SLVSIQ9
February 2026
MSPM0G1218
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Functional Block Diagram
5
Device Comparison
6
Pin Configuration and Functions
6.1
Pin Diagrams
6.2
Pin Attributes
10
6.3
Signal Descriptions
12
13
14
15
16
17
18
19
20
21
22
6.4
Connections for Unused Pins
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Supply Current Characteristics
7.5.1
RUN/SLEEP Modes
7.5.2
STOP/STANDBY Modes
7.5.3
SHUTDOWN Mode
7.6
Power Supply Sequencing
7.6.1
Power Supply Ramp
7.6.2
POR and BOR
7.7
Flash Memory Characteristics
7.8
Timing Characteristics
7.9
Clock Specifications
7.9.1
System Oscillator (SYSOSC)
7.9.2
Low Frequency Oscillator (LFOSC)
7.9.3
System Phase Lock Loop (SYSPLL)
7.9.4
Low Frequency Crystal/Clock
7.9.5
High Frequency Crystal/Clock
7.10
Digital IO
7.10.1
Electrical Characteristics
7.10.2
Switching Characteristics
7.11
Analog Mux VBOOST
7.12
ADC
7.12.1
Electrical Characteristics
7.12.2
Switching Characteristics
7.12.3
Linearity Parameters
7.12.4
Typical Connection Diagram
7.13
Temperature Sensor
7.14
VREF1
7.14.1
Voltage Characteristics
7.14.2
Electrical Characteristics
7.15
VREF2
7.15.1
Voltage Characteristics
7.15.2
Electrical Characteristics
7.16
Comparator (COMP)
7.16.1
Comparator Electrical Characteristics
7.17
I2C
7.17.1
I2C Characteristics
7.17.2
I2C Filter
7.17.3
I2C Timing Diagram
7.18
SPI
7.18.1
SPI
7.18.2
SPI Timing Diagram
7.19
UART
7.20
TIMx
7.21
TRNG
7.21.1
TRNG Electrical Characteristics
7.22
Emulation and Debug
7.22.1
SWD Timing
8
Detailed Description
8.1
Functional Block Diagram
8.2
CPU
8.3
Operating Modes
8.3.1
Functionality by Operating Mode (MSPM0Gx218, MSPM0Gx207, MSPM0G122x)
8.4
Power Management Unit (PMU)
8.5
Clock Module (CKM)
8.6
DMA
8.7
Events
8.8
Memory
8.8.1
Memory Organization
8.8.2
Peripherals Summary
8.8.3
Peripheral Interrupt Vector
8.9
Flash Memory
8.10
SRAM
8.11
GPIO
8.12
IOMUX
8.13
ADC
8.14
Temperature Sensor
8.15
VREF
8.16
COMP
8.17
Security
8.18
AESADV
8.19
Keystore
8.20
CRC-P
8.21
MATHACL
8.22
UNICOMM (UART/SPI/I2C)
8.22.1
UART (UNICOMM)
8.22.2
I2C (UNICOMM)
8.22.3
SPI (UNICOMM)
8.23
UART
8.24
I2C
8.25
SPI
8.26
CAN-FD
8.27
Low-Frequency Sub System (LFSS)
8.28
RTC_B
8.29
IWDT_B
8.30
WWDT
8.31
Timers (TIMx)
8.32
Input/Output Diagrams
8.33
Device Analog Connections
8.34
Serial Wire Debug Interface
8.35
Boot Strap Loader (BSL)
8.36
Device Factory Constants
8.37
Identification
9
Applications, Implementation, and Layout
9.1
Typical Application
9.1.1
Schematic
10
Device and Documentation Support
10.1
Getting Started and Next Steps
10.2
Device Nomenclature
10.3
Tools and Software
10.4
Documentation Support
10.5
Support Resources
10.6
Trademarks
10.7
Electrostatic Discharge Caution
10.8
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGZ|48
MPQF123F
RHB|32
MPQF130D
Thermal pad, mechanical data (Package|Pins)
Data Sheet
Mixed-Signal Microcontrollers With CAN-FD Interface