HDC3020FLXEVM

HDC3020 flexible printed circuit evaluation module

HDC3020FLXEVM

Order now

Overview

The HDC3020FLXEVM is a flexible printed circuit (FPC) based breakout sensor board. It enables users to evaluate the performance of the HDC3020 digital relative humidity (RH) and temperature sensor on a compact and easy-to-use circuit board.

Features
  • Flex printed circuit board (PCB)
  • Gold fingers for quick soldering connection
Humidity sensors
HDC3020 0.5% RH digital humidity sensor, 0.19% long-term drift, 400 nA, 4-sec response time, NIST traceable
Download View video with transcript Video

Order & start development

Evaluation board

HDC3020FLXEVM — HDC3020 flexible printed circuit evaluation module

Log in to order
In stock / Out of stock
Limit:
Not available on TI.com
TI's Standard Terms and Conditions for Evaluation Items apply.

Technical documentation

No results found. Please clear your search and try again.
View all 2
Type Title Date
EVM User's guide HDC3020FLX Evaluation Module User's Guide PDF | HTML 13 Nov 2024
Certificate HDC3020FLXEVM EU Declaration of Conformity 26 Jul 2024

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​

Videos