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TLV320AIC3254 Ultra Low Power Stereo Audio Codec with Embedded miniDSP
SLAS549D
September 2008 – November 2014
TLV320AIC3254
PRODUCTION DATA.
CONTENTS
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TLV320AIC3254 Ultra Low Power Stereo Audio Codec with Embedded miniDSP
1
Features
2
Applications
3
Description
4
Simplified Block Diagram
5
Revision History
6
Device Comparison Table
7
Pin Configuration and Functions
8
Specifications
8.1
Absolute Maximum Ratings
8.2
Handling Ratings
8.3
Recommended Operating Conditions
8.4
Thermal Information
8.5
Electrical Characteristics, ADC
8.6
Electrical Characteristics, Bypass Outputs
8.7
Electrical Characteristics, Microphone Interface
8.8
Electrical Characteristics, Audio DAC Outputs
8.9
Electrical Characteristics, LDO
8.10
Electrical Characteristics, Misc.
8.11
Electrical Characteristics, Logic Levels
8.12
I2S LJF and RJF Timing in Master Mode (see )
8.13
I2S LJF and RJF Timing in Slave Mode (see )
8.14
DSP Timing in Master Mode (see )
8.15
DSP Timing in Slave Mode (see )
8.16
Digital Microphone PDM Timing (see )
8.17
I2C Interface Timing
8.18
SPI Interface Timing (See )
8.19
Typical Characteristics
8.20
Typical Characteristics, FFT
9
Parameter Measurement Information
10
Detailed Description
10.1
Overview
10.2
Functional Block Diagram
10.3
Feature Description
10.3.1
Device Connections
10.3.1.1
Digital Pins
10.3.1.1.1
Multifunction Pins
10.3.1.2
Analog Pins
10.3.2
Analog Audio IO
10.3.2.1
Analog Low Power Bypass
10.3.2.2
ADC Bypass Using Mixer Amplifiers
10.3.2.3
Headphone Outputs
10.3.2.4
Line Outputs
10.3.3
ADC
10.3.3.1
ADC Processing
10.3.3.1.1
ADC Processing Blocks
10.3.4
DAC
10.3.4.1
DAC Processing Blocks
10.3.5
PowerTune
10.3.6
Digital Audio IO Interface
10.3.7
Clock Generation and PLL
10.3.8
Control Interfaces
10.3.8.1
I2C Control
10.3.8.2
SPI Control
10.4
Device Functional Modes
10.5
Software
10.6
Register Map
11
Applications and Implementation
11.1
Application Information
11.2
Typical Application
11.2.1
Design Requirements
11.2.1.1
Reference Filtering Capacitor
11.2.1.2
MICBIAS
11.2.2
Detailed Design Procedures
11.2.2.1
Analog Input Connection
11.2.2.2
Analog Output Connection
11.2.3
Application Curves
12
Power Supply Recommendations
13
Layout
13.1
Layout Guidelines
13.2
Layout Example
14
Device and Documentation Support
14.1
Documentation Support
14.1.1
Related Documentation
14.2
Trademarks
14.3
Electrostatic Discharge Caution
14.4
Glossary
15
Mechanical, Packaging, and Orderable Information
IMPORTANT NOTICE
Package Options
Mechanical Data (Package|Pins)
RHB|32
MPQF130D
Thermal pad, mechanical data (Package|Pins)
RHB|32
QFND029X
Orderable Information
slas549d_oa
slas549d_pm
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