DATA SHEET
MUX36xxx 36-V, low-capacitance, low-leakage-current, precision, analog multiplexers
1 Features
- Low On-Capacitance
- MUX36S08: 9.4 pF
- MUX36D04: 6.7 pF
- Low Input Leakage: 1 pA
- Low Charge Injection: 0.3 pC
- Rail-to-Rail Operation
- Wide Supply Range: ±5 V to ±18 V, 10 V to 36 V
- Low On-Resistance: 125 Ω
- Transition Time: 92 ns
- Break-Before-Make Switching Action
- EN Pin Connectable to VDD
- Logic Levels: 2 V to VDD
- Low Supply Current: 45 µA
- ESD Protection HBM: 2000 V
- Industry-Standard TSSOP and smaller WQFN Package
- For Other Configurations, Refer to:
- TMUX6111/ 12/ 13 (4 ch. SPST)
- TMUX6121/ 22/ 23 (2 ch. SPST)
- TMUX6119 (1 ch. SPDT)
- TMUX6136 (2 ch. SPDT)
- TMUX6104 (1 ch. 4:1)
2 Applications
- Factory Automation and Industrial Process Controls
- Programmable Logic Controllers (PLC)
- Analog Input Modules
- ATE Test Equipment
- Battery Monitoring Systems
3 Description
The MUX36S08 and MUX36D04 (MUX36xxx) are modern complementary metal-oxide semiconductor (CMOS) analog multiplexers (muxes). The MUX36S08 offers 8:1 single-ended channels, whereas the MUX36D04 offers differential 4:1 or dual 4:1 single-ended channels. The MUX36S08 and MUX36D04 work equally well with either dual supplies (±5 V to ±18 V) or a single supply (10 V to 36 V). They also perform well with symmetric supplies (such as VDD = 12 V, VSS = –12 V), and unsymmetric supplies (such as VDD = 12 V,
VSS = –5 V). All digital inputs have TTL-logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range.
The MUX36S08 and MUX36D04 have very low on and off leakage currents, allowing these multiplexers to switch signals from high input impedance sources with minimal error. A low supply current of 45 µA enables use in portable applications.
Device Information(1)
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| MUX36S08
MUX36D04 |
TSSOP (16) | 5.00 mm × 4.40 mm |
| WQFN (16) | 4.00 mm x 4.00 mm |
- For all available packages, see the package option addendum at the end of the data sheet.
SPACER
Device Images
Simplified Schematic
Leakage Current vs Temperature
4 Revision History
Changes from C Revision (April 2018) to D Revision
- Added Feature: For Other Configurations, Refer toGo
- Added RRJ (WQFN) package option to the MUX36D08 Go
- Changed the WQFN S6 pin number From: 19 To: 9Go
- Added the RRJ package option to the MUX36D04 Go
- Added WQFN (RRJ) data to Thermal InformationGo
- Changed On-resistance drift unit value From: Ω To: %/°CGo
- Changed IDL(ON) unit value From: nA To: pAGo
Changes from B Revision (July 2016) to C Revision
- Added WQFN Package option in FeaturesGo
- Added WQFN package option in Device Information Go
- Changed Description column of MUX36D04 row in Device Comparison TableGo
- Added WQFN (RUM) data to Thermal InformationGo
- Changed On-resistance drift TYP value From: 0.52 To: 0.64 in Electrical Characteristics: Dual SupplyGo
- Changed Analog Switch, ID parameter in Electrical Characteristics: Dual Supply table: split parameter into ID(OFF) and ID(ON) parameters, changed symbols, parameter names, and test conditions Go
- Changed Analog Switch, IDL(ON) parameter test conditions in Electrical Characteristics: Dual Supply tableGo
- Changed On-resistance drift TYP value From: 0.47 To: 1.13 in Electrical Characteristics: Single SupplyGo
- Changed Analog Switch, ID parameter in Electrical Characteristics: Single Supply table: split parameter into ID(OFF) and ID(ON) parameters, changed symbols, parameter names, and ID(ON) test conditions Go
- Changed and swapped data between 25°C and 85°C to fix the typo Go
- Changed Figure 30: changed low-voltage level to 0 VGo
- Changed Figure 33: added 0 V line, flipped VS supply symbolGo
- Changed Figure 37: changed 5 VRMS marking in Audio Precision boxGo
- Changed description of MUX36D04 in Overview sectionGo
- Changed Figure 43: changed OPA140 amplifier and charge kickback filter boxGo
Changes from A Revision (January 2016) to B Revision
- Added differential on-leakage current parameter to Electrical Characteristics table Go
- Added Differential On-Leakage Current sectionGo
Changes from * Revision (January 2016) to A Revision
- Changed from product preview to production dataGo
6 Pin Configuration and Functions
MUX36S08: RUM and RRJ Package
16-Pin WQFN
Top View
RUM and RRJ have the same package dimension, but different thermal pad dimension and lead finger length.
