SLVSHK1A
September 2023 – June 2024
TPS6521905-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
System Control Thresholds
5.6
BUCK1 Converter
5.7
BUCK2, BUCK3 Converter
5.8
General Purpose LDOs (LDO1, LDO2)
5.9
General Purpose LDOs (LDO3, LDO4)
5.10
GPIOs and multi-function pins (EN/PB/VSENSE, nRSTOUT, nINT, GPO1, GPO2, GPIO, MODE/RESET, MODE/STBY, VSEL_SD/VSEL_DDR)
5.11
Voltage and Temperature Monitors
5.12
I2C Interface
5.13
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Power-Up Sequencing
6.3.2
Power-Down Sequencing
6.3.3
Push Button and Enable Input (EN/PB/VSENSE)
6.3.4
Reset to SoC (nRSTOUT)
6.3.5
Buck Converters (Buck1, Buck2, and Buck3)
6.3.6
Linear Regulators (LDO1 through LDO4)
6.3.7
Interrupt Pin (nINT)
6.3.8
PWM/PFM and Low Power Modes (MODE/STBY)
6.3.9
PWM/PFM and Reset (MODE/RESET)
6.3.10
Voltage Select pin (VSEL_SD/VSEL_DDR)
6.3.11
General Purpose Inputs or Outputs (GPO1, GPO2, and GPIO)
6.3.12
I2C-Compatible Interface
6.3.12.1
Data Validity
6.3.12.2
Start and Stop Conditions
6.3.12.3
Transferring Data
6.4
Device Functional Modes
6.4.1
Modes of Operation
6.4.1.1
OFF State
6.4.1.2
INITIALIZE State
6.4.1.3
ACTIVE State
6.4.1.4
STBY State
6.4.1.5
Fault Handling
6.5
Multi-PMIC Operation
6.6
NVM Programming
6.6.1
TPS6521905-Q1 default NVM settings
6.6.2
NVM programming in Initialize State
6.6.3
NVM Programming in Active State
6.7
User Registers
6.8
Device Registers
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Typical Application Example
7.2.2
Design Requirements
7.2.3
Detailed Design Procedure
7.2.3.1
Buck1, Buck2, Buck3 Design Procedure
7.2.3.2
LDO1, LDO2 Design Procedure
7.2.3.3
LDO3, LDO4 Design Procedure
7.2.3.4
VSYS, VDD1P8
7.2.3.5
Digital Signals Design Procedure
7.2.4
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Receiving Notification of Documentation Updates
8.2
Support Resources
8.3
Trademarks
8.4
Electrostatic Discharge Caution
8.5
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RHB|32
MPQF130D
Thermal pad, mechanical data (Package|Pins)
RHB|32
QFND643
Orderable Information
slvshk1a_oa
slvshk1a_pm
Data Sheet
Automotive
User Programmable Power Management IC (PMIC) with Three Step-down DC/DC Converters and Four LDOs