SENST-3P-SG-CAMERA-MODULES

Sensing Technology camera modules for FPD-LINK

SENST-3P-SG-CAMERA-MODULES

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Overview

SENSING technology camera solutions can be readily integrated with TI processors and provide a complete vision solution for edge AI vision systems, it can provide FPDLink III & FPDLINK IV camera, GMSL camera, MIPI Camera for TDA4x and AM6x solutions.

Features
  • FPD-Link™ interface
  • RAW and YUV image supported
  • 2MP to 8MP resolution
  • Automotive and industrial grade
Arm-based processors
AM62A3 1 TOPS vision SoC with RGB-IR ISP for 1-2 cameras, low-power, video surveillance, retail automation AM62A7 2 TOPS vision SoC with RGB-IR ISP for 1-2 cameras, low-power systems, machine vision, robotics TDA4VM Dual Arm® Cortex®-A72 SoC and C7x DSP with deep-learning, vision and multimedia accelerators
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Photos courtesy of Shenzhen SENSING Technology Co., Ltd

Order & start development

Development kit

SG2-IMX390C-FPDLink-H100F1 — 2MP camera with IMX390 sensor for TDA4VM and AM62A processor starter kit

Development kit

SG3-IMX623C-FPDLink-H100F1 — 2MP camera with IMX623 sensor for TDA4VM and AM62A processor starter kit

Development kit

SG2-OX03CC-FPDLink-H100F1 — 2MP camera with OX0310 sensor for TDA4VM and AM62A processor starter kit

Development kit

SG8-OX08B4C-FPDLink-H100F1 — 8MP camera with OX08B4C sensor for TDA4Vx processor starter kit

TI's Standard Terms and Conditions for Evaluation Items apply.

Related design resources

Hardware development

EVALUATION BOARD
J721EXCPXEVM Common processor board for Jacinto™ 7 processors SK-AM62A-LP AM62A starter kit for low-power Sitara™ processors

Support & training

Videos

Disclaimer

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