Pin Functions: MUX36S08
| PIN | FUNCTION | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | TSSOP | WQFN | ||
| A0 | 1 | 15 | Digital input | Address line 0 |
| A1 | 16 | 14 | Digital input | Address line 1 |
| A2 | 15 | 13 | Digital input | Address line 2 |
| D | 8 | 6 | Analog input or output | Drain pin. Can be an input or output. |
| EN | 2 | 16 | Digital input | Active high digital input. When this pin is low, all switches are turned off. When this pin is high, the A[2:0] logic inputs determine which switch is turned on. |
| GND | 14 | 12 | Power supply | Ground (0 V) reference |
| S1 | 4 | 2 | Analog input or output | Source pin 1. Can be an input or output. |
| S2 | 5 | 3 | Analog input or output | Source pin 2. Can be an input or output. |
| S3 | 6 | 4 | Analog input or output | Source pin 3. Can be an input or output. |
| S4 | 7 | 5 | Analog input or output | Source pin 4. Can be an input or output. |
| S5 | 12 | 10 | Analog input or output | Source pin 5. Can be an input or output. |
| S6 | 11 | 9 | Analog input or output | Source pin 6. Can be an input or output. |
| S7 | 10 | 8 | Analog input or output | Source pin 7. Can be an input or output. |
| S8 | 9 | 7 | Analog input or output | Source pin 8. Can be an input or output. |
| VDD | 13 | 11 | Power supply | Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND. |
| VSS | 3 | 1 | Power supply | Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VSS and GND. |
| Thermal Pad(1) | - | - | Power supply | Exposed Pad. The exposed pad is electrically connected to VSS internally. Connect EP to VSS to achieve rated thermal and ESD performance. |
(1) RUM and RRJ have the same package dimension, but different thermal pad dimension and lead finger length.
MUX36D04: PW Package
16-Pin TSSOP
Top View
MUX36D04: RUM and RRJ Package
16-Pin WQFN
Top View
RUM and RRJ have the same package dimension, but different thermal pad dimension and lead finger length.
Pin Functions: MUX36D04
| PIN | FUNCTION | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | TSSOP | WQFN | ||
| A0 | 1 | 15 | Digital input | Address line 0 |
| A1 | 16 | 14 | Digital input | Address line 1 |
| DA | 8 | 6 | Analog input or output | Drain pin A. Can be an input or output. |
| DB | 9 | 7 | Analog input or output | Drain pin B. Can be an input or output. |
| EN | 2 | 16 | Digital input | Active high digital input. When this pin is low, all switches are turned off. When this pin is high, the A[1:0] logic inputs determine which pair of switches is turned on. |
| GND | 15 | 13 | Power supply | Ground (0 V) reference |
| S1A | 4 | 2 | Analog input or output | Source pin 1A. Can be an input or output. |
| S2A | 5 | 3 | Analog input or output | Source pin 2A. Can be an input or output. |
| S3A | 6 | 4 | Analog input or output | Source pin 3A. Can be an input or output. |
| S4A | 7 | 5 | Analog input or output | Source pin 4A. Can be an input or output. |
| S1B | 13 | 11 | Analog input or output | Source pin 1B. Can be an input or output. |
| S2B | 12 | 10 | Analog input or output | Source pin 2B. Can be an input or output. |
| S3B | 11 | 9 | Analog input or output | Source pin 3B. Can be an input or output. |
| S4B | 10 | 8 | Analog input or output | Source pin 4B. Can be an input or output. |
| VDD | 14 | 12 | Power supply | Positive power supply. This pin is the most positive power supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND. |
| VSS | 3 | 1 | Power supply | Negative power supply. This pin is the most negative power supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VSS and GND. |
| Thermal Pad(1) | - | - | Power supply | Exposed Pad. The exposed pad is electrically connected to VSS internally. Connect EP to VSS to achieve rated thermal and ESD performance. |
(1) RUM and RRJ have the same package dimension, but different thermal pad dimension and lead finger length.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| Voltage | Supply | VDD | –0.3 | 40 | V |
| VSS | –40 | 0.3 | |||
| VDD – VSS | 40 | ||||
| Digital input pins: (3)EN, A0, A1, A2 | VSS – 0.3 | VDD + 0.3 | V | ||
| Analog input pins: (3)Sx, SxA, SxB, D, DA, DB | VSS – 2 | VDD + 2 | V | ||
| Current(2) | –30 | 30 | mA | ||
| Temperature | Operating, TA | –55 | 150 | °C | |
| Junction, TJ | 150 | ||||
| Storage, Tstg | –65 | 150 | |||
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Voltage limits are valid if current is limited to ±30 mA.
