Driver or library
CC2564CMSP432BTBLESW
CC2564C TI Dual-mode Bluetooth® Stack on MSP432 MCUs
CC2564CMSP432BTBLESW
Overview
TI’s CC2564C Dual-mode Bluetooth® stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 5.1 specification. The Bluetooth stack is fully qualified (QDID172096 and QDID172097), provides simple command line based sample applications to speed development, and upon request has MFI capability.
For a complete evaluation solution, the CC2564C Dual-mode Bluetooth stack works directly with the TI hardware development kits: MSP-EXP432P401R, BOOST-CCEMADAPTER and CC256XCQFN-EM. For audio and voice applications, the CC3200AUDBOOST can be connected to the MSP-EXP432P401R and BOOST-CCEMADAPTER. Moreover, the stack that is available for the MSP432 MCU is certified and royalty-free.
The software works with the CC256XCQFN-EM board via the BOOST-CCEMADAPTER and MSP-EXP432P401R boards which provides a complete Bluetooth BT/EDR/LE HCI solution, reducing design effort and enabling fast time to market.
Features
- Supports Dual-mode Bluetooth 5.1 - Bluetooth certified and royalty free
- Supports LE Secure Connection
- Supports LE Dual Mode Topology and Link Layer Topology with CC2564C
- Bluetooth stack is fully qualified (QDID172096 and QDID172097)
- Fully Thread safe
- Sample apps are available for the MSP-EXP432P401R LaunchPad with the support of the BOOST-CCEMADAPTER
- Fully Documented API Interface
- Supports CCS, IAR, KEIL IDE
- Classic Profiles Available
- Advanced Audio Distribution Profile (A2DP): Internal SBC encoding/decoding is implemented (Assisted A2DP) – please note that due to lack of PCM routing in MSP Launchpad, manual prototyping is required to interface an external audio codec EVM, e.g. CC3200AUDBOOST
- Audio/Video Transport Protocols (AVDTP)
- Audio/Video Remote Control Profile (AVRCP)
- Generic Access Profile (GAP)
- Headset Profile (HSP) and Hands Free Profile (HFP): please note that due to lack of PCM routing in MSP Launchpad, manual prototyping is required to interface an external audio codec EVM, e.g. CC3200AUDBOOST
- Human Interface Device Profile (HID)
- Message Access Profile (MAP)
- Phonebook Access Profile (PBAP)
- Serial Port Profile (SPP)
- Bluetooth Low Energy Profiles Available
- Alert Notification Service (ANS)
- Battery Service (BAS)
- Cycle Speed and Cadence Service (CSCS)
- Device Information Service (DIS)
- Find Me Profile (FMP)
- Generic Access Profile Service (GAPS)
- Generic Attribute Profile (GATT)
- Health Thermometer Service (HTS)
- Heart Rate Service (HRS)
- Human Interface Device Service (HIDS)
- Immediate Alert Service (IAS)
- Link Loss Service (LLS)
- Phone Alert State Service (PASS)
- Proximity Profile (PXP)
- TX Power Service (TPS)
Downloads
Technical documentation
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| Type | Title | Date | ||
|---|---|---|---|---|
| More literature | Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. C) | PDF | HTML | 20 Dec 2021 | |
| User guide | CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. B) | PDF | HTML | 20 Dec 2021 | |
| User guide | CC2564B to CC2564C Migration Guide (Rev. B) | PDF | HTML | 01 Dec 2021 | |
| User guide | CC256xC QFN EM User Guide (Rev. B) | 11 Mar 2020 | ||
| User guide | EM Adapter BoosterPack User's Guide (Rev. A) | 15 Apr 2013 |
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