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TXG8122-Q1

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Automotive, 2-bit, bidirectional 80V ground level translator for I2C signals

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Data sheet

TXG8122-Q1

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Data sheet Order now

Product details

Rating Automotive Ground offset voltage (max) (V) 80 Bits (#) 2 Topology Open drain Applications GPIO, I2C, SMBus Forward/reverse channels 2/2 Isolation rating Functional Data rate (max) (Mbps) 2 Prop delay (ns) 69 CMTI (V/µs) 500 Output drive capability (max) (mA) 50 Technology family TXG Vin (min) (V) 3 Vin (max) (V) 5.5 Vout (min) (V) 2.25 Vout (max) (V) 5.5 Current consumption per channel (1 Mbps) (typ) (mA) 4.2 Features AEC Q100
Rating Automotive Ground offset voltage (max) (V) 80 Bits (#) 2 Topology Open drain Applications GPIO, I2C, SMBus Forward/reverse channels 2/2 Isolation rating Functional Data rate (max) (Mbps) 2 Prop delay (ns) 69 CMTI (V/µs) 500 Output drive capability (max) (mA) 50 Technology family TXG Vin (min) (V) 3 Vin (max) (V) 5.5 Vout (min) (V) 2.25 Vout (max) (V) 5.5 Current consumption per channel (1 Mbps) (typ) (mA) 4.2 Features AEC Q100
SOIC (D) 8 29.4 mm² 4.9 x 6
  • AEC-Q100 qualified for automotive applications
  • Bidirectional I2C compatible communication
  • Support for Standard-mode, Fast-mode, and Fast-mode Plus I2C operation
  • Supports DV shifts up to ±80V
  • Data rate up to 1MHz
  • Side 1 Supply Range: 3V to 5.5V
  • Side 2 Supply Range: 2.25V to 5.5V
  • Maximum capacitive load:
    • 80pF (Side 1) and 550pF (Side 2)
  • Open -drain outputs with current sink capability:
    • 3.5mA (Side 1) and 50mA (Side 2)
  • Low power consumption at 400kHz (typical):
    • ICC1 = 3.1mA, ICC2 = 0.7mA
  • Operating temperature from –40°C to +125°C
  • CMTI of 500V/µs
  • Latch-up performance exceeds 100mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 2000V human-body model
    • 500V charged-device model
  • Package options provided: SOIC (8D), WSON (8DSG), SOT-23 (8DDF)
  • AEC-Q100 qualified for automotive applications
  • Bidirectional I2C compatible communication
  • Support for Standard-mode, Fast-mode, and Fast-mode Plus I2C operation
  • Supports DV shifts up to ±80V
  • Data rate up to 1MHz
  • Side 1 Supply Range: 3V to 5.5V
  • Side 2 Supply Range: 2.25V to 5.5V
  • Maximum capacitive load:
    • 80pF (Side 1) and 550pF (Side 2)
  • Open -drain outputs with current sink capability:
    • 3.5mA (Side 1) and 50mA (Side 2)
  • Low power consumption at 400kHz (typical):
    • ICC1 = 3.1mA, ICC2 = 0.7mA
  • Operating temperature from –40°C to +125°C
  • CMTI of 500V/µs
  • Latch-up performance exceeds 100mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 2000V human-body model
    • 500V charged-device model
  • Package options provided: SOIC (8D), WSON (8DSG), SOT-23 (8DDF)

The TXG8122-Q1 device is a dual bidirectional, non-galvanic based voltage and ground-level translator for I2C. This device supports two separate configurable power-supply rails. Side 1 is designed to track VCC1 which accepts any supply voltage from 3V to 5.5V. Side 2 is designed to track VCC2 which accepts any supply voltage from 2.25V to 5.5V. Compared to traditional level shifters, the TXG8122-Q1 can solve the challenges of voltage translation across different ground levels up to ±80V. Both GNDA or GNDB can have an offset ground as long as the difference between GNDA and GNDB remains -80V to +80V.

The Simplified Block Diagram shows a common use case where DC shift occurs between GNDA to GNDB due to parasitic resistance or capacitance. The TXG8122-Q1 is able to support I2C-based communication between systems that have different supply voltages and different ground references. The leakage between GNDA and GNDB is typically 50nA when VCC to GND is shorted.

The TXG8122-Q1 device is a dual bidirectional, non-galvanic based voltage and ground-level translator for I2C. This device supports two separate configurable power-supply rails. Side 1 is designed to track VCC1 which accepts any supply voltage from 3V to 5.5V. Side 2 is designed to track VCC2 which accepts any supply voltage from 2.25V to 5.5V. Compared to traditional level shifters, the TXG8122-Q1 can solve the challenges of voltage translation across different ground levels up to ±80V. Both GNDA or GNDB can have an offset ground as long as the difference between GNDA and GNDB remains -80V to +80V.

The Simplified Block Diagram shows a common use case where DC shift occurs between GNDA to GNDB due to parasitic resistance or capacitance. The TXG8122-Q1 is able to support I2C-based communication between systems that have different supply voltages and different ground references. The leakage between GNDA and GNDB is typically 50nA when VCC to GND is shorted.
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* Data sheet TXG8122-Q1 ± 80V Bidirectional Ground-Level Translator for I2C datasheet PDF | HTML 06 Jun 2025
Application brief Top Questions about Ground-Level Translators PDF | HTML 27 May 2026
Application note Solving Ground Mismatch in Automotive Systems PDF | HTML 03 Mar 2026

Design & development

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Evaluation board

TXG-4CH-EVM — TXG evaluation module for 4-channel ground-level translator

TXG-4CH-EVM is an evaluation module (EVM) used to evaluate the TXGx04x 4-channel ground-level translator product family. The EVM supports multiple package options, which include 16-pin DBQ, 14-pin DYY, and 14-pin RUC. The EVM features multiple test points and connection options to evaluate the (...)
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