(3) Only one pin at a time
7.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
| MIN | NOM | MAX | UNIT | |||
|---|---|---|---|---|---|---|
| VDD(1) | Positive power-supply voltage | Dual supply | 5 | 18 | V | |
| Single supply | 10 | 36 | ||||
| VSS(2) | Negative power-supply voltage (dual supply) | –5 | –18 | V | ||
| VDD – VSS | Supply voltage | 10 | 36 | V | ||
| VS | Source pins voltage(3) | VSS | VDD | V | ||
| VD | Drain pins voltage | VSS | VDD | V | ||
| VEN | Enable pin voltage | VSS | VDD | V | ||
| VA | Address pins voltage | VSS | VDD | V | ||
| ICH | Channel current (TA = 25°C) | –25 | 25 | mA | ||
| TA | Operating temperature | –40 | 125 | °C | ||
(1) When VSS = 0 V, VDD can range from 10 V to 36 V.
(2) VDD and VSS can be any value as long as 10 V ≤ (VDD – VSS) ≤ 36 V.
(3) VS is the voltage on all S pins.
7.4 Thermal Information
| THERMAL METRIC(1) | MUX36S08 and MUX36D04 | UNIT | |||
|---|---|---|---|---|---|
| PW (TSSOP) | RUM (WQFN) | RRJ (WQFN) | |||
| 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 103.8 | 37.3 | 46.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 36.8 | 31.6 | 37.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 49.8 | 16.2 | 21.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 2.7 | 0.5 | 0.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 49.1 | 16.2 | 21.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 6.1 | 6.2 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
7.5 Electrical Characteristics: Dual Supply
at TA = 25°C, VDD = 15 V, and VSS = –15 V (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| ANALOG SWITCH | |||||||
| Analog signal range | TA = –40°C to +125°C | VSS | VDD | V | |||
| RON | On-resistance | VS = 0 V, ICH = 1 mA | 125 | 170 | Ω | ||
| VS = ±10 V, ICH = 1 mA | 145 | 200 | Ω | ||||
| TA = –40°C to +85°C | 230 | ||||||
| TA = –40°C to +125°C | 250 | ||||||
| ΔRON | On-resistance mismatch between channels | VS = ±10 V, ICH = 1 mA | 2.4 | 6 | Ω | ||
| TA = –40°C to +85°C | 9 | ||||||
| TA = –40°C to +125°C | 11 | ||||||
| RFLAT | On-resistance flatness | VS = 10 V, 0 V, –10 V | 2.4 | 6 | Ω | ||
| TA = –40°C to +85°C | 53 | ||||||
| TA = –40°C to +125°C | 58 | ||||||
| On-resistance drift | VS = 0 V | 0.64 | %/°C | ||||
| IS(OFF) | Input leakage current | Switch state is off,
VS = ±10 V, VD = ±10 V(2) |
–0.04 | 0.001 | 0.04 | nA | |
| TA = –40°C to +85°C | –0.15 | 0.15 | |||||
| TA = –40°C to +125°C | –1.9 | 1.9 | |||||
| ID(OFF) | Output off leakage current | Switch state is off,
