SN54ALS259
- 8-Bit Parallel-Out Storage Register Performs Serial-to-Parallel Conversion With Storage
- Asynchronous Parallel Clear
- Active-High Decoder
- Enable/Disable Input Simplifies Expansion
- Expandable for n-Bit Applications
- Four Distinct Functional Modes
- Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs
These 8-bit addressable latches are designed for general-purpose storage applications in digital systems. Specific uses include working registers, serial-holding registers, and active-high decoders or demultiplexers. They are multifunctional devices capable of storing single-line data in eight addressable latches and being a 1-of-8 decoder or demultiplexer with active-high outputs.
Four distinct modes of operation are selectable by controlling the
clear () and enable
(G\) inputs as shown in the function table. In the addressable-latch
mode, data at the data-in terminal is written into the addressed
latch. The
addressed latch follows the data input with all unaddressed latches remaining in their previous states. In the memory mode, all latches remain in their previous states and are unaffected by the data or address inputs. To eliminate the possibility of entering erroneous data in the latches, G\ should be held high (inactive) while the address lines are changing. In the 1-of-8 decoding or demultiplexing mode, the addressed output follows the level of the D input with all other outputs low. In the clear mode, all outputs are low and unaffected by the address and data inputs.
The SN54ALS259 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALS259 is characterized for operation from 0°C to 70°C.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 8-Bit Addressable Latches 数据表 (Rev. A) | 1994年 12月 1日 | |||
* | SMD | SN54ALS259 SMD 5962-88741 | 2016年 6月 21日 | |||
应用手册 | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022年 12月 15日 | |||
选择指南 | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||||
应用手册 | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||||
选择指南 | 逻辑器件指南 2014 (Rev. AA) | 最新英语版本 (Rev.AB) | 2014年 11月 17日 | |||
用户指南 | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||||
应用手册 | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||||
应用手册 | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||||
应用手册 | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997年 8月 1日 | ||||
应用手册 | 使用逻辑器件进行设计 (Rev. C) | 1997年 6月 1日 | ||||
应用手册 | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 | ||||
应用手册 | Live Insertion | 1996年 10月 1日 | ||||
应用手册 | Advanced Schottky (ALS and AS) Logic Families | 1995年 8月 1日 |
设计和开发
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
CDIP (J) | 16 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点