Home Logic & voltage translation Buffers, drivers & transceiver Inverting buffers & drivers
Home
Logic & voltage translation
Buffers, drivers & transceiver
Inverting buffers & drivers

SN54ACT14

ACTIVE

Military 6-ch, 4.5-V to 5.5-V inverters with Schmitt-Trigger inputs

Order now
Data sheet

SN54ACT14

ACTIVE
Data sheet Order now

Product details

Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 20 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Very high speed (tpd 5-10ns) Rating Military Operating temperature range (°C) -55 to 125
Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 20 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Very high speed (tpd 5-10ns) Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 14 130.4652 mm² 19.56 x 6.67 CFP (W) 14 58.023 mm² 9.21 x 6.3 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • VCC operation of 4.5V to 5.5V
  • Inputs accept voltages to 5.5V
  • Max tpd of 11ns at 5V
  • Inputs are TTL-voltage compatible
  • VCC operation of 4.5V to 5.5V
  • Inputs accept voltages to 5.5V
  • Max tpd of 11ns at 5V
  • Inputs are TTL-voltage compatible

These Schmitt-trigger devices contain six independent inverters.

These Schmitt-trigger devices contain six independent inverters.

filter Find other Inverting buffers & drivers
Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 13
Type Title Date
* Data sheet SNx4ACT14 Hex Schmitt-Trigger Inverter datasheet (Rev. K) PDF | HTML 01 Nov 2024
* SMD SN54ACT14 SMD 5962-92183 21 Jun 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Application brief Understanding Schmitt Triggers (Rev. A) PDF | HTML 22 May 2019
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 Apr 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins CAD symbols, footprints & 3D models
CDIP (J) 14 Ultra Librarian
CFP (W) 14 Ultra Librarian
LCCC (FK) 20 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos