SWRC256

CC256x Bluetooth Hardware Evaluation Tool

SWRC256

Downloads

Overview

The CC256x Bluetooth Hardware Evaluation Tool is a Texas Instruments (TI) tool which can be downloaded as a complete package from the TI web site. It is a very intuitive, user-friendly tool to evaluate TI's Bluetooth chips. More specifically, it is used to configure the BT chip's properties through the Service Pack (SP) and also allows to test RF performance.

Features
  • Set device properties such as baud rate, sleep mode, XTAL support, etc.
  • RF performance testing
  • FCC certification testing
  • SIG certification testing

  • CC256X Bluetooth Hardware evaluation tool

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Calculation tool

CC256XBHET CC256x Bluetooth Hardware Evaluation Tool (BHET)

Supported products & hardware

Supported products & hardware

Wi-Fi products
CC2560 Bluetooth® 4.0 with enhanced data rate (EDR) CC2564 Bluetooth® 4.0 with Enhanced Data Rate (EDR), Low Energy (LE) and ANT
Evaluation board
CC2564MODNEM Dual-mode Bluetooth® CC2564 module evaluation board CC256XQFNEM Dual-mode Bluetooth® CC2564 evaluation board

CC256XBHET CC256x Bluetooth Hardware Evaluation Tool (BHET)

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Latest version
Version: null
Release date: null
Wi-Fi products
CC2560 Bluetooth® 4.0 with enhanced data rate (EDR) CC2564 Bluetooth® 4.0 with Enhanced Data Rate (EDR), Low Energy (LE) and ANT
Evaluation board
CC2564MODNEM Dual-mode Bluetooth® CC2564 module evaluation board CC256XQFNEM Dual-mode Bluetooth® CC2564 evaluation board

Technical documentation

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Type Title Date
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 06 Dec 2023
Application note DN035 -- Antenna Quick Guide (Rev. B) 09 Feb 2022
Application note CC256XQFN PCB Guidelines (Rev. B) 28 Oct 2016
Application note AN058 -- Antenna Selection Guide (Rev. B) 06 Oct 2010

Related design resources

Software development

DRIVER OR LIBRARY
CC256XM4BTBLESW TI dual-mode Bluetooth® stack on TM4C MCUs CC256XMSPBTBLESW TI Dual-mode Bluetooth® stack on MSP430™ MCUs

Support & training

TI E2E™ forums with technical support from TI engineers

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