Data Sheet
TLV902x-Q1 and TLV903x-Q1 Precision Automotive Comparator Family
1 Features
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to 125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C6
- 1.65V to 5.5V supply range
- Power-On Reset (POR) for known start-up
- Precision input offset voltage 300μV
- 100ns Typical propagation delay
- Low quiescent current 16μA per channel
- Rail-to-Rail input voltage range exceeds the rails
- Open-drain output option (TLV902x-Q1)
- Push-pull output option (TLV903x-Q1)
- Alternate single pinout option (TLV90x0)
- 2kV ESD Protection
3 Description
The TLV902x-Q1 and TLV903x-Q1 are a family of Automotive grade single, dual and quad channel comparators. The family offers low input offset voltage, fault-tolerant inputs and a excellent speed-to-power combination with a propagation delay of 100ns with a quiescent supply current of only 18μA per channel.
The family also includes a Power-on Reset (POR) feature that makes sure the output is in a known state until the minimum supply voltage has been reached to prevent output transients during system power-up and power-down.
These comparators also feature fault-tolerant inputs that can go up to 6V without damage with no output phase inversion. This makes this family of comparators designed for precision voltage monitoring in harsh, noisy environments.
The TLV902x-Q1 have an open-drain output that may be pulled-up below or beyond the supply voltage, making it appropriate for low voltage logic translators.
The TLV903x-Q1 have a push-pull output stage capable of sinking and sourcing many milliamps of current to drive LEDs or a capacitive load such as a MOSFET gate.
The TLV90x0-Q1 and TLV90x1-Q1 are alternate pinouts of the single device.
The family is specified for the Automotive temperature range of -40°C to +125°C and are available in a standard leaded and leadless packages.
Device Information
| PART NUMBER | PACKAGE (1) | BODY SIZE (NOM) (2) |
|---|---|---|
| TLV90x0-Q1, TLV90x1-Q1 (Single) |
SC-70 (5) | 1.25mm x 2.00mm |
| SOT-23 (5) | 1.60mm x 2.90mm | |
| TLV9022-Q1, TLV9032-Q1 (Dual) |
SOIC (8) | 3.91mm × 4.90mm |
| TSSOP (8) | 3.00mm × 4.40mm | |
| VSSOP (8) | 3.00mm × 3.00mm | |
|
WSON (8) |
2.00mm × 2.00mm | |
| SOT-23-THN (8) | 1.60mm × 2.90mm | |
| TLV9024-Q1, TLV9034-Q1 (Quad) |
SOIC (14) | 3.91mm × 8.65mm |
| TSSOP (14) | 4.40mm × 5.00mm | |
| SOT-23 (14) | 4.20mm x 2.00mm | |
| WQFN (16) | 3.00mm × 3.00mm |
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) The package size (length × width) is a nominal value and includes pins, where
applicable.
TLV902x-Q1 Block Diagram
TLV903x-Q1 Block Diagram4 Pin Configuration and Functions
4.1 Pin Functions: TLV90x0-Q1 and TLV90x1-Q1 Single
Figure 4-1 TLV9020-Q1, TLV9030-Q1 DCK and DBV PackagesStandard "South East" Pinout
5-Pin SC-70 and SOT-23
Top View
Figure 4-2 TLV9021-Q1, TLV9031-Q1 DCK and DBV PackagesStandard "North West" Pinout
5-Pin SC-70 and SOT-23
Top View
Table 4-1 Pin Functions: TLV90x0-Q1 and
TLV90x1-Q1
| PIN | TYPE | DESCRIPTION | ||
|---|---|---|---|---|
| TLV90x0-Q1 | TLV90x1-Q1 | |||
| NAME | NO. | NO. | ||
| IN+ | 1 | 3 | I | Non-Inverting (Positive) Input |
| IN– | 3 | 4 | I | Inverting (Negative) Input |
| OUT | 4 | 1 | O | Output |
V+ | 5 | 5 | — | Positive Power Supply |
V- | 2 | 2 | — | Negative Power Supply |
Pin Functions: TLV90x2-Q1 Dual
Figure 4-3 D, DGK, PW, DDF Packages8-Pin SOIC, VSSOP, TSSOP, SOT-23-8
Top View
NOTE: Connect exposed thermal pad directly to V- pin.