VS = ±10 V, VD = ±10 V(2) |
–0.1 | 0.005 | 0.1 | nA | |
| TA = -40°C to +85°C | –0.5 | 0.5 | |||||
| TA = –40°C to +125°C | –2 | 2 | |||||
| ID(ON) | Output on leakage current | Switch state is on,
VD = ±10 V, VS = floating |
–0.1 | 0.008 | 0.1 | nA | |
| TA = –40°C to +85°C | –0.5 | 0.5 | |||||
| TA = –40°C to +125°C | –3.3 | 3.3 | |||||
| IDL(ON) | Differential on-leakage current | Switch state is on,
VDA = VDB = ±10 V, VS = floating |
–15 | 3 | 15 | pA | |
| TA = –40°C to +85°C | –100 | 100 | |||||
| TA = –40°C to +125°C | –500 | 500 | |||||
| LOGIC INPUT | |||||||
| VIH | Logic voltage high | 2 | V | ||||
| VIL | Logic voltage low | 0.8 | V | ||||
| ID | Input current | 0.15 | µA | ||||
| SWITCH DYNAMICS(1) | |||||||
| tON | Enable turn-on time | VS = ±10 V, RL = 300 Ω,
CL= 35 pF |
88 | 136 | ns | ||
| TA = –40°C to +85°C | 144 | ||||||
| TA = –40°C to +125°C | 151 | ||||||
| tOFF | Enable turn-off time | VS = ±10 V, RL = 300 Ω,
CL= 35 pF |
63 | 75 | ns | ||
| TA = –40°C to +85°C | 83 | ||||||
| TA = –40°C to +125°C | 90 | ||||||
| tt | Transition time | VS = 10 V, RL = 300 Ω,
CL= 35 pF |
92 | 143 | ns | ||
| TA = –40°C to +85°C | 151 | ||||||
| TA = –40°C to +125°C | 157 | ||||||
| tBBM | Break-before-make time delay | VS = 10 V, RL = 300 Ω, CL= 35 pF, TA = –40°C to +125°C | 30 | 54 | ns | ||
| QJ | Charge injection | CL = 1 nF, RS = 0 Ω | VS = 0 V | 0.3 | pC | ||
| VS = –15 V to +15 V | ±0.6 | ||||||
| Off-isolation | RL = 50 Ω, VS = 1 VRMS,
f = 1 MHz |
Nonadjacent channel to D, DA, DB | –96 | dB | |||
| Adjacent channel to D, DA, DB | –85 | ||||||
| Channel-to-channel crosstalk | RL = 50 Ω, VS = 1 VRMS,
f = 1 MHz |
Nonadjacent channels | –96 | dB | |||
| Adjacent channels | –88 | ||||||
| CS(OFF) | Input off-capacitance | f = 1 MHz, VS = 0 V | 2.4 | 2.9 | pF | ||
| CD(OFF) | Output off-capacitance | f = 1 MHz, VS = 0 V | MUX36S08 | 7.5 | 8.4 | pF | |
| MUX36D04 | 4.3 | 5 | |||||
| CS(ON), CD(ON) | Output on-capacitance | f = 1 MHz, VS = 0 V | MUX36S08 | 9.4 | 10.6 | pF | |
| MUX36D04 | 6.7 | 7.7 | |||||
| POWER SUPPLY | |||||||
| VDD supply current | All VA = 0 V or 3.3 V,
VS = 0 V, VEN = 3.3 V |
45 | 59 | µA | |||
| TA = –40°C to +85°C | 62 | ||||||
| TA = –40°C to +125°C | 83 | ||||||
| VSS supply current | All VA = 0 V or 3.3 V,
VS = 0 V, VEN = 3.3 V |
25 | 34 | µA | |||
| TA = –40°C to +85°C | 37 | ||||||
| TA = –40°C to +125·C | 57 | ||||||
(1) Specified by design, not subject to production testing.
(2) When VS is positive, VD is negative, and vice versa.
7.6 Electrical Characteristics: Single Supply
at TA = 25°C, VDD = 12 V, and VSS = 0 V (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| ANALOG SWITCH | |||||||
| Analog signal range | TA = –40°C to +125°C | VSS | VDD | V | |||
| RON | On-resistance | VS = 10 V, ICH = 1 mA | 235 | 340 | Ω | ||
| TA = –40°C to +85°C | 390 | ||||||
| TA = –40°C to +125°C | 430 | ||||||
| ΔRON | On-resistance match | VS = 10 V, ICH = 1 mA | 3.1 | 12 | Ω | ||
| TA = –40°C to +85°C | 19 | ||||||
| TA = –40°C to +125°C | 23 | ||||||
| On-resistance drift | VS = 10 V | 1.13 | %/°C | ||||
| IS(OFF) | Input leakage current | Switch state is off,
VS = 1 V and VD = 10 V, or VS = 10 V and VD = 1 V(1) |
–-0.04 | 0.001 | 0.04 | nA | |
| TA = –40°C to +85°C | –0.15 | 0.15 | |||||
| TA = –40°C to +125°C | –1.9 | 1.9 | |||||
| ID(OFF) | Output off leakage current | Switch state is off,
VS = 1 V and VD = 10 V, or VS = 10 V and VD = 1 V(1) |
–0.1 | 0.005 | 0.1 | nA | |
| TA = –40°C to +85°C | –0.5 | 0.5 | |||||
| TA = –40°C to +125°C | –2 | 2 | |||||
| ID(ON) | Output on leakage current | Switch state is on,
VD = 1 V and 10 V, VS = floating |
–0.1 | 0.008 | 0.1 | nA | |
| TA = –40°C to +85°C | –0.5 | 0.5 | |||||
| TA = –40°C to +125°C | –3.3 | 3.3 | |||||
| LOGIC INPUT | |||||||
| VIH | Logic voltage high | 2.0 | V | ||||
| VIL | Logic voltage low | 0.8 | V | ||||
| ID | Input current | 0.15 | µA | ||||
| SWITCH DYNAMIC CHARACTERISTICS(2) | |||||||
| tON | Enable turn-on time | VS = 8 V, RL = 300 Ω,
CL= 35 pF |
85 | 140 | ns | ||
| TA = –40°C to +85°C | 145 | ||||||
| TA = –40°C to +125°C | 149 | ||||||
| tOFF | Enable turn-off time | VS = 8 V, RL = 300 Ω,
CL= 35 pF |
48 | 83 | ns | ||
| TA = –40°C to +85°C | 94 | ||||||
| TA = –40°C to +125°C | 102 | ||||||
| tt | Transition time | VS = 8 V, CL= 35 pF | 87 | 147 | ns | ||
| VS = 8 V, RL = 300 Ω,
CL= 35 pF |
TA = –40°C to +85°C | 153 | |||||
| VS = 8 V, RL = 300 Ω,
CL= 35 pF |
TA = –40°C to +125°C | 155 | |||||
| tBBM | Break-before-make time delay | VS = 8 V, RL = 300 Ω, CL= 35 pF, TA = –40°C to +125°C | 30 | 54 | ns | ||
| QJ | Charge injection | CL = 1 nF, RS = 0 Ω | VS = 6 V | 0.15 | pC | ||
| VS = 0 V to 12 V, | ±0.4 | ||||||
| Off-isolation | RL = 50 Ω, VS = 1 VRMS,
f = 1 MHz |
Nonadjacent channel to D, DA, DB | -96 | dB | |||
| Adjacent channel to D, DA, DB | -85 | ||||||
| Channel-to-channel crosstalk | RL = 50 Ω, VS = 1 VRMS,
f = 1 MHz |
Nonadjacent channels | –96 | dB | |||
| Adjacent channels | -88 | ||||||
| CS(OFF) | Input off-capacitance | f = 1 MHz, VS = 6 V | 2.7 | 3.2 | pF | ||
| CD(OFF) | Output off-capacitance | f = 1 MHz, VS = 6 V | MUX36S08 | 9.1 | 10 | pF | |
| MUX36D04 | 5 | 5.7 | |||||
| CS(ON), CD(ON) | Output on-capacitance | f = 1 MHz, VS = 6 V | MUX36S08 | 10.8 | 12 | pF | |
| MUX36D04 | 6.9 | 8 | |||||
| POWER SUPPLY | |||||||
| VDD supply current | All VA = 0 V or 3.3 V,
VS = 0 V, VEN = 3.3 V |
42 | 53 | µA | |||
| TA = –40°C to +85°C | 56 | ||||||
| TA = –40°C to +125°C | 77 | ||||||
| VSS supply current | All VA = 0 V or 3.3 V,
VS = 0 V, VEN = 3.3 V |
23 | 31 | µA | |||
| TA = –40°C to +85°C | 38 | ||||||
| TA = –40°C to +125°C | 51 | ||||||
(1) When VS is 1 V, VD is 10 V, and vice versa.
(2) Specified by design; not subject to production testing.