SBAS758C January   2016  – September 2016 MUX508 , MUX509

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Dual Supply
    6. 7.6 Electrical Characteristics: Single Supply
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  Truth Tables
    2. 8.2  On-Resistance
    3. 8.3  Off-Leakage Current
    4. 8.4  On-Leakage Current
    5. 8.5  Transition Time
    6. 8.6  Break-Before-Make Delay
    7. 8.7  Turn-On and Turn-Off Time
    8. 8.8  Charge Injection
    9. 8.9  Off Isolation
    10. 8.10 Channel-to-Channel Crosstalk
    11. 8.11 Bandwidth
    12. 8.12 THD + Noise
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Ultralow Leakage Current
      2. 9.3.2 Ultralow Charge Injection
      3. 9.3.3 Bidirectional Operation
      4. 9.3.4 Rail-to-Rail Operation
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power-Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Low On-Capacitance
    • MUX508: 9.4 pF
    • MUX509: 6.7 pF
  • Low Input Leakage: 10 pA
  • Low Charge Injection: 0.3 pC
  • Rail-to-Rail Operation
  • Wide Supply Range: ±5 V to ±18 V, 10 V to 36 V
  • Low On-Resistance: 125 Ω
  • Transition Time: 92 ns
  • Break-Before-Make Switching Action
  • EN Pin Connectable to VDD
  • Logic Levels: 2 V to VDD
  • Low Supply Current: 45 µA
  • ESD Protection HBM: 2000 V
  • Industry-Standard TSSOP and SOIC Packages

2 Applications

  • Factory Automation and Industrial Process Controls
  • Programmable Logic Controllers (PLC)
  • Analog Input Modules
  • ATE Test Equipment
  • Digital Multimeters
  • Battery Monitoring Systems

3 Description

The MUX508 and MUX509 (MUX50x) are modern, complementary metal-oxide semiconductor (CMOS), analog multiplexers (muxes). The MUX508 offers 8:1 single-ended channels, whereas the MUX509 offers differential 4:1 or dual 4:1 single-ended channels. The MUX508 and MUX509 work equally well with either dual supplies (±5 V to ±18 V) or a single supply (10 V to 36 V). They also perform well with symmetric supplies (such as VDD = 12 V, VSS = –12 V), and unsymmetric supplies (such as VDD = 12 V, VSS = –5 V). All digital inputs have TTL-logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range.

The MUX508 and MUX509 have very low on and off leakage currents, allowing these multiplexers to switch signals from high input impedance sources with minimal error. A low supply current of 45 µA allows for use in portable applications.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
MUX50x TSSOP (16) 5.00 mm × 4.40 mm
SOIC (16) 9.90 mm × 3.91 mm
  1. For all available packages, see the package option addendum at the end of the data sheet.

Simplified Schematic

MUX508 MUX509 front_page_schem_sbas758.gif

Charge Injection vs Source Voltage

MUX508 MUX509 C008_SBOS705.png