Altiumcustomize

Board Information Report

Date: 9/30/2024
Time: 10:18:02 AM
Elapsed Time: 00:00:00
Filename: C:\Users\a0500859\Downloads\Lierda_HV3PHINV_response\PMP_PCB_9_25\E1\MCU155E1\Sources\TIEVM-MC-MODULE-F280013x.PcbDoc
Units:
mmmils

Contents

Contents

Board Specification

General

Layer Information

Layer Information


Board Specification

General
Board Size 31.9997mm  x  29.0005mm
Components on board 102

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Layer Information

Layer Arcs Pads Vias Tracks Texts Fills Regions ComponentBodies
Top Layer 0 187 0 565 1 0 293 0
Layer 1 0 0 0 0 0 0 1 0
Layer 2 0 0 0 0 0 0 1 0
Bottom Layer 0 5 0 144 1 0 105 0
M1 Board Outline 108 0 0 102 1 0 0 0
M2 Board Dimensions 0 0 0 17 2 2 0 0
M3 3D STEP Top 0 0 0 0 1 0 0 4
M4 3D STEP Bottom 0 0 0 0 1 0 0 4
M5 Assembly Top 10 0 0 475 79 2 0 0
M6 Assembly Bottom 4 0 0 33 23 0 0 0
M7 LPKF Text Top 0 0 0 0 0 0 0 0
M8 LPKF Text Bottom 0 0 0 0 0 0 0 0
M9 Title Sheet 0 0 0 39 39 0 18 0
M10 Fab Notes 0 0 0 205 113 0 0 0
M11 Gerber Information 0 0 0 13 16 0 0 0
M12 Stackup 0 0 0 196 45 0 0 0
M13 Component Bodies Top 0 0 0 330 1 0 0 175
M14 Component Bodies Bottom 0 1 0 0 1 0 0 1
M15 Courtyards Top 0 0 0 342 1 0 0 0
M16 Courtyards Bottom 0 0 0 0 1 0 0 0
M17 Embedded Cavity 0 0 0 0 1 0 0 0
M18 Embedded Assembly 0 0 0 0 1 0 0 0
M19 Embedded Keepout 0 0 0 0 1 0 0 0
Top Paste 0 0 0 0 1 0 48 0
Top Overlay 6 0 0 364 194 1 2 0
Top Solder 0 20 0 0 2 0 0 0
Bottom Solder 0 20 0 0 1 0 0 0
Bottom Overlay 11 0 0 25 21 0 26 0
Bottom Paste 0 0 0 0 1 0 0 0
Drill Guide 0 0 0 0 1 0 0 0
Keep-Out Layer 0 0 0 0 1 0 0 0
Drill Drawing 1 0 0 21 35 0 0 0
Multi-Layer 0 50 120 0 0 0 1 0
Total 140 283 120 2871 586 5 495 184

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