The SN74ACT164-Q1 device contains six D-type flip-flops with shared active-low clear (CLR) and rising-edge triggered clock (CLK) inputs.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | SN74ACT164-Q1 Automotive Hex D-Type Flip-Flops with Clear datasheet | PDF | HTML | 13 Sep 2024 |
| Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 26 Jul 2021 | ||
| Selection guide | Logic Guide (Rev. AB) | 12 Jun 2017 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 02 Dec 2015 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 16 Jan 2007 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 08 Jul 2004 | ||
| Application note | Selecting the Right Level Translation Solution (Rev. A) | 22 Jun 2004 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 29 Aug 2002 | ||
| Application note | CMOS Power Consumption and CPD Calculation (Rev. B) | 01 Jun 1997 | ||
| Application note | Designing With Logic (Rev. C) | 01 Jun 1997 | ||
| Application note | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 01 Apr 1996 |
For additional terms or required resources, click any title below to view the detail page where available.
The 14-24-LOGIC-EVM evaluation module (EVM) is designed to support any logic device that is in a 14-pin to 24-pin D, DW, DB, NS, PW, DYY or DGV package,
14-24-NL-LOGIC-EVM is a flexible evaluation module (EVM) designed to support any logic or translation device that has a 14-pin to 24-pin BQA, BQB, RGY, RSV, RJW or RHL package.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
| WQFN (BQB) | 16 | Ultra Librarian |
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.