TTC-3P-WIRELESS-MODULE
Overview
HY-27P101PC and HY-27P103WC are Bluetooth low energy(5.3 and later) module for AEC-Q100 qualified automotive applications. Support Bluetooth Channel Sounding(High Accuracy Distance Measurement). Automotive device specification temperature Grade 2: ( –40°C to +105°C).
These devices optimized for low-power wireless communication in applications such as car access including passive entry passive start (PEPS), phone as a key (PaaK) and remote keyless entry (RKE).
HY-234011P is based on CC2340R53E0RKPR chipset integrating all the functions required for low-power Bluetooth applications. It is a highly integrated Bluetooth 5.3 module dedicated to low-power smart devices and IoT applications.
Application area:Building automation, asset tracking, medical, retail EPOS,ESL, Personal electronics ,Digital key system
Development Kit (SDK)
Features
HY-27P101PC and HY-27P103WC features:
- Bluetooth 5.3 & upcoming Bluetooth 6.0 support.
- Support for Bluetooth Channel Sounding technology and VCE post processing accelerator.
- VCE accelerator for efficient, low-energy algorithm execution.
- Includes a complete Bluetooth software stack with SimpleLink™ Low Power F3 SDK.
- Advanced security enablers with ARM Cortex M33 TrustZone-M based trusted execution environment support, isolated HSM environment supporting accelerated cryptographic and random number generation operations, secure boot and firmware updates.
HY-234011P features:
- 2.4 GHz MCU ,Low Energy ,Bluetooth® 5.3 module
- Supports over-the-air upgrade (OTA)
- Application area:Building automation, asset tracking, medical, retail EPOS,ESL, Personal electronics ,Digital key system
- Development Kit (SDK)
- Wireless protocol support
- Bluetooth® 5.3 Low Energy
- Zigbee® 1
- SimpleLink™ TI 15.4-stack 1
- Proprietary systems
Order & start development
HY-27P101 PC — BLE 5.3 & BLE 6.0 automotive module for channel sounding
HY-27P103 WC — BLE 5.3 & BLE 6.0 automotive module supporting channel sounding
Support & training
Video series
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