Figure 4-4 DSG Package8-Pad WSON With Exposed Thermal Pad
Top View
Table 4-2 Pin Functions: TLV90x2-Q1
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| OUT1 | 1 | O | Output pin of the comparator 1 |
| IN1– | 2 | I | Inverting input pin of comparator 1 |
| IN1+ | 3 | I | Noninverting input pin of comparator 1 |
| V– | 4 | — | Negative (low) supply |
| IN2+ | 5 | I | Noninverting input pin of comparator 2 |
| IN2– | 6 | I | Inverting input pin of comparator 2 |
| OUT2 | 7 | O | Output pin of the comparator 2 |
| V+ | 8 | — | Positive supply |
| Thermal Pad | — | — | Connect directly to V- pin |
Pin Functions: TLV90x4-Q1 Quad
Figure 4-5 D, PW, DYY Package, 14-Pin SOIC, TSSOP, SOT-23,
Top View
NOTE: Connect exposed thermal pad directly to V- pin.
Figure 4-6 RTE Package, 16-Pad WQFN With Exposed Thermal Pad,
Top View
Table 4-3 Pin Functions: TLV90x4-Q1
| PIN | I/O | DESCRIPTION | |||
|---|---|---|---|---|---|
| NAME(1) | SOIC | WQFN | |||
| OUT2 | 1 | 15 | Output | Output pin of the comparator 2 | |
| OUT1 | 2 | 16 | Output | Output pin of the comparator1 | |
| V+ | 3 | 1 | — | Positive supply | |
| IN1– | 4 | 2 | Input | Negative input pin of the comparator 1 | |
| IN1+ | 5 | 4 | Input | Positive input pin of the comparator 1 | |
| IN2– | 6 | 5 | Input | Negative input pin of the comparator 2 | |
| IN2+ | 7 | 6 | Input | Positive input pin of the comparator 2 | |
| IN3– | 8 | 7 | Input | Negative input pin of the comparator 3 | |
| IN3+ | 9 | 8 | Input | Positive input pin of the comparator 3 | |
| IN4– | 10 | 9 | Input | Negative input pin of the comparator 4 | |
| IN4+ | 11 | 11 | Input | Positive input pin of the comparator 4 | |
| V– | 12 | 12 | — | Negative supply | |
| OUT4 | 13 | 13 | Output | Output pin of the comparator 4 | |
| OUT3 | 14 | 14 | Output | Output pin of the comparator 3 | |
| NC | — | 3 | — | No Internal Connection - Leave floating or GND | |
| NC | — | 10 | — | No Internal Connection - Leave floating or GND | |
| Thermal Pad | — | PAD | — | Connect directly to V- pin. | |
(1) Some manufacturers transpose the names of channels 1 & 2. Electrically the pinouts are identical, just a difference in channel naming convention.
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
| MIN | MAX | UNIT | |
|---|---|---|---|
| Supply voltage: VS = (V+) – (V–) | –0.3 | 6 | V |
| Input pins (IN+, IN–) from V–(2) | –0.3 | 6 | V |
| Current into Input pins (IN+, IN–) | –10 | 10 | mA |
| Output (OUT) from V–, open drain only(3) | –0.3 | 6 | V |
| Output (OUT) from V–, push-pull only | –0.3 | (V+) + 0.3 | V |
| Output short circuit duration(4) | 10 | s | |
| Junction temperature, TJ | 150 | °C | |
| Storage temperature, Tstg | –65 | 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to (V–). Input signals that can swing more than 0.3V beyond the supply rails must be current-limited to 10mA or less. Additionally, Inputs (IN+, IN–) can be greater than V+ and OUT as long as it is within the –0.3V to 6V range
(3) Output (OUT) for open drain can be greater than V+ and inputs (IN+, IN–) as long as it is within the –0.3V to 6V range
(4) Short-circuit to V– or V+. Short circuits from outputs can cause excessive heating and eventual destruction.
5.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), , per AEC Q100-002 (1) | ±2000 | V |
| Charged-device model (CDM), per AEC Q100-0111 | ±1000 | |||
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
5.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Supply voltage: VS = (V+) – (V–) | 1.65 | 5.5 | V | |
| Input voltage range (IN+, IN–) from (V–) | –0.2 | 5.7 | V | |
| Ambient temperature, TA | –40 | 125 | °C | |
5.4 Thermal Information, TLV90x0-Q1,TLV90x1-Q1
| THERMAL METRIC (1) | TLV90x0-Q1,TLV90x1-Q1 | UNIT | ||
|---|---|---|---|---|
| DCK (SC-70) |
DBV (SOT-23) |
|||
| 5 PINS | 5 PINS | |||
| RqJA | Junction-to-ambient thermal resistance | 238.5 | 223.7 | °C/W |
| RqJC(top) | Junction-to-case (top) thermal resistance | 134.0 | 123.2 | °C/W |
| RqJB | Junction-to-board thermal resistance | 87.6 | 91.4 | °C/W |
| yJT | Junction-to-top characterization parameter | 59.1 | 58.7 | °C/W |
| yJB | Junction-to-board characterization parameter | 87.2 | 91.0 | °C/W |
| RqJC(bot) | Junction-to-case (bottom) thermal resistance | – | – | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.