Product details

Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 CPU 32-bit Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator Operating system Linux, RTOS Security Cryptography Rating Catalog Power supply solution TPS650250, TPS65216 Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 CPU 32-bit Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator Operating system Linux, RTOS Security Cryptography Rating Catalog Power supply solution TPS650250, TPS65216 Operating temperature range (°C) -40 to 105
FCCSP (CBC) 515 196 mm² 14 x 14 FCCSP (CBP) 515 144 mm² 12 x 12 FCCSP (CUS) 423 256 mm² 16 x 16
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

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Limited design support from TI available

This product has limited design support from TI for existing projects. If available, you will find relevant collateral, software and tools in the product folder. For existing designs using this product, you can request support in the TI E2ETM support forums, but limited support is available for this product.

Technical documentation

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Type Title Date
* Data sheet DM3730, DM3725 Digital Media Processors datasheet (Rev. D) 11 Apr 2011
* Errata DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 13 Feb 2014
* User guide AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 24 Sep 2012
Application note OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles 20 Mar 2019
Technical article Spring has sprung. A sale has sprung. PDF | HTML 04 Apr 2016
User guide Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 10 Sep 2012
More literature DM37x Design Network Partners 05 Jun 2012
Application note Introduction to TMS320C6000 DSP Optimization 06 Oct 2011
Application note PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 15 Jun 2011
Application note PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 23 Jun 2010
Application note PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 23 Jun 2010
Application note AM/DM37x Power Estimation Spreadsheet 07 Jun 2010
Application note AM/DM37x Overview 03 Jun 2010
Application note AM3715/03 Memory Subsystem 03 Jun 2010
Application note AM37x CUS Routing Guidelines 03 Jun 2010
Application note Setting up AM37x SDRC Registers 03 Jun 2010

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Debug probe

TMDSEMU200-U — XDS200 USB Debug Probe

The XDS200 is a debug probe (emulator) used for debugging TI embedded devices.  The XDS200 features a balance of low cost with good performance as compared to the low cost XDS110 and the high performance XDS560v2.  It supports a wide variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a (...)

Not available on TI.com
Debug probe

TMDSEMU560V2STM-U — XDS560™ software v2 system trace USB debug probe

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

Not available on TI.com
Debug probe

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB & Ethernet Debug Probe

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

Not available on TI.com
Software development kit (SDK)

ANDROIDEVKIT-FROYO Android FROYO - Dev Kit for DM37x (TI_Android_DevKit/02_02_00)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

Supported products & hardware

Supported products & hardware

Products
Arm-based processors
DM3725 Digital Media Processor DM3730 Digital Media Processor
Download options
Software development kit (SDK)

ANDROIDEVKIT-GINGERBREAD Android GINGERBREAD 2.3 - Dev Kit for DM37x (TI_Android_GingerBread_2_3_DevKit_1_0)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

Supported products & hardware

Supported products & hardware

Products
Arm-based processors
DM3725 Digital Media Processor DM3730 Digital Media Processor
Download options
Software development kit (SDK)

LINUXDVSDK-DM37X — Linux Digital Video Software Development Kit (DVSDK) for DM3730/3725 Digital Media Processors

The Linux Digital Video Software Development Kit (DVSDK) for DaVinci™ processors provides everything developers need to evaluate and start developing on the DM37x Cortex™-A8 DSP+ARM® microprocessors. With the included Graphical User Interface (GUI)-based Matrix Application Launcher, launching (...)
IDE, configuration, compiler or debugger

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

Supported products & hardware

Supported products & hardware

This design resource supports most products in these categories.

Check the product details page to verify support.

Launch Download options
Software programming tool

FLASHTOOL FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices

Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

TI GForge - Welcome to gforge.ti.com

TI E2E Community

Supported products & hardware

Supported products & hardware

Products
Arm-based processors
AM3505 Sitara processor: Arm Cortex-A8, video front end AM3517 Sitara processor: Arm Cortex-A8, 3D graphics, video front end AM3703 Sitara processor: Arm Cortex-A8, camera AM3715 Sitara processor: Arm Cortex-A8, 3D graphics, camera DM3725 Digital Media Processor DM3730 Digital Media Processor OMAP3503 Sitara processor: Arm Cortex-A8, LPDDR OMAP3515 Sitara Processor: Arm Cortex-A8, 3D Graphics, LPDDR OMAP3525 Applications Processor OMAP3530 Applications Processor
Download options
Simulation model

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507B.ZIP (8 KB) - BSDL Model
Simulation model

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS Model
Simulation model

AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL Model
Simulation model

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS Model
Simulation model

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL Model
Simulation model

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS Model
Package Pins CAD symbols, footprints & 3D models
FCCSP (CBC) 515 Ultra Librarian
FCCSP (CBP) 515 Ultra Librarian
FCCSP (CUS) 423 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

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