IoT Networking Security
    • Asymmetric Keys and Unique Device Identity
    • Software IP Protection and Secure Storage (CC3220S/CC3220SF)
  • Advanced Low-Power Modes for Battery Powered Applications
  • Built-In Power Management Subsystem
  • Industrial Temperature: –40°C to 85°C
  • Chip-Level Wi-Fi Alliance®Wi-Fi CERTIFIED™

Extended Features List:

  • Applications Microcontroller Subsystem:
    • Arm®Cortex®-M4 Core at 80 MHz
    • Embedded Memory:
      • 256KB of RAM
      • Optional 1MB of Executable Flash
      • External Serial Flash
    • Peripherals:
      • McASP Supports Two I2S Channels
      • SD, SPI, I2C, UART
      • 8-Bit Synchronous Imager Interface
      • 4-Channel 12-Bit ADCs
      • 4 General-Purpose Timers (GPT) With 16-Bit PWM Mode
      • Watchdog Timer
      • Up to 27 GPIO Pins
      • Debug Interfaces: JTAG, cJTAG, SWD
  • Wi-Fi Network Processor (NWP) Subsystem:
    • Wi-Fi Modes:
      • 802.11b/g/n Station
      • 802.11b/g Access Point (AP) Supports up to Four Stations
      • Wi-Fi Direct® Client and Group Owner
    • WPA2 Personal and Enterprise Security: WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise (802.1x), WPA3™ Personal, WPA3™ Enterprise
    • IPv4 and IPv6 TCP/IP Stack
    • Industry-Standard BSD Socket Application Programming Interfaces (APIs):
      • 16 Simultaneous TCP or UDP Sockets
      • 6 Simultaneous TLS and SSL Sockets
    • IP Addressing: Static IP, LLA, DHCPv4, DHCPv6 With Duplicate Address Detection (DAD)
    • SimpleLink Connection Manager for Autonomous and Fast Wi-Fi Connections
    • Flexible Wi-Fi Provisioning With SmartConfig™ Technology, AP Mode, and WPS2 Options
    • RESTful API Support Using the Internal HTTP Server
    • Wide Set of Security Features:
      • Hardware Features:
        • Separate Execution Environments
        • Device Identity
        • Hardware Crypto Engine for Advanced Fast Security, Including: AES, DES, 3DES, SHA2, MD5, CRC, and Checksum
        • Initial Secure Programming:
          • Debug Security
          • JTAG and Debug Ports are Locked
        • Personal and Enterprise Wi-Fi Security
        • Secure Sockets (SSLv3, TLS1.0, TLS1.1, TLS1.2)
      • Networking Security:
        • Personal and Enterprise Wi-Fi Security
        • Secure Sockets (SSLv3, TLS1.0, TLS1.1, TLS1.2)
        • HTTPS Server
        • Trusted Root-Certificate Catalog
        • TI Root-of-Trust Public Key
      • Software IP Protection:
        • Secure Key Storage
        • File System Security
        • Software Tamper Detection
        • Cloning Protection
        • Secure Boot: Validate the Integrity and Authenticity of the Runtime Binary During Boot
    • Embedded Network Applications Running on the Dedicated Network Processor:
      • HTTP/HTTPS Web Server With Dynamic User Callbacks
      • mDNS, DNS-SD, DHCP Server
      • Ping
    • Recovery Mechanism—Can Recover to Factory Defaults or to a Complete Factory Image
    • Wi-Fi TX Power:
      • 18.0 dBm at 1 DSSS
      • 14.5 dBm at 54 OFDM
    • Wi-Fi RX Sensitivity:
      • –96 dBm at 1 DSSS
      • –74.5 dBm at 54 OFDM
    • Application Throughput:
      • UDP: 16 Mbps
      • TCP: 13 Mbps
      • Peak: 72 Mbps
  • Power-Management Subsystem:
    • Integrated DC/DC Converters Support a Wide Range of Supply Voltage:
      • VBAT Wide-Voltage Mode: 2.1 V to 3.6 V
      • VIO is Always Tied With VBAT
      • Preregulated 1.85-V Mode
    • Advanced Low-Power Modes:
      • Shutdown: 1 µA
      • Hibernate: 4.5 µA
      • Low-Power Deep Sleep (LPDS): 135 µA (Measured on CC3220R, CC3220S, and CC3220SF With 256KB RAM Retention)
      • RX Traffic (MCU Active): 59 mA (Measured on CC3220R and CC3220S; CC3220SF Consumes an Additional 10 mA) at 54 OFDM
      • TX Traffic (MCU Active): 223 mA (Measured on CC3220R and CC3220S; CC3220SF Consumes an Additional 15 mA) at 54 OFDM, Maximum Power
      • Idle Connected (MCU in LPDS): 710 µA (Measured on CC3220R and CC3220S With 256KB RAM Retention) at DTIM = 1
  • Clock Source:
    • 40.0-MHz Crystal With Internal Oscillator
    • 32.768-kHz Crystal or External RTC
  • RGK Package
    • 64-Pin, 9-mm × 9-mm Very Thin Quad Flat Nonleaded (VQFN) Package, 0.5-mm Pitch
  • Operating Temperature
    • Ambient Temperature Range: –40°C to +85°C
  • Device Supports SimpleLink™ MCU Platform Developer's Ecosystem