SCES366L August   2001  – October 2015 SN74LVC3G34

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Documentation Support
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • YZP|8
  • DCT|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5.5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.1 ns at 3.3 V
  • Low Power Consumption, 10-µA Maximum ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Can Be Used as a Down Translator to Translate Inputs From a Maximum of 5.5 V Down to the VCC Level
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

2 Applications

  • AV Receivers
  • Audio Docks: Portable
  • Blu-ray Players and Home Theaters
  • DVD Recorders and Players
  • Embedded PCs
  • MP3 Players and Recorders (Portable Audio)
  • Personal Digital Assistant (PDA)
  • Power: Telecom/Server AC/DC Supply: Single Controller: Analog and Digital
  • Solid-State Drive (SSD): Client and Enterprise
  • TV: LCD/Digital and High-Definition (HDTV)
  • Tablets: Enterprise
  • Video Analytics: Servers
  • Wireless Headsets, Keyboards, and Mice

3 Description

The SN74LVC3G34 device is a triple buffer gate designed for 1.65-V to 5.5-V VCC operation. The SN74LVC3G34 device performs the Boolean function Y = A in positive logic.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
SN74LVC3G34DCT SM8 (8) 2.95 mm × 2.80 mm
SN74LVC3G34DCU VSSOP (8) 2.30 mm × 2.00 mm
SN74LVC3G34YZP DSBGA (8) 1.91 mm × 0.91 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

SN74LVC3G34 LD_CES366.gif

4 Revision History

Changes from J Revision (Feburary 2007) to K Revision

  • Updated document to new TI data sheet format.Go
  • Removed Ordering Information table.Go
  • Updated Features sectionGo
  • Updated operating temperature range.Go

Changes from K Revision (November 2013) to L Revision

  • Added Applications, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information table, Typical Characteristics section, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted part number from Switching Characteristics table headers.Go