SN74ALVTH16374 不再投入量产
此产品不再投入生产。新设计应考虑替代产品。
open-in-new 比较替代产品
功能与比较器件相同,且具有相同引脚
74ACT16374 正在供货 具有三态输出的 16 位 D 类边沿触发触发器 Lower average drive strength (24mA)
SN74ALVCH16374 正在供货 具有三态输出的 16 位边沿 D 类触发器 Replacement

产品详情

Number of channels 16 Technology family ALVT Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 250 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 5000 Features Bus-hold, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 16 Technology family ALVT Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 250 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 5000 Features Bus-hold, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating Catalog
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Widebus™ Design for 2.5-V and 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • High Drive (-24/24 mA at 2.5-V VCC and -32/64 mA at 3.3-V )
  • Power Off Disables Outputs, Permitting Live Insertion
  • High-Impedance State During Power Up and Power Down Prevents Driver Conflict
  • Uses Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection
    • Exceeds 2000 V Per MIL-STD-883, Method 3015
    • Exceeds 200 V Using Machine Model
    • Exceeds 1000 V Using Charged-Device Model, Robotic Method
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

Widebus is a trademark of Texas Instruments.

  • State-of-the-Art Advanced BiCMOS Technology (ABT) Widebus™ Design for 2.5-V and 3.3-V Operation and Low Static Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • High Drive (-24/24 mA at 2.5-V VCC and -32/64 mA at 3.3-V )
  • Power Off Disables Outputs, Permitting Live Insertion
  • High-Impedance State During Power Up and Power Down Prevents Driver Conflict
  • Uses Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection
    • Exceeds 2000 V Per MIL-STD-883, Method 3015
    • Exceeds 200 V Using Machine Model
    • Exceeds 1000 V Using Charged-Device Model, Robotic Method
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

Widebus is a trademark of Texas Instruments.

The 'ALVTH16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. These devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK), the flip-flops store the logic levels set up at the data (D) inputs.

A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.

OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ALVTH16374 is characterized for operation over the full military temperature range of -55°C to 125°C.

The SN74ALVTH16374 is characterized for operation from -40°C to 85°C.

The 'ALVTH16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. These devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK), the flip-flops store the logic levels set up at the data (D) inputs.

A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.

OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ALVTH16374 is characterized for operation over the full military temperature range of -55°C to 125°C.

The SN74ALVTH16374 is characterized for operation from -40°C to 85°C.

下载

技术文档

star =有关此产品的 TI 精选热门文档
未找到结果。请清除搜索并重试。
查看全部 1
类型 标题 下载最新的英语版本 日期
* 数据表 SN54ALVTH16374, SN74ALVTH16374 数据表 (Rev. G) 2006年 11月 9